Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Micro-component transfer device, transfer method, manufacturing method, device, and electronic device

A transfer device and transfer method technology, applied in semiconductor/solid-state device manufacturing, measuring devices, electrical components, etc.

Active Publication Date: 2017-08-11
XIAMEN SANAN OPTOELECTRONICS TECH CO LTD
View PDF3 Cites 60 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One of the difficulties in the fabrication of microcomponents is how to transfer the microcomponents from the donor substrate to the receiving substrate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Micro-component transfer device, transfer method, manufacturing method, device, and electronic device
  • Micro-component transfer device, transfer method, manufacturing method, device, and electronic device
  • Micro-component transfer device, transfer method, manufacturing method, device, and electronic device

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment

[0086] figure 1 A cross-sectional side view of a transfer device according to a first preferred embodiment of the present invention is shown. The transfer device 1100 includes: a base substrate 1110 , an array of pick-up heads 1120 , a testing circuit and a CMOS integrated circuit 1140 . Specifically, the base substrate 1110 is used to provide a supporting function, and may be formed of various materials, such as silicon, ceramics, and polymers. The pick-up heads 1120 are arranged in an array on the first surface 1110A of the base substrate 1110, with a size ranging from 1 μm to 100 μm, for example, 50 μm to 20 μm, and a pitch of (1 μm to 100 μm)×(1 μm to 100 μm), for example 10μm x 10μm or 50μm x 100μm pitch. The array of pick-up heads 1120 is disposed on the first surface 1110A of the base substrate 1100 for picking up micro-components by various adsorption forces (such as electrostatic force, vacuum pressure, van der Waals force, magnetic force, etc.) to achieve the funct...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Radiusaaaaaaaaaa
Login to View More

Abstract

The invention discloses a micro-component transfer device, a transfer method, a manufacturing method, a device and an electronic device. According to the invention, when micro-components are being transferred, testing can be done to the micro-components so as to remove the micro-components with defects. The micro-component transfer device with a testing circuit comprises a base substrate with two opposite surfaces; a pick-up head array formed on the first surface of the base substrate and used to pick up or release the micro-components; and a testing circuit arranged inside of the base substrate or the surface of the base substrate and consisting of a series of sub-testing circuits with each sub-testing circuit containing at least two testing electrodes and used to test the optical-electro parameters of the micro-components when the micro-components are being transferred by the transfer device.

Description

technical field [0001] The present invention relates to a micro-element for display, and more particularly, to a transfer device, a transfer method, a manufacturing method, a device and an electronic device for a micro-element. Background technique [0002] Micro-component technology refers to an array of micro-sized components integrated at high density on a substrate. At present, micro-pitch light-emitting diode (Micro LED) technology has gradually become a research hotspot, and the industry expects high-quality micro-component products to enter the market. High-quality fine-pitch light-emitting diode products will have a profound impact on traditional display products such as LCD / OLED that are already on the market. [0003] In the process of fabricating microcomponents, the microcomponents are first formed on a donor substrate and then transferred to a receiving substrate. The receiving substrate is, for example, a display screen. One difficulty in the fabrication of ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/66H01L21/67H01L21/683
CPCH01L21/67271H01L21/683H01L22/14H01L21/6838H01L21/6831G01R31/2887H01L33/0095H01L33/62H01L25/0753H01L2224/95H01L21/67288H01L22/34H01L24/00
Inventor 徐宸科邵小娟郑建森其他发明人请求不公开姓名
Owner XIAMEN SANAN OPTOELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com