Preparation method of Ti3SiC2/Ag composite conductive powder

A composite conductive powder and powder technology, applied in metal processing equipment, liquid chemical plating, coating and other directions, can solve the problems of inability to mass production, high cost, complex process, etc., achieve good chemical stability, reduce density , the effect of simple process

Active Publication Date: 2017-10-13
XI'AN POLYTECHNIC UNIVERSITY
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

According to the reports in the existing literature, flexible conductive materials mainly use metal nanowires, graphene, CNTs, etc. as conductive fillers. there is still a certain gap

Method used

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  • Preparation method of Ti3SiC2/Ag composite conductive powder
  • Preparation method of Ti3SiC2/Ag composite conductive powder

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preparation example Construction

[0059] The Ti prepared by the preparation method of the present invention will be 3 SiC 2 / Ag composite conductive powder is mixed with resin, rubber and other insulating matrix in a certain proportion, by adjusting the Ti 3 SiC 2 / Ag composite conductive powder content, can prepare conductive film material with good conductivity; in addition, the Ti 3 SiC 2 / Ag composite conductive powder can also be used as conductive filler of electronic paste.

[0060] figure 1 is Ti 3 SiC 2 / Ag composite conductive powder XRD pattern, from figure 1 It can be seen that: except Ti 3 SiC 2 In addition to the diffraction peaks of Ag, the diffraction peaks of Ag can also be clearly observed, indicating that the Ti3SiC2 / Ag composite conductive powder has been successfully prepared.

[0061] figure 2 is Ti 3 SiC 2 / Ag composite conductive powder SEM image, from figure 2 It can be seen that the nano-Ag particles are attached to the Ti 3 SiC 2 Powder surface, but not completely c...

Embodiment 1

[0063] Take Ti with an average particle size of 2 μm to 20 μm and a purity greater than 93%. 3 SiC 2 powder; the Ti 3 SiC 2 Pour the powder into the ethanol aqueous solution (the ethanol aqueous solution is obtained by mixing ethanol and water at a volume ratio of 1:1), and make the Ti 3 SiC 2 The powder is completely immersed in the ethanol aqueous solution, and the Ti 3 SiC 2 The powder was washed with alcohol, and the alcohol washing time was 10 minutes; the Ti obtained after alcohol washing 3 SiC 2 Pour the powder into hydrofluoric acid aqueous solution (hydrofluoric acid aqueous solution is obtained by mixing hydrofluoric acid and water at a volume ratio of 1:1), and make Ti 3 SiC 2 The powder is completely submerged in hydrofluoric acid aqueous solution, and the Ti 3 SiC 2 The powder is subjected to coarsening treatment, and the coarsening treatment time is 30 minutes; hydrochloric acid (the concentration of hydrochloric acid is 100ml / L) and SnCl are mixed at a...

Embodiment 2

[0068] Take Ti with an average particle size of 2 μm to 20 μm and a purity greater than 93%. 3 SiC 2 powder; the Ti 3 SiC 2 Pour the powder into the ethanol aqueous solution (the ethanol aqueous solution is obtained by mixing ethanol and water at a volume ratio of 1:1.5), and make the Ti 3 SiC 2 The powder is completely immersed in the ethanol aqueous solution, and the Ti 3 SiC 2 The powder was washed with alcohol, and the alcohol washing time was 15 minutes; the Ti obtained after alcohol washing 3 SiC 2 Pour the powder into hydrofluoric acid aqueous solution (hydrofluoric acid aqueous solution is obtained by mixing hydrofluoric acid and water at a volume ratio of 1:2), and make Ti 3 SiC 2 The powder is completely submerged in hydrofluoric acid aqueous solution, and the Ti 3 SiC 2 The powder is subjected to coarsening treatment, and the coarsening treatment time is 40min; the volume ratio of SnCl is 3:1 2 Aqueous solution (SnCl 2 The concentration of the aqueous so...

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Abstract

The invention discloses a preparation method of Ti3SiC2/Ag composite conductive powder. The preparation method comprises the steps of (1) performing alcohol washing, coarsening, sensitization, activation, water washing and drying on Ti3SiC2 powder in sequence, so that pretreated Ti3SiC2 powder is obtained; (2) respectively preparing a silver-ammonia solution and a reduction solution; (3) performing silver and ammonia plating on the pretreated Ti3SiC2 powder obtained in the step (1) by utilizing the silver-ammonia solution and the reduction solution which are obtained in the step (2); and (4) filtering residual substances after the plating in the step (3) is completed, and drying the residual part after liquid is filtered, so that the Ti3SiC2/Ag composite conductive powder is obtained. By adopting the preparation method, the Ti3SiC2/Ag composite conductive powder with low density, good stability and high electric conductivity can be prepared.

Description

technical field [0001] The invention belongs to the technical field of conductive materials or electronic paste preparation methods, in particular to a Ti 3 SiC 2 A preparation method of Ag / Ag composite conductive powder. Background technique [0002] With the development of electronic technology, more and more electronic devices are developing in the direction of flexibility, such as: smart clothing, robot skin, rollable e-books, strain sensors, stretchable solar cells, etc. At present, the conductive films that have been widely used are mostly prepared on hard substrate materials such as glass ceramics, but hard substrate materials have many shortcomings such as brittleness, fragility, and difficulty in deformation, which largely limits their use. Applications, can no longer meet the needs of the new generation of electronic equipment, so the development of new flexible conductive materials is urgently needed. [0003] Conductive fillers play a decisive role in the cond...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02C23C18/44
CPCC23C18/44B22F1/17
Inventor 刘毅苏晓磊徐洁王俊勃贺辛亥屈银虎
Owner XI'AN POLYTECHNIC UNIVERSITY
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