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High-performance conductive silver paste and preparation method thereof

A conductive silver glue, high-performance technology, used in conductive adhesives, circuits, adhesives, etc., can solve the problems of scarcity of products required for the use of high-power LEDs, and achieve low curing temperature, high thermal conductivity, and even size dispersion. Effect

Active Publication Date: 2010-08-18
连云港市昭华光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although some companies at home and abroad have produced many different types of conductive adhesive products, there are very few products that can really meet the requirements of high-power LEDs.

Method used

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  • High-performance conductive silver paste and preparation method thereof
  • High-performance conductive silver paste and preparation method thereof
  • High-performance conductive silver paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Example 1. A high-performance conductive silver glue, which is made of the following raw materials in weight percentage:

[0039] Micron-sized metallic silver powder 79.05%;

[0040] Epoxy resin 12%;

[0041] Curing agent 1.4%;

[0042] Solvent 6%;

[0043] Accelerator 0.5%;

[0044] Toughener 0.05%;

[0045]Additive 1%.

[0046] Prepared by conventional methods.

Embodiment 2

[0047] Example 2. A high-performance conductive silver glue, which is made of the following raw materials in weight percentage:

[0048] Micron-sized metallic silver powder 74.2%;

[0049] Epoxy resin 10%;

[0050] Curing agent 3.5%;

[0051] Solvent 9%;

[0052] Accelerator 1.2%;

[0053] Toughener 0.1%;

[0054] Additives 2%.

[0055] Its preparation method steps are as follows:

[0056] (1) Take the toughening agent and epoxy resin in proportion, heat and stir at 140°C for 2 hours to mix evenly, and obtain the prepolymer for later use;

[0057] (2) Take the prepolymer, add curing agent, solvent, accelerator and additives in proportion, fully stir evenly, and obtain the matrix for subsequent use;

[0058] (3) Take micron-sized metal silver powder in proportion and add it to the matrix and stir it thoroughly, then put it into a three-roller machine and mix evenly to obtain the product.

Embodiment 3

[0059] Example 3. A high-performance conductive silver glue, which is made of the following raw materials in weight percentage:

[0060] Micron-sized metallic silver powder 65%;

[0061] Epoxy resin 20%;

[0062] Curing agent 3%;

[0063] Solvent 8.73%;

[0064] Accelerator 1.2%;

[0065] Toughener 0.07%;

[0066] Additives 2%.

[0067] Its preparation method steps are as follows:

[0068] (1) Take the toughening agent and epoxy resin in proportion, heat and stir at 160°C for 5 hours to mix evenly, and obtain the prepolymer for later use;

[0069] (2) Take the prepolymer, add curing agent, solvent, accelerator and additives in proportion, fully stir evenly, and obtain the matrix for subsequent use;

[0070] (3) Take micron-sized metal silver powder in proportion and add it to the matrix and stir it thoroughly, then put it into a three-roller machine and mix evenly to obtain the product.

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Abstract

The invention relates to a high-performance conductive silver paste, which is characterized by comprising the following raw materials in percentage by weight: 65-80% of micron-sized metal silver powder, 10-20% of epoxy resin, 1.4-3.5% of curing agent, 6-9% of solvent, 0.5-1.2% of accelerator, 0.05-0.1% of flexibilizer and 1-2% of additive. The invention also discloses a preparation method of the high-performance conductive silver paste. The conductive silver paste of the invention has high conductivity, very high thermal conductivity, high working temperature, strong viscosity and very high shear strength, and the performance indexes are apparently higher than the working performance of the conductive silver paste in the prior art, thereby solving the technical problems of poor shear performance, low working temperature, poorer thermal conductivity, long curing time, high curing temperature, poor viscosity, easy pollution of environment and the like in the field of the conductive silver paste in the prior art.

Description

technical field [0001] The invention relates to a glue, especially a high-performance conductive silver glue mainly used in high-power LED packaging and heat sinking; the invention also relates to a preparation method of the above-mentioned high-performance conductive silver glue. Background technique [0002] With the continuous update and development of vacuum micro-nano electronics technology, electronic devices are rapidly moving towards the direction of miniaturization. At present, the size of electronic devices has been reduced to the scale of several nm. However, the installation of micro components and the bonding of complex and high-density electronic circuits cannot be directly completed by traditional welding methods. Therefore, the use of conductive adhesives has become an effective method to solve the connection problem in the micro-nano electronics industry chain. , it is replacing traditional lead-tin soldering as the first choice for conductive bonding in the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/04C09J9/02C09J11/04H01L33/62
Inventor 邱昭武宋芳芳刘飞
Owner 连云港市昭华光电科技有限公司
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