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Photo-curable conductive adhesive and method for making same

A conductive adhesive and photo-curing technology, which is applied in the direction of conductive adhesives, adhesives, adhesive types, etc., can solve the difficult problem of deep-layer curing of photo-curable conductive adhesives, and achieve deep-layer curing, low resistivity, and curing The effect of low temperature

Inactive Publication Date: 2005-11-23
DALIAN POLYTECHNIC UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The initiation system of the above studies all adopts a separate photoinitiation system. Due to the reflection of the metal filler on ultraviolet light, it is difficult to solve the problem of deep curing of photocurable conductive adhesives.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Heat 100g of epoxy resin to 70°C, slowly add dropwise a mixed solution of 0.14g of hydroquinone, 0.58g of N,N-xylidine and 37g of acrylic acid under stirring, and after 1 hour of reaction, the temperature rises to 85°C The reaction was carried out for 1 hour.

[0017] components

[0018] Apply the conductive adhesive evenly on the transparent substrate, press the lead wire or another substrate on the surface of the conductive adhesive, and irradiate the ultraviolet light from the transparent surface for 60 seconds to complete the curing and bonding, and then the UV-curable isotropic conductive adhesive can be obtained . The measured resistivity of the conductive adhesive is 2.0×10 -4 Ω.cm, the shear strength is 8Mpa.

Embodiment 2

[0020] Heat 44.4g of isophorone diisocyanate to 65°C, slowly add 100g of polytetrahydrofuran diol (1000) mixed solution with 0.58g of dibutyltin dilaurate dropwise under stirring, and react for 3 hours, the temperature rises to 75 °C, 28.80 g of hydroxypropyl methacrylate was added dropwise to react for 4 hours.

[0021] components

[0022] Spread the conductive adhesive evenly on the transparent substrate, and complete the curing and bonding in 200 seconds. The resistivity of the conductive adhesive is 1.0×10 -4 Ω.cm, the shear strength is 4.50Mpa.

Embodiment 3

[0024]Take 11.64g epoxy acrylic resin, 5.02g polyurethane acrylic resin according to the ratio in the table, add 11.76g isobornyl acrylate, 5.68g ethylene glycol diacrylate, 2.24g trimethylolpropane triacrylate, 0.02g 2,6-di-tert-butyl-4-methylphenol is mixed, then add 1.02g bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 0.50g tert-butyl peroxide, stir to make It is mixed evenly, and 162.12g of flaky copper powder with a particle size of 0.10-10.00 microns is mixed and ground evenly with the above-mentioned matrix adhesive to obtain the conductive adhesive.

[0025] components

[0026] Spread the conductive adhesive evenly on the transparent substrate, and complete the curing and bonding within 150 seconds. The resistivity of the conductive adhesive is 2.3×10 -4 Ω.cm, the shear strength is 6.50MPa.

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PUM

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Abstract

Disclosed is a photo-curable conductive adhesive and method for preparation, which is prepared from light-sensitive high molecular polymer, reactive dilution monomer, conducting particles, light-summing heat initiating agent and anti-oxidant through mixing and grinding, wherein the light-sensitive high molecular polymer is epoxy acrylic resin or / and polyurethane-acrylate, the reactive dilution monomer is the single, double and multiple functional monomers of acrylic acid, the conducting particle is silver powder, copper powder or silver-plated copper powder, the light initiating agent is alpha-amine alkyl methyl ketone, benzoin (or substituted benzoin) ether or acyl phosphines, the heat initiating agent is azocompound or peralcohol, the antioxidant is hydroquinone, p-hydroxybenzene methyl ether, 2,6-ditertiary-butyl-4-methylphenol.

Description

technical field [0001] The invention relates to a preparation technology of a polymer adhesive, in particular to a preparation technology of a light-cured conductive adhesive film for connection used in the technical fields of electronic packaging such as polyester, thin film circuit, and PCB circuit board. Background technique [0002] Conductive adhesive is a conductive material formed by uniformly dispersing conductive particles in resin. The conductive particles give it conductivity, and the resin makes it suitable for bonding. It is a material that has both conductivity and bonding properties. It can connect a variety of conductive materials together to form a conductive path between the connected materials. Different from other conductive polymers, conductive adhesives require the system to have fluidity under storage conditions, and can be cured by heating or other methods to form a connection with a certain strength. With the continuous advancement of science and t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02
Inventor 刘彦军常英
Owner DALIAN POLYTECHNIC UNIVERSITY
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