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Environment-friendly heat conduction insulating glue used by high-power LEDs and preparation method

A heat-conducting, insulating, high-power technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of reduced mechanical properties, reduced work efficiency, poor scattering performance, etc., to increase service life and improve work efficiency , the effect of low curing temperature

Active Publication Date: 2010-08-25
连云港市昭华光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the working life of electronic components with a general working temperature of 150 ° C is 10 years, then if they work at 300 ° C for a long time, their life will drop sharply to 15 days
Moreover, if the traditional technology using insulating dielectric materials is used to prepare the separator, there will be disadvantages such as poor thermal conductivity and reduced mechanical properties, and due to poor scattering performance, the operating power of the device can only reach 40% of the rated operating power. %, which greatly reduces work efficiency and also causes a great degree of waste of energy

Method used

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  • Environment-friendly heat conduction insulating glue used by high-power LEDs and preparation method
  • Environment-friendly heat conduction insulating glue used by high-power LEDs and preparation method
  • Environment-friendly heat conduction insulating glue used by high-power LEDs and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Example 1. A heat-conducting and insulating glue used in an environment-friendly high-power LED, which is made of the following raw materials in weight percentage:

[0033] Micron-sized high thermal conductivity powder 57.4%;

[0034] Epoxy resin 30%;

[0035] Curing agent 4%;

[0036] Solvent 7%;

[0037] Accelerator 0.6%;

[0038] Additive 1%;

[0039] The micron-level high thermal conductivity powder is selected from one of micron-level silver powder, palladium powder, platinum powder, gold powder, C powder, AlN powder and SiC powder.

[0040] Its preparation method adopts the preparation method of conventional heat-conducting and insulating glue.

Embodiment 2

[0041] Example 2. A heat-conducting and insulating glue used in an environment-friendly high-power LED, which is made of the following raw materials in weight percentage:

[0042] Micron-sized high thermal conductivity powder 53.5%;

[0043] Epoxy resin 18%;

[0044] Curing agent 10%;

[0045] Solvent 15%;

[0046] Accelerator 1.5%;

[0047] Additives 2%;

[0048] The micron-scale high thermal conductivity powder is selected from: any two of micron-scale silver powder, palladium powder, platinum powder, gold powder, C powder, AlN powder, and SiC powder or a mixture of three in any proportion.

[0049] Its preparation method is: under the constant temperature condition of temperature 26 ℃, the humidity is 52% under the condition of constant humidity to carry out the following operations: first weigh epoxy resin, solvent, curing agent, accelerator and Additives, after mixing, stir evenly to obtain a matrix for later use; then weigh the micron-sized high thermal conductivity ...

Embodiment 3

[0050] Example 3. A heat-conducting and insulating glue used in an environment-friendly high-power LED, which is made of the following raw materials in weight percentage:

[0051] Micron-sized high thermal conductivity powder 50%;

[0052] Epoxy resin 30%;

[0053] Curing agent 8%;

[0054] Solvent 9.8%;

[0055] Accelerator 1%;

[0056] Additives 1.2%;

[0057] The micron-scale high thermal conductivity powder is selected from any four of micron-scale silver powder, palladium powder, platinum powder, gold powder, C powder, AlN powder and SiC powder or a mixture of five in any proportion.

[0058] The preparation method is as follows: under the constant temperature condition of 28°C and the constant humidity condition of 60% humidity, the following operations are carried out: firstly weigh the epoxy resin, solvent, curing agent, accelerator and Additives, after mixing, stir evenly to obtain a matrix for later use; then weigh the micron-sized high thermal conductivity pow...

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Abstract

The invention relates to an environment-friendly heat conduction insulating glue used by high-power LEDs, which is characterized by being prepared from the following raw materials in percentage by weight: 50-68 percent of micro-grade high-thermal conductive powder, 18-30 percent of epoxy resin, 4-10 percent of curing agent, 7-15 percent of solvent, 0.6-1.5 percent of accelerator and 1-2 percent of additive; and the micro-grade high-thermal conductive powder is selected from a mixture formed by one or more of micro-grade aluminum powder, palladium powder, platinum powder, gold powder, C powder, AlN powder and SiC powder. The invention also relates to a preparation method of the heat conduction insulating glue. The environment-friendly heat conduction insulating glue used by high-power LEDsis obtained by optimizing the matching ratio and the modification of the raw materials and improving and simplifying the preparation process. Besides high resistivity, the heat conduction insulating glue also has high thermal conductivity, higher working temperature, strong viscosity, high cutting strength and fine performance index.

Description

technical field [0001] The invention relates to a heat-conducting and insulating glue, in particular to a heat-conducting and insulating glue used in an environment-friendly high-power LED; the invention also relates to a preparation method of the heat-conducting and insulating glue. Background technique [0002] The 21st century is a century of vigorous development of the information industry, and electronic devices and electronic equipment are constantly moving towards the goal of miniaturization. However, due to the needs of large-scale integrated circuits and the miniaturization of electronic devices, the number of electronic devices per unit chip area and the density of electronic circuits are getting higher and higher, and the resulting increase in chip temperature has greatly affected its performance and life. Impact. Therefore, the problems of heat conduction and heat dissipation have become the bottlenecks that restrict the development of the electronics industry, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/04C09J9/00C09J11/04H01L33/56H01L33/64
Inventor 邱昭武宋芳芳刘飞
Owner 连云港市昭华光电科技有限公司
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