21 results about "Micro components" patented technology

The invention discloses a mechanism and method for assembling a main body and a central contact of a coaxial cable connector, and the mechanism comprises a main body riveting mechanism which is used for riveting and fixing the main body at the end part of a wire rod, a main body taking and placing mechanism which is used for grabbing and moving the main body, and an auxiliary guide assembly which is disposed on the main body taking and placing mechanism. The auxiliary guide assembly comprises a butt joint pin head, an extension column and an auxiliary driving part for driving the extension column to stretch out and draw back, the butt joint pin head is connected with the extension column, and when the main body taking claw grabs the main body, the butt joint pin head can be inserted into the coaxial hole of the main body from the non-riveting end of the main body and can firstly extend into the insertion hole of the center contact part for axial guiding; the axial alignment of the main body and the central contact piece is guided; by means of the mode, high-precision and high-reliability automatic coaxial assembly of millimeter-level micro parts can be achieved through the butt joint needle head which is actively guided and synchronously avoided, and the assembly success rate and the production efficiency are remarkably improved.

The utility model relates to the field of polishers, in particular to a closed polisher for medical miniature parts. Comprising a machine body, a polishing module and an adjusting structure, the polishing module is installed on the upper surface of the machine body, a plurality of supporting columns are fixedly connected to the lower surface of the machine body, the adjusting structure is located on the upper surface of the machine body and comprises a side plate, the side plate is fixed to the upper surface of the machine body, the section of the side plate is in a U shape, and supporting plates are fixedly connected to the two sides of the outer wall of the side plate; the upper surface of the supporting plate is rotationally connected with lead screws, and the arc surfaces of the two lead screws are fixedly connected with rolling wheels. According to the closed polishing machine for the medical miniature parts, in the process that the polishing machine is used for polishing the medical miniature parts, the sealing plate can be conveniently adjusted to close and seal a polishing site, so that waste chips generated during polishing can be prevented from splashing, the waste chips are prevented from hurting operators, and the production efficiency is improved. And the influence on the surrounding environment is prevented.

The invention provides a capacitor coil processing method based on electrochemical metal additive manufacturing. The capacitor coil processing method comprises the following steps: providing a silicon wafer substrate; uniformly coating glue on the surface of the substrate; sputtering a metal layer on the surface after spin coating, and dividing the substrate into a plurality of small blocks; putting a small substrate into a printing pool, adding electrolyte, and injecting printing ink into the probe; the scanning component is controlled to grab the printing probe, and laser focusing calibration and signal feedback detection are carried out; 3D design modeling is carried out according to the target capacitance coil structure; the surface appearance of the substrate is obtained, printing structure parameters and position parameters are input, and coil structure printing is conducted through laser feedback based on the modeling file; and performing post-treatment on the printing sample to obtain a target capacitance coil sample piece. The capacitor coil manufactured based on the electrochemical metal additive technology is stable in structure and high in precision, array preparation can be achieved, and the high-precision, integrated and batched development requirements of current micro elements can be met.

The utility model relates to the technical field of chip mounters, in particular to a super-miniature component visual calibration chip mounting mechanism, which comprises an operation table, a clamping claw and a driving assembly, a mounting seat is arranged above the operation table, a camera is arranged on one side of the mounting seat, the clamping claw is arranged at the bottom of the mounting seat and is rotatably connected with the mounting seat, and the driving assembly is arranged on the mounting seat. A driving assembly is arranged on the inner side of the mounting base, a light path pipe is arranged at the bottom of the camera, a first mirror and a second mirror are arranged on the inner side of the light path pipe, and the first mirror and the second mirror are inclined by 45 degrees; according to the utility model, the driving assembly is arranged to drive the clamping claw to rotate to clamp materials, so that the chip mounter can take the materials with uneven upper surfaces, and meanwhile, the first mirror and the second mirror are utilized to refract light rays, so that the light rays entering the mounting seat enter the camera after being refracted twice in the light path tube, and the light rays enter the camera after being refracted twice. And therefore, the camera can obtain the visual field under the clamping claw, and the clamping precision is improved.

The present application relates to the technical field of semiconductor wafer processing protection materials, and specifically relates to a high-buffer-gradient protective substrate for wafer grinding and a preparation method thereof, which is composed of a corona layer, an intermediate buffer layer and a back support layer in sequence; the substrate has a double-gradient structure of gradient hardness and gradient elastic modulus, the hardness of the three layers is 43A-47A, 53A-56A and 67A-70A in sequence, and the elastic modulus of the three layers is 18-28 MPa, 35-45 MPa and 70-90 MPa in sequence; the present application realizes overall optimization from micro components, interface structure to macro performance through the synergistic cooperation of three-layer gradient structure design, full polyolefin non-extraction material system and three-layer co-extrusion flow forming process, and systematically solves the technical problems that the existing wafer grinding protective substrate cannot adapt to high-fall wafer, is insufficient in adhesion and buffering, and has a high pollution and damage rate.

The invention provides an airflow heat dissipation device of a micro piezoelectric pump, and relates to the technical field of micro electro mechanical systems. An inlet runner arranged on the lower end face of a flow guide part and an outlet runner arranged on the upper end face of the flow guide part are both communicated with a flow guide channel arranged on the flow guide part, and the cross sectional area of the outlet runner is gradually reduced in the direction from the first end to the second end of the outlet runner. The PZT piezoelectric layer is arranged on the upper end face of the flow guide part and provided with a pump film corresponding to the flow guide channel, and the first electrode can drive the pump film to move up and down. The airflow heat dissipation device of the micro piezoelectric pump is suitable for heat dissipation operation of micro components and large-scale integrated circuit systems, and ensures that the temperature of the components and the operating environment of the systems is stable.

The application relates to a preparation method for reducing the surface friction of single crystal diamond and application, and the preparation method comprises the following steps: step one, determining a predetermined working environment of a single crystal diamond base material; step two, determining a surface energy regulation direction according to the predetermined working environment; when the predetermined working environment is a gas phase environment, the regulation direction is to reduce the surface energy, or when the predetermined working environment is a liquid phase environment, the regulation direction is to increase the surface energy; step three, according to the regulation direction determined in step two, selecting a corresponding surface energy regulation method to modify the friction working surface of the single crystal diamond. The preparation method is combined with the design of the surface energy directional regulation of the single crystal diamond crystal face intrinsic friction characteristic ordering rule, can effectively inhibit the friction failure of micro components, and prolongs the service life of a device.

The invention belongs to the technical field, and particularly relates to a thermoset part based on an ultrasonic heat effect and a manufacturing method thereof. Comprising the following steps: transferring a thermosetting material prepolymer mixed solution into a forming chamber, and then putting the forming chamber and an ultrasonic probe into a container filled with an ultrasonic coupling medium; and an ultrasonic probe is adopted to emit ultrasonic waves to the thermosetting material prepolymer mixed liquid, the thermosetting material prepolymer mixed liquid is subjected to cross-linking curing according to the movement track through the ultrasonic heat effect, and finally the thermosetting part of the target structure is obtained. The ultrasonic heat effect is utilized to induce rapid cross-linking curing of the thermosetting material prepolymer, no modifier or photoinitiator is added to the miniature part, the manufacturing process is simple, the manufacturing efficiency is high, and precise forming manufacturing of the thermosetting material miniature part can be achieved.

The invention relates to a method and a device for producing micro parts and micro components by means of additive manufacturing using micro laser sintering. A pulverulent agglomerating material (1) is applied in layers from a first powder reservoir (2), and the material is melted using laser light (4) after being applied. The invention is characterized in that the material (1) located in the first powder reservoir (2), which is open in the direction of a processing plane, is an agglomerating powder, the particle size (1) of which equals maximally 20 μm, and a force (F1) is applied to the agglomerating material (1) in the direction of a substrate (3) in a process region (100) at least during the application process, the agglomerating material (1) behaving as a fluid while being applied as a result of said force. For this purpose, the device has a horizontally aligned base (5) which is interrupted at least in some regions in a process region (100) above a substrate (3) and has a first powder reservoir (2) which is arranged above the base (5) in a horizontally movable manner over the base (5) and which comprises an interior for receiving a pulverulent agglomerating material (1), the particle size (1) of which equals maximally 20 μm, wherein the first powder reservoir (2) has a first means (6) in the interior thereof for applying a first axial force (F1), which acts in the direction of the base (5) and the substrate (3), to the pulverulent agglomerating material (1) located in the interior, the agglomerating material (1) behaving as a fluid in the process region (100) at least while being applied as a result of said force.

This invention discloses a device and method for detecting critical dimensions of micro-parts. The device includes a mounting support, laser scanning, motion control, attitude adjustment and positioning, and communication transmission modules. The mounting support module includes an optical platform mounting plate and a height-adjustable gantry frame, providing a reference for detection. The laser scanning module adjusts the incident angle of the laser profile sensor via a rotating platform. In the motion control module, a horizontal slide and a grating ruler are arranged parallel to each other, and the slider is rigidly connected to the reading head to provide displacement feedback. The attitude adjustment and positioning module compensates for clamping deviations via an attitude adjustment platform, and a miniature flat-jaw vise clamps the part. The communication transmission module establishes a hard-trigger link to achieve synchronous triggering of displacement and profile acquisition. This device has strong adaptability and high detection accuracy, enabling automated real-time detection of critical dimensions of micro-parts and meeting the needs of industrial on-line assembly inspection.

This invention relates to the technical field of micro-part assembly equipment, specifically to a laser welding device and a laser welding method for micro-parts. The laser welding device includes a laser welding gun, a welding table, and a welding vision device. The welding table is equipped with a positioning mechanism for positioning parts. The laser welding gun is positioned above the welding table so that its laser beam irradiates the parts on the placement table. The welding vision device works in conjunction with the laser welding gun to observe the welding process. The device, with its laser welding gun, welding table, and welding vision device working in tandem, achieves precise positioning of micro-parts with a diameter of less than 5mm to prevent displacement. The laser welding gun beam is focused and precisely matched to the micro-weld joint. The welding vision device observes the welding process in real time and guides the welding execution. This overall solution addresses the problems of insufficient positioning accuracy, high operational difficulty, and high defect rate in traditional welding methods, ensuring stable welding quality.

The present application relates to the technical field of micro part assembling equipment, and in particular to a multi-micro part assembling device and method. The multi-micro part assembling device comprises a feeding disc, a feeding manipulator, a pressing mechanism and a welding mechanism. The feeding manipulator picks up micro parts from the feeding disc and transfers them to the pressing mechanism for pressing, and finally transfers the pressed part group to the welding mechanism for welding, thereby realizing automatic assembly of the micro parts.

The invention relates to a method for preparing a ceramic part by micromachining comprising in particular the preparation of a suspension comprising in particular a ceramic powder, a binder and a plasticizer, and a thermocompression step before machining the raw ceramic part.

The invention relates to the field of machine tool accessories, particularly discloses a small-diameter liquid expansion clamp and a manufacturing method and an expansion amount control method thereof, and aims to enhance the strength of a thin-wall structure and ensure the expansion uniformity of the thin-wall structure. The diameter of the expansion part of the small-diameter liquid expansion clamp is smaller than or equal to 4 mm, and the requirement for high-precision positioning and clamping of miniature parts can be met; the expansion part is of a cylindrical structure, the side cavity wall of the expansion cavity is of a continuous and closed wave annular structure composed of the thickening parts and the thinning parts which are distributed alternately, the rigidity and the anti-fatigue performance of the expansion part are improved by using the thickening parts as reinforcing inner ridges, and the anti-fatigue performance of the expansion part is improved by using the thinning parts as elastic connecting areas; the expansion part can generate uniform radial expansion under the hydraulic action, so that the clamping force is enough, the problem of local stress concentration can be avoided, and high-precision positioning clamping can be realized. In addition, the closed end of the expansion part is arranged to be the solid lengthening part, so that the axial lengthening effect of the whole expansion part under the action of internal hydraulic pressure can be reduced.

The present invention relates to a method and a device for producing microparts and microcomponents by additive manufacturing using micro laser sintering, in which a powdered cohesive material (1) is applied in layers from a first powder reservoir (2), which is melted after application using a laser beam (4). The method is characterized in that the material (1) arranged in the first powder reservoir (2) opening towards the processing surface is a cohesive powder, the particle size (1) of the cohesive powder corresponds to at most 20 μm, and a force (F1) is applied to the cohesive material (1) in the processing area (100) towards the substrate (3) at least during the application process, and the cohesive material (1) behaves as a fluid as a result of said force while being applied. To this end, the device comprises a horizontally aligned base (5) having interruptions in at least some regions in a processing region (100) above a substrate (3), and a first powder reservoir (2) movably arranged horizontally above the base (5) and having an interior for receiving a powdered cohesive material (1) having a particle size of at most 20 μm or equivalent above the base (5). The first powder reservoir (2) comprises first means (6) therein for applying a first axial force (F1) acting in the direction of the base (5) and the substrate (3) to the powdered cohesive material (1) arranged therein, the first axial force (F1) acting on the powdered cohesive material (1) therein, the cohesive material (1) behaving as a fluid in the processing region (100) at least during the application of said force.

The utility model discloses a mechanism for arranging workpieces on a rail of high-speed feeding equipment by utilizing magnets. The mechanism comprises a linear rail, a first air nozzle, a first magnet, a second magnet, a third magnet, a fourth magnet, a second air nozzle, a transverse material blowing block, a grading blowing block, a first circular groove, a second circular groove, a height limiting plate, a connecting block, a magnet adjusting plate and a sensor assembly. Round grooves are sequentially formed in the linear track, through the synergistic effect of the multi-stage magnet set and the air nozzle, magnetic surfaces of workpieces are attracted through a magnetic field, the posture of the workpieces is adjusted in cooperation with air blowing, and directional arrangement of the workpieces is achieved. The height limiting plate restrains the height of a workpiece, the magnet adjusting plate optimizes magnetic field distribution, and the sensor assembly detects the arrangement state in real time. By simplifying the structure and accurately controlling the magnetic field, the problems that a traditional multi-stage sorting mechanism is complex and low in efficiency are solved, the arrangement precision and the feeding efficiency of micro workpieces are remarkably improved, the manufacturing cost is reduced, and the multi-stage sorting mechanism is suitable for large-scale high-speed feeding of micro components in the consumer electronics industry.

The utility model provides automatic charging equipment for micro components. The automatic charging equipment comprises a charging table; the conveying mechanism is arranged on the loading platform and is used for conveying a jig capable of bearing the micro component; the conveying mechanism is provided with an input end and an output end, and the input end and the output end are close to the two sides of the charging table. The auxiliary pulling mechanism is arranged on the charging table, corresponds to the input end and is used for pulling the jig in the lifting basket to move into the input end; the auxiliary pushing mechanism is arranged on the loading platform, corresponds to the output end and is used for pushing the jig on the output end to move into the lifting basket; the technical problems that a pulling jig in a lifting basket cannot be moved to a conveying mechanism and the jig which is fully loaded on the conveying mechanism cannot be automatically placed into the lifting basket in an existing micro element charging device are solved, and the automation level of the charging device is improved. Unmanned operation can be achieved in the process from loading of the micro components to final storage of the jigs, the labor cost is greatly reduced, and meanwhile the overall working efficiency of a production line is improved.

The application belongs to the field of processing of conduit pumps, and particularly relates to a micro part chamfer polishing tool. The micro part chamfer polishing tool comprises a clamping assembly for clamping a micro part, a posture adjusting unit for driving the clamping assembly to move and / or rotate, a micro part to-be-processed region exposed outside a clamping assembly body, and a chamfer polishing unit arranged above the micro part to-be-processed region. The posture adjusting unit and the chamfer polishing unit cooperate with each other to chamfer and polish the micro part. The application can chamfer and polish the micro part in the conduit pump at high precision, multiple angles and high efficiency, and improve production efficiency.

The present application relates to the technical field of micro part assembly equipment, and in particular to a pressing mechanism, a pressing device with visual guidance and a micro part pressing method. The pressing mechanism comprises a feeding manipulator, a pressing head, a pressing table and a positioning mechanism. The positioning mechanism comprises a positioning seat and a clamping member. The positioning seat is provided with a positioning groove adapted to the micro part. An outer side wall of the positioning seat is provided with a clamping hole communicating with the positioning groove. The clamping member is retractable and extends into the positioning groove to clamp the part. The pressing head is vertically arranged above the positioning groove. The feeding manipulator can transfer the part to the positioning groove. The mechanism preliminarily limits the part through the positioning groove, stably fixes the part through the clamping member, and vertically presses the part through the pressing head. The mechanism solves the problems of inaccurate positioning and unstable pressing force in manual assembly, realizes stable pressing of the micro part, guarantees assembly precision and consistency, and avoids damage to the part.

The application discloses a metal foil electromagnetic flexible micro-forming device and method based on magnetic force. A cylinder drives a clamp to press a concave die, the concave die and an electric heating plate press a non-magnetic metal foil, the electric heating plate heats the non-magnetic metal foil, an electric telescopic rod drives an upper electromagnet to move down to a set position, the upper electromagnet is electrified to generate magnetic attraction force on the iron powder below the upper electromagnet, the iron powder moves upward to impact the non-magnetic metal foil, the non-magnetic metal foil is drawn upward to a forming groove, the upper electromagnet is de-energized, a lower electromagnet is electrified, the iron powder falls back into an iron powder container, and the lower electromagnet is de-energized. The non-magnetic metal foil is repeatedly micro-formed in the forming groove. The concave die is arranged above and the iron powder is arranged below, which is beneficial to demolding. The magnetic force of the iron powder on the electromagnet is used to make the metal foil adhere to the surface of the concave die, so that the metal foil is formed into a micro part according to the shape of the forming groove, and the forming process is not affected by the shape of the micro part.

The invention discloses a fault detection method for tiny parts of a contact network under a complex background, and belongs to the technical field of computer vision and railway operation and maintenance. The core of the method is that a multi-dimensional joint data enhancement strategy is adopted to expand images of the tiny parts of the overhead line system; the invention further provides an improved YOLO11-PCW target detection model. Firstly, a P2 tiny target detection layer is newly added at the front end of a feature pyramid network; secondly, integrating a CA attention mechanism; and finally, replacing the bounding box regression loss function with the Wise-IoU v3. According to the method, FP16 quantification and reasoning optimization are carried out on the model by utilizing a TensorRT technology. Experimental results show that the improved model keeps lightweight parameters, meanwhile, the 0.5 threshold average precision mean value (mAP at 0.5) is remarkably improved, the reasoning speed on edge equipment after optimization is remarkably improved, high precision of tiny faults such as overhead line system bolts and cotter pins is achieved, and the method is suitable for railway inspection scenes.