Photo-curable conductive adhesive and method for making same

Abstract

Disclosed is a photo-curable conductive adhesive and method for preparation, which is prepared from light-sensitive high molecular polymer, reactive dilution monomer, conducting particles, light-summing heat initiating agent and anti-oxidant through mixing and grinding, wherein the light-sensitive high molecular polymer is epoxy acrylic resin or / and polyurethane-acrylate, the reactive dilution monomer is the single, double and multiple functional monomers of acrylic acid, the conducting particle is silver powder, copper powder or silver-plated copper powder, the light initiating agent is alpha-amine alkyl methyl ketone, benzoin (or substituted benzoin) ether or acyl phosphines, the heat initiating agent is azocompound or peralcohol, the antioxidant is hydroquinone, p-hydroxybenzene methyl ether, 2,6-ditertiary-butyl-4-methylphenol.

Description

technical field

[0001] The invention relates to a preparation technology of a polymer adhesive, in particular to a preparation technology of a light-cured conductive adhesive film for connection used in the technical fields of electronic packaging such as polyester, thin film circuit, and PCB circuit board. Background technique

[0002] Conductive adhesive is a conductive material formed by uniformly dispersing conductive particles in resin. The conductive particles give it conductivity, and the resin makes it suitable for bonding. It is a material that has both conductivity and bonding properties. It can connect a variety of conductive materials together to form a conductive path between the connected materials. Different from other conductive polymers, conductive adhesives require the system to have fluidity under storage conditions, and can be cured by heating or other methods to form a connection with a certain strength. With the continuous advancement of science and t...