The present invention aims to provide a compound having excellent
solvent solubility and excellent
heat resistance,
thermal decomposition stability,
thermal conductivity, and
flame retardancy, and a curable resin composition containing the compound. A multifunctional vinyl resin represented by the following general formula (1A) or an
epoxy resin represented by the following general formula (1B) is provided. In formula (1), R 1 ~R 6 each independently represents a
hydrogen atom or a monovalent
hydrocarbon group having 1 to 6 carbon atoms, X independently represents a structure represented by formula (2), a
benzonitrile structure, a diphenylsulfonyl structure, a
xylylene structure, or - (CH2) m -, m represents a number of 3 to 10, and n represents a number of 1 to 15. (1A) (1B) (2).