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Rolled tungsten-copper alloy material and preparation method thereof

A technology of tungsten-copper alloy and roll, which is applied in the field of tungsten-copper alloy materials and its preparation, can solve the problems of high cost of manufacturing equipment, complicated process, and low production efficiency, and achieve the effects of low cost, simple process, and improved efficiency

Inactive Publication Date: 2009-03-18
HARBIN INST OF TECH AT WEIHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems of existing tungsten-copper alloy materials, such as poor compatibility between product phases and a density lower than 99%, high cost of manufacturing equipment, complicated process, high energy consumption and low production efficiency, the present invention provides a A kind of rolling state tungsten-copper alloy material and preparation method thereof

Method used

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Examples

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Effect test

specific Embodiment approach 1

[0009] Specific embodiment 1: In this embodiment, the rolled tungsten-copper alloy material is made of 10% to 90% tungsten powder and 10% to 90% copper powder by weight percentage; wherein the Fisherman's particle size of the tungsten powder is 1 to 10 μm; In the as-rolled tungsten-copper alloy material, the tungsten phase and copper phase are distributed in the form of deformed fiber strips.

specific Embodiment approach 2

[0010] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the as-rolled tungsten-copper alloy material is made of 20%-80% tungsten powder and 20%-80% copper powder by weight percentage. Others are the same as the first embodiment.

specific Embodiment approach 3

[0011] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the as-rolled tungsten-copper alloy material is made of 60% tungsten powder and 40% copper powder by weight percentage. Others are the same as the first embodiment.

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PUM

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Abstract

The invention relates to a rolled tungsten-copper alloy material and a preparation method thereof, and relates to a tungsten-copper alloy material and a preparation method thereof. The invention solves the problems of poor compatibility between phases, less than 99 percent of density, high cost of manufacture equipment, complex technological process, large energy consumption and low production efficiency in the prior tungsten-copper alloy material. The rolled tungsten-copper alloy material is prepared by tungsten powder and copper powder. The preparation method comprises the following steps: firstly, preparation of mixed powder; secondly, preparation of a blank; thirdly, vacuum degassing of the blank; fourthly, preparation of an extruded tungsten-copper alloy material; and fifthly, acquisition of the rolled tungsten-copper alloy material after heating and pressurizing of the extruded tungsten-copper alloy material. The rolled tungsten-copper alloy material has good compatibility between the phases, and increases the density by 0.2 to 0.5 percent. The preparation method is simple, and has low equipment cost required, simple technology, low energy consumption and high production efficiency. The rolled tungsten-copper alloy material and the preparation method are suitable to be used in the fields of preparation, application and so on of electric spark machining electrodes, resistance welding electrodes and electronic packaging and heat sinking materials.

Description

technical field [0001] The invention relates to a tungsten-copper alloy material and a preparation method thereof. Background technique [0002] Because the tungsten-copper powder alloy material contains tungsten element with high melting point and high hardness and Cu element with high electrical conductivity and thermal conductivity, the tungsten-copper powder alloy material combines the advantages of these two elements. Therefore, it is widely used in the preparation of resistance welding, EDM and plasma spraying electrode materials, the preparation of electronic packaging materials, computer central processing systems, lead frames of large-scale integrated circuits and heat sink substrates of electronic devices such as solid-state microwave tubes, etc. field. However, due to the incompatibility between tungsten and copper, only a pseudo-alloy is formed between the two, which affects the performance of the alloy, and conventional metallurgy and powder metallurgy methods ...

Claims

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Application Information

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IPC IPC(8): C22C27/04C22C1/04B22F3/00
Inventor 于洋王尔德
Owner HARBIN INST OF TECH AT WEIHAI
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