A preparation method for connecting tungsten copper alloy and whole electrical contact of the copper end

A technology of tungsten-copper alloy and copper alloy, which is applied in the field of preparation of integral electrical contacts connecting tungsten-copper alloy and copper or copper alloy copper tail, can solve the problems of low connection strength, high resistivity, poor conductivity, etc., and achieve mechanical physics Performance and electrical performance assurance, the effect of improving conductivity
CN101009165AInactive Publication Date: 2007-08-01XIAN UNIV OF TECH
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
XIAN UNIV OF TECH
Publication Date
2007-08-01
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a preparation method of joining elconite and copper trail integral electrical contacts; it adopts method of adding copper-tungsten alloy buffer layer between copper-tungsten alloy and copper or copper alloy copper trail to realize the integral connection, firstly getting 23.6-41.2% copper powder and 58.8-76.4% tungsten powder as percentage by weight, and nickel powder which is about 0.05-0.15% of the total weight and 0.5-1.5%ml alcohol; The buffer layer material is placed at the bottom of the die, and the copper-tungsten alloy mixture is placed to pressed forming; at last the transition material bedding surface of the moulded blank and the copper or copper alloy surface which is to be connected are placed contactly, it then adglutinated as a whole. The preparation method of the invention not only improve the conjunction strength of copper-tungsten alloy and copper, copper-tungsten alloy and copper alloy integral electrical contacts, at the same time, the conductivity of integral electrical contacts is also improved.
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Description

technical field

[0001] The invention belongs to the technical field of electric contact materials, and relates to a preparation method of an integral electric contact, in particular to a preparation method of an integral electric contact connecting a tungsten-copper alloy and a copper or copper alloy copper tail. Background technique

[0002] Tungsten-copper alloy is widely used as electrode material, electronic packaging and electrical contact material because of its good electrical conductivity, thermal conductivity and arc corrosion resistance. When it is used, it is often required to be integrated with copper or copper alloy with better electrical conductivity. to apply. At present, the connection methods of tungsten-copper alloy and copper, tungsten-copper alloy and copper alloy include welding, riveting, screw connection, integral sintering and so on. The main problem in the preparation of integral electrical contacts by these methods is that the prepared electrical c...

Claims

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