Prediction method for temperature distribution and warping deformation in selective laser melting process

A temperature distribution and laser melting technology, applied in design optimization/simulation, special data processing applications, instruments, etc., can solve problems such as inability to accurately measure temperature changes, and inability to predict component warpage and deformation

Active Publication Date: 2018-10-30
WUHAN UNIV OF TECH
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AI Technical Summary

Problems solved by technology

However, this process is limited by capital and time costs, and the warping deformation of the entire component cannot be predicted
At the same time, due to the limitation of experimental means, it is impossible to accurately measure the temperature change of the component during the heating process, which is used to study the formation process of the molten pool and the temperature gradient.

Method used

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  • Prediction method for temperature distribution and warping deformation in selective laser melting process
  • Prediction method for temperature distribution and warping deformation in selective laser melting process
  • Prediction method for temperature distribution and warping deformation in selective laser melting process

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Embodiment Construction

[0029] The present invention will be further described below in conjunction with the accompanying drawings.

[0030] Such as figure 1 and figure 2 As shown, the present invention designs a temperature distribution and warpage deformation prediction method in the selective laser melting process, which is used to analyze the phase change of metal materials, molten pool forming process, temperature distribution, thermal stress and warpage deformation in the component manufacturing process To analyze and finally predict the temperature distribution and final warpage deformation distribution during component processing, the method mainly includes the following steps:

[0031] Step1, select the SLM processing process parameters, and compile the process parameters in the fluid analysis software by using a self-defined function. In Step 1, the process parameters specifically include: laser type, laser heat source distribution mode, laser power, scanning speed, laser effective radiu...

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Abstract

The invention discloses a prediction method for temperature distribution and warping deformation in a selective laser melting process. The method is mainly composed of thermal analysis and mechanicalanalysis. Thermal analysis comprises the steps that Step1, processing parameters are determined, and technological planning is performed; Step2, metal material heat relevant properties are acquired, and a model is established according to the dimensions of an SLM component; Step3, temperature boundary conditions are loaded; and Step4, transient analysis is performed to obtain a temperature field of the SLM component. Mechanical analysis comprises the steps that Step5, the model is modified according to material mechanical properties; and Step6, the boundary conditions are added, and the temperature field obtained through analysis in Step4 is used as a load to obtain a stress field and deformation of the component through analysis. According to the method, through thermoset coupling, thermal analysis and mechanical analysis are combined to establish a temperature and deformation prediction system, and technical support is provided for optimizing technological parameters and reducing warping deformation of the SLM component.

Description

technical field [0001] The invention relates to the field of advanced manufacturing technology, more specifically, to a method for predicting temperature distribution and warpage deformation during selective laser melting. Background technique [0002] SLM technology (Selective laser melting) is an additive manufacturing technology that uses metal powder to be completely melted under the heat of a laser beam, cooled and solidified to form a shape. Its working principle is to horizontally control the laser to act on the metal powder on the surface according to a certain trajectory. After one layer of scanning is completed, the substrate is lowered by one layer thickness. The powder spreading system spreads the metal powder evenly on the processed solidified layer, and repeats the above processing. process until the required metal components are obtained. This unique feature allows it to process complex parts without the need for expensive molding tools and complicated proced...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/23G06F2119/06
Inventor 肖汉斌邹晟陈耀林汤文治祝锋肖涵
Owner WUHAN UNIV OF TECH
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