High-temperature-resisting ferro-bronze and preparing method and application of high-temperature-resisting ferro-bronze

Abstract

The invention discloses high-temperature-resisting ferro-bronze. The high-temperature-resisting ferro-bronze comprises, by weight percent, 0.05%-3.0% of Fe, 0.005-0.25% of Sn, 0.01%-0.30% of P and the balance Cu and inevitable impurities. Due to the fact that the ratio and the content of elements such as Fe, Sn and P are rigidly controlled and meanwhile the precipitation amount of iron-phosphorus intermetallic compounds and tin-phosphorus intermetallic compounds in an alloy microstructure is controlled, it can be achieved that the alloy tensile strength is 450 MPa or above, the electric conductivity is 85% of the IACS or above, the hardness is 130 HV or above, meanwhile, after the situation is maintained for 5 min under the temperature of 500 DEG C, the hardness retention rate is larger than or equal to 80% of the original hardness, the good high-temperature-softening resisting performance is achieved, and the high-temperature-resisting ferro-bronze can be used for connectors and lead frame materials under the high temperature. According to the preparing method, it can be ensured that solid solution of Fe and P is achieved in a copper alloy matrix, the iron-phosphorus intermetallic compounds and the tin-phosphorus intermetallic compounds are formed by surplus Fe, P and Sn, dispersion strengthening precipitation is achieved, the alloy strength and hardness are improved, and meanwhile the electric conductivity of the high-temperature-resisting ferro-bronze is not reduced.

Description

Technical field [0001] The invention relates to the technical field of copper alloys and their applications, in particular to a high-temperature-resistant iron bronze alloy with excellent high-temperature resistance and softening performance, which can be applied to various electronic connectors, connectors, lead frames and other electronic and electrical industry products, and preparation thereof Methods and applications. Background technique [0002] In recent years, the semiconductor devices and lead frames of electronic equipment have increasingly developed in the direction of high power, large capacity, high integration, and small size. The space inside electronic and communication equipment has become smaller and more integrated. High, heat dissipation requirements are getting stricter. Corresponding LED industry, its products are also gradually developing in the direction of high brightness and high power, which leads to a significant increase in the amount of heat emitte...

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Problems solved by technology

[0006] Although the R&D personnel in this industry have made a lot of improvements on the basis of Cu-Fe-P, they have not solved the problem of low temperature softening performance of iron bronze

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