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Transferring head used for transferring micro-components and micro-component transferring method

A technology of micro-components and components, which is applied in the field of transfer of transposition heads and micro-components, and can solve problems such as thermal budget constraints and performance degradation of micro-components

Active Publication Date: 2016-12-14
HUBEI SANAN OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in the fabrication process using transfer head arrays, the thermal budget of microcomponents for phase change is limited, usually less than 350 °C, or more specifically, less than 200 °C; otherwise, the performance of microcomponents will be degraded

Method used

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  • Transferring head used for transferring micro-components and micro-component transferring method
  • Transferring head used for transferring micro-components and micro-component transferring method
  • Transferring head used for transferring micro-components and micro-component transferring method

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Experimental program
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specific Embodiment

[0039] figure 1 Showing a first preferred embodiment of the present invention, a transpose head 300 for transferring micro components includes: a cavity 330 , an array of switching elements, an array of vacuum paths 350 and an array of suction nozzles 360 . Wherein, the switch assembly array is disposed on the upper side of the cavity 330 , the vacuum path array 350 is disposed on the lower side of the cavity 330 , and there is a space between them to form the cavity. The vacuum path array communicates with the cavity 330, and controls the opening / closing of each vacuum path 350 through the valve, and controls the valve of each vacuum path through the switch assembly to control the opening or closing of the vacuum path to extract the required micro element.

[0040] Please see figure 2 The switch assembly array is composed of a CMOS storage circuit layer 310 and an address electrode layer 320 located below it. An address electrode array is arranged on the address electrode...

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Abstract

The invention discloses a transferring head used for transferring micro-components and a micro-component transferring method. The transferring head comprises a cavity, several vacuum paths, several suction nozzles and a switch assembly. The vacuum paths are communicated with the cavity, and each communicating part is provided with a valve which can be opened and closed; the suction nozzles are respectively communicated with the vacuum paths, the suction nozzles adsorb or release micro-components by means of vacuum pressure, and the vacuum pressure is transmitted by means of the vacuum paths; and the switch assembly is used for controlling the valve of each vacuum path to be opened or closed, thereby controlling the suction nozzles to adsorb or release needed micro-components by means of vacuum pressure.

Description

technical field [0001] The present invention relates to a micro-element used for display, and more particularly, to a transposition head for transferring a micro-element and a transfer method of the micro-element. Background technique [0002] Micro-component technology refers to an array of micro-sized components integrated at high density on a substrate. At present, micro-pitch light-emitting diode (Micro LED) technology has gradually become a research hotspot, and the industry expects high-quality micro-component products to enter the market. High-quality fine-pitch light-emitting diode products will have a profound impact on traditional display products such as LCD / OLED that are already on the market. [0003] In the process of fabricating microcomponents, the microcomponents are first formed on a donor substrate and then transferred to a receiving substrate. The receiving substrate is, for example, a display screen. One difficulty in the fabrication of microcomponent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/6833H01L21/6838H01L33/0095B25J15/0625H01L21/6835H01L33/00
Inventor 徐宸科邵小娟郑建森时军朋林科闯
Owner HUBEI SANAN OPTOELECTRONICS CO LTD
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