A preparation method for connecting tungsten copper alloy and whole electrical contact of the copper end

A technology of tungsten-copper alloy and copper alloy, which is applied in the field of preparation of integral electrical contacts connecting tungsten-copper alloy and copper or copper alloy copper tail, can solve the problems of low connection strength, high resistivity, poor conductivity, etc., and achieve mechanical physics Performance and electrical performance assurance, the effect of improving conductivity

Inactive Publication Date: 2007-08-01
XIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a preparation method for connecting tungsten-copper alloy and copper tail integral electric contact, adopting layer gradient burning method to realize the connection of i...

Method used

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  • A preparation method for connecting tungsten copper alloy and whole electrical contact of the copper end

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Integral electrical contacts of tungsten-copper alloy W70Cu30 and copper with a diameter of 20 mm and a weight percentage of 70 and 30 were prepared.

[0020] Step 1, prepare the transition layer material with copper powder with a particle size of 200-250 mesh, tungsten powder with a particle size of 6-8 μm and additional ingredients in the following parts by weight:

[0021] Copper powder (41.2%) 2.678 grams

[0022] Tungsten powder (58.8%) 3.822 grams

[0023] Nickel powder (0.1%) 0.0065 grams

[0024] Ethanol (1%) 0.065 ml

[0025] The above powders were mechanically mixed together for 6 hours as a transition layer material;

[0026] Step 2, put the transition layer material prepared above into the bottom of the mold with a diameter of 20mm, lay it with a thickness of 2mm, and punch it with a die at a rate of 3 kg / cm 2 After the pre-pressure is compacted, take out the die punch;

[0027] Step 3, lay the tungsten-copper alloy mixed powder W70Cu30 to be connected ...

Embodiment 2

[0030] Integral electrical contacts of tungsten-copper alloy W85Cu15 and copper with a diameter of 20 mm and a weight percentage of 85 and 15 were prepared.

[0031] Step 1, laying two layers of transition layer materials, the transition layer material is prepared by the following parts by weight:

[0032] The first layer: copper powder (41.2%) 1.339 grams

[0033] Tungsten powder (58.8%) 1.911 grams

[0034] Nickel powder (0.1%) 0.0033 grams

[0035] Ethanol (1%) 0.033 ml

[0036] The second layer: copper powder (23.6%) 0.86 grams

[0037] Tungsten powder (76.4%) 2.782 grams

[0038] Nickel powder (0.1%) 0.0036 grams

[0039] Ethanol (1%) 0.036 ml

[0040] The above two layers of transition layer materials were mechanically mixed for 10 hours respectively as transition layer materials;

[0041] Step 2, put the transition layer material prepared above into the bottom of the mold with a diameter of 20 mm, first lay the first layer, and then lay the second layer, the thic...

Embodiment 3

[0045] A tungsten-copper alloy with a diameter of 20 mm and a weight percentage of 80 and 20 is prepared as an integral electrical contact of W80Cu20 and copper.

[0046] Step 1, prepare the transition layer material with copper powder with a particle size of 200-250 mesh, tungsten powder with a particle size of 6-8 μm and additional ingredients in the following parts by weight:

[0047] Copper powder (30%) 1.95g

[0048] Tungsten powder (70%) 4.55 grams

[0049] Nickel powder (0.1%) 0.0065 grams

[0050] Ethanol (1%) 0.065ml

[0051] The above powders were mechanically mixed together for 20 hours as a transition layer material;

[0052] Step 2, put the transition layer material prepared above into the bottom of the mold with a diameter of 20mm, lay it with a thickness of 3mm, and punch it with a die at a rate of 4 kg / cm 2 After the pre-pressure is compacted, take out the die punch;

[0053]Step 3, lay the tungsten-copper alloy mixed powder W80Cu20 that needs to be connec...

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Abstract

The invention discloses a preparation method of joining elconite and copper trail integral electrical contacts; it adopts method of adding copper-tungsten alloy buffer layer between copper-tungsten alloy and copper or copper alloy copper trail to realize the integral connection, firstly getting 23.6-41.2% copper powder and 58.8-76.4% tungsten powder as percentage by weight, and nickel powder which is about 0.05-0.15% of the total weight and 0.5-1.5%ml alcohol; The buffer layer material is placed at the bottom of the die, and the copper-tungsten alloy mixture is placed to pressed forming; at last the transition material bedding surface of the moulded blank and the copper or copper alloy surface which is to be connected are placed contactly, it then adglutinated as a whole. The preparation method of the invention not only improve the conjunction strength of copper-tungsten alloy and copper, copper-tungsten alloy and copper alloy integral electrical contacts, at the same time, the conductivity of integral electrical contacts is also improved.

Description

technical field [0001] The invention belongs to the technical field of electric contact materials, and relates to a preparation method of an integral electric contact, in particular to a preparation method of an integral electric contact connecting a tungsten-copper alloy and a copper or copper alloy copper tail. Background technique [0002] Tungsten-copper alloy is widely used as electrode material, electronic packaging and electrical contact material because of its good electrical conductivity, thermal conductivity and arc corrosion resistance. When it is used, it is often required to be integrated with copper or copper alloy with better electrical conductivity. to apply. At present, the connection methods of tungsten-copper alloy and copper, tungsten-copper alloy and copper alloy include welding, riveting, screw connection, integral sintering and so on. The main problem in the preparation of integral electrical contacts by these methods is that the prepared electrical c...

Claims

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Application Information

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IPC IPC(8): H01H11/04H01H1/021H01H1/04
Inventor 陈文革陈勉之
Owner XIAN UNIV OF TECH
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