Preparing method for Ti3SiC2/Cu composite conductive powder

A technology of composite conductive powder and powder, which is applied in metal processing equipment, liquid chemical plating, transportation and packaging, etc. It can solve the problems of inability to carry out mass production, complex process, high cost, etc., and achieve good chemical stability and process The process is simple and the effect of energy production

Active Publication Date: 2017-08-08
上海闻朗新材料科技有限公司
View PDF4 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to the reports in the existing literature, flexible conductive materials mainly us

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparing method for Ti3SiC2/Cu composite conductive powder
  • Preparing method for Ti3SiC2/Cu composite conductive powder
  • Preparing method for Ti3SiC2/Cu composite conductive powder

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0061] The Ti prepared by the preparation method of the present invention 3 SiC 2 / Cu composite conductive powder is mixed with resin, rubber and other insulating substrates in a certain proportion, by adjusting the Ti 3 SiC 2 / Cu composite conductive powder content, can prepare conductive film material with good conductivity; in addition, Ti 3 SiC 2 / Cu composite conductive powder can also be used as conductive filler of electronic paste.

[0062] figure 1 is Ti 3 SiC 2 / Cu composite conductive powder XRD pattern, from figure 1 It can be seen that: except Ti 3 SiC 2 In addition to the diffraction peak of Cu, the diffraction peak of Cu can be clearly observed, indicating that the Ti 3 SiC 2 / Cu composite conductive powder;

[0063] figure 2 is Ti 3 SiC 2 / Cu composite conductive powder SEM image, from figure 2 It can be seen that the nano-Cu particles are attached to the Ti 3 SiC 2 Powder surface, but not completely covered with Ti 3 SiC 2 Powder.

Embodiment 1

[0065] Take Ti with an average particle size of 2 μm to 20 μm and a purity greater than 93%. 3 SiC 2 powder; the Ti 3 SiC 2 Pour the powder into the ethanol aqueous solution (the ethanol aqueous solution is obtained by mixing ethanol and water at a volume ratio of 1:1), and make the Ti 3 SiC 2 The powder is completely immersed in the ethanol aqueous solution, and the Ti 3 SiC 2 The powder was washed with alcohol, and the alcohol washing time was 10 minutes; the Ti obtained after alcohol washing 3 SiC 2 Pour the powder into hydrofluoric acid aqueous solution (hydrofluoric acid aqueous solution is obtained by mixing hydrofluoric acid and water at a volume ratio of 1:1), and make Ti 3 SiC 2 The powder is completely submerged in hydrofluoric acid aqueous solution, and the Ti 3 SiC 2 The powder is subjected to coarsening treatment, and the coarsening treatment time is 30 minutes; hydrochloric acid (the concentration of hydrochloric acid is 100ml / L) and SnCl are mixed in a...

Embodiment 2

[0072] Take Ti with an average particle size of 2 μm to 20 μm and a purity greater than 93%. 3 SiC 2 powder; the Ti 3 SiC 2 Pour the powder into the ethanol aqueous solution (the ethanol aqueous solution is obtained by mixing ethanol and water at a volume ratio of 1:1.5), and make the Ti 3 SiC 2 The powder is completely immersed in the ethanol aqueous solution, and the Ti 3 SiC 2 The powder was washed with alcohol, and the alcohol washing time was 15 minutes; the Ti obtained after alcohol washing 3 SiC 2 Pour the powder into hydrofluoric acid aqueous solution (hydrofluoric acid aqueous solution is obtained by mixing hydrofluoric acid and water at a volume ratio of 1:2), and make Ti 3 SiC 2 The powder is completely submerged in hydrofluoric acid aqueous solution, and the Ti 3 SiC 2 The powder is subjected to coarsening treatment, and the coarsening treatment time is 40min; the volume ratio is 1:3 with SnCl 2 Aqueous solution (SnCl 2 The concentration of the aqueous ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Resistivityaaaaaaaaaa
Login to view more

Abstract

The invention discloses a preparing method for Ti3SiC2/Cu composite conductive powder. The preparing method comprises the steps that firstly, Ti3SiC2 powder is sequentially subjected to alcohol washing, roughening, sensitization, activating, washing and drying treatment, and pretreated Ti3SiC2 powder is obtained; secondly, a copper plating solution is prepared through CuSO4.5H2O, EDTANa2, NaOH and 2-2'-dipyridyl; thirdly, the copper plating solution prepared in the second step is utilized for conducting plating treatment on the pretreated Ti3SiC2 powder obtained in the first step; and fourthly, after the third step, substances left after plating treatment are filtered, parts left after liquid is filtered out are dried, and the Ti3SiC2/Cu composite conductive powder is obtained. The Ti3SiC2/Cu composite conductive powder obtained through the preparing method has low density, good stability and high conductivity.

Description

technical field [0001] The invention belongs to the technical field of conductive materials or electronic paste preparation methods, in particular to a Ti 3 SiC 2 A preparation method of / Cu composite conductive powder. Background technique [0002] With the development of electronic technology, more and more electronic devices are developing in the direction of flexibility, such as: smart clothing, robot skin, rollable e-books, strain sensors, stretchable solar cells, etc. At present, most of the conductive films that have been widely used are prepared on hard substrate materials such as glass ceramics. The disadvantages of hard substrate materials such as brittleness, fragility, and non-deformation limit their application to a large extent. It has been unable to meet the needs of the new generation of electronic equipment, so the development of new flexible conductive materials is urgently needed. [0003] Conductive fillers play a decisive role in the conductivity of m...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B22F1/02C23C18/38
CPCC23C18/38B22F1/17
Inventor 刘毅苏晓磊徐洁王俊勃贺辛亥屈银虎
Owner 上海闻朗新材料科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap