Rolled tungsten-copper alloy material and preparation method thereof

Abstract

The invention relates to a rolled tungsten-copper alloy material and a preparation method thereof, and relates to a tungsten-copper alloy material and a preparation method thereof. The invention solves the problems of poor compatibility between phases, less than 99 percent of density, high cost of manufacture equipment, complex technological process, large energy consumption and low production efficiency in the prior tungsten-copper alloy material. The rolled tungsten-copper alloy material is prepared by tungsten powder and copper powder. The preparation method comprises the following steps: firstly, preparation of mixed powder; secondly, preparation of a blank; thirdly, vacuum degassing of the blank; fourthly, preparation of an extruded tungsten-copper alloy material; and fifthly, acquisition of the rolled tungsten-copper alloy material after heating and pressurizing of the extruded tungsten-copper alloy material. The rolled tungsten-copper alloy material has good compatibility between the phases, and increases the density by 0.2 to 0.5 percent. The preparation method is simple, and has low equipment cost required, simple technology, low energy consumption and high production efficiency. The rolled tungsten-copper alloy material and the preparation method are suitable to be used in the fields of preparation, application and so on of electric spark machining electrodes, resistance welding electrodes and electronic packaging and heat sinking materials.

Description

technical field [0001] The invention relates to a tungsten-copper alloy material and a preparation method thereof. Background technique [0002] Because the tungsten-copper powder alloy material contains tungsten element with high melting point and high hardness and Cu element with high electrical conductivity and thermal conductivity, the tungsten-copper powder alloy material combines the advantages of these two elements. Therefore, it is widely used in the preparation of resistance welding, EDM and plasma spraying electrode materials, the preparation of electronic packaging materials, computer central processing systems, lead frames of large-scale integrated circuits and heat sink substrates of electronic devices such as solid-state microwave tubes, etc. field. However, due to the incompatibility between tungsten and copper, only a pseudo-alloy is formed between the two, which affects the performance of the alloy, and conventional metallurgy and powder metallurgy methods ...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems of existing tungsten-copper alloy materials, such as poor compatibility between product phases and a density lower than 99%, high cost of manufacturing equipmen