163results about How to "Less layers" patented technology

An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.

To provide a working fluid for heat cycle, which has less influence over global warming, which has a small temperature glide, which has a sufficiently low discharge temperature and which is excellent in the cycle performance (refrigerating capacity and coefficient of performance), a composition for a heat cycle system, and a heat cycle system. A working fluid for heat cycle, which contains trifluoroethylene and 1,2-difluoroethylene, a composition for a heat cycle system, and a heat cycle system employing the composition. In the working fluid for heat cycle, the proportion of the total amount of trifluoroethylene and 1,2-difluoroethylene is preferably at least 20 mass % and at most 100 mass %.

Conventional schedulers employ designs allocating specific processor and memory resources, such as memory for configuration data, state data, and scheduling engine processor resources for specific aspects of the scheduler, such as layers of the scheduling hierarchy, each of which consumes dedicated processor and memory resources. A generic, iterative scheduling engine, applicable to an arbitrary scheduling hierarchy structure having a variable number of hierarchy layers, receives a scheduling hierarchy structure having a predetermined number of layers, and allocates scheduling resources such as instructions and memory, according to scheduling logic, in response to design constraints and processing considerations. The resulting scheduling logic processes the scheduling hierarchy in iterative manner which allocates the available resources among the layers of the hierarchy, such that the scheduler achieves throughput requirements corresponding to enqueue and dequeue events with consideration to the number of layers in the scheduling hierarchy and the corresponding granularity of queuing.

A mattress embodying a foam encasement surrounding individually wrapped coils and lacking a barrier separating upholstery layers from the coil assembly. Border material is affixed to sidewalls forming the foam encasement and the upholstery layer is tacked to a base of the foam encasement.

The invention provides a display panel, an electronic device comprising the display panel, and a display panel manufacturing method. The display panel comprises: an array substrate, which includes a substrate and a driving unit arranged on the substrate; a light emitting function layer, which is arranged at one side, away from the substrate, of the driving unit and is electrically connected with the driving unit; a packaging film, which is arranged at one side, away from the array substrate, of the light emitting function layer; and a polarizing function layer, which is arranged at a light outgoing side of the display panel and contains a coated polarizing layer. The flexible display panel has much fewer layers and comprises the layers that are thinner, so the flexible display panel becomes thin conveniently and is greatly improved in bending performance. Moreover, display light leakage is avoided when the display panel is bent flexibly. In addition, the manufacturing process of the display panel is easy, the production cost is low, the production efficiency is high, and large-scale industrialized applications can be facilitated.

A method comprises providing a first electrically-conductive circuit-path (22), and separately providing a second electrically-conductive circuit-path (24). A portion of the first circuit-path is positioned proximally adjacent a portion of the second circuit-path at a first predetermined electrical bond location (26). A first, electrically-insulating barrier layer (28) is interposed between the first circuit-path and second circuit-path at the first bond location, and the first circuit-path is mechanically bonded to the second circuit-path at the first bond location. The mechanical bonding configured to provide an electrically-conductive bond-path between the first circuit-path and the second circuit-path at the first bond location. The mechanical bonding may desirably include ultrasonic bonding and/or pressure bonding.

Multilayer polymeric films and other optical bodies are provided which is useful in making colored mirrors and polarizers. The films are characterized by a change in color as a function of viewing angle.

A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. Specific via designs reduce differential signal distortion due to the via pair, allowing the backplane to operate reliably at differential signal rates in excess of 3 Gigabits per second. In particular, each via passes through nonfunctional conductive pads on selected digital ground plane layers, the pads separated from the remainder of its ground plane layer by a clearance, thereby modifying the impedance of the via and reducing reflections from the stubs created by the via.

The invention relates to communication field, disclose a flow control method based on bandwidth adjustment mechanism, comprising : user data packets arrived at the hostel MSTP equipment from the source MSTP-end equipment; the MSTP equipment detect its own memory state, connect the link bandwidth of source MSTP equipment according to detection results, and send the regulating information to the sources MSTP equipment; the source MSTP equipment adjust its up-run bandwidth according to the above regulating information. The invention also discloses a network, comprising source MSTP equipment and hostel MSTP equipment. The MSTP equipment described comprises: FIFO state detection module, the FIFO receiving memory modules, FIFO sending memory modules, LCAS control modules and LCAS module. The invention transmits the congestion of the users' residential side in network to the source end users, avoid user data information packet loss, and achieve the end-to-end flow control for users.

A micro-louver structure includes a cured layer on a surface. A plurality of micro-channels forms a pattern in the cured layer. The micro-channels have a greater depth than width and are spaced apart by a separation distance greater than the width. A cured light-absorbing material is located in the micro-channels.

A structure and fabrication method for a bipolar transistor with shallow trench isolation (STI) comprises a collector formed by implanting first electric type impurity in active area; pseudo buried layers at the bottom of STI at both sides of active area by implanting heavy dose of first electric type impurity; deep contacts through field oxide to connect to pseudo buried layers and to pick up the collector; a base, a thin film deposited on the collector and doped with second electric type impurity; an emitter, a polysilicon film doped by heavy dose implant of first electric type impurity. This transistor has smaller device area, less parasitic effect, less photo layers and lower process cost.

A surface mount grid array implemented on a PCB (printed circuit board) optimized for trace escape routing for the PCB. The surface mount grid array includes a plurality of connection blocks, with each connection block including an array of pins and an array of vias, wherein the pins and vias are configured to communicatively connect an integrated circuit device to a plurality of traces of the PCB. The connection blocks are disposed in a tiled arrangement, wherein the connection blocks implement a plurality of trace escape channels along connection block boundaries. The trace escape channels are configured for routing traces from inner pins of the surface mount grid array to a periphery of the surface mount grid array.

A method of manufacturing a GaN-based film includes the steps of preparing a composite substrate, the composite substrate including a support substrate in which a coefficient of thermal expansion in its main surface is more than 1.0 time and less than 1.2 times as high as a coefficient of thermal expansion of GaN crystal in a direction of a axis and a single crystal film arranged on a main surface side of the support substrate, the single crystal film having threefold symmetry with respect to an axis perpendicular to a main surface of the single crystal film, and forming a GaN-based film on the main surface of the single crystal film in the composite substrate, the single crystal film in the composite substrate being an SiC film. Thus, a method of manufacturing a GaN-based film capable of manufacturing a GaN-based film having a large main surface area and less warpage is provided.

Simplified LED chip architectures or chip builds are disclosed that can result in simpler manufacturing processes using fewer steps. The LED structure can have fewer layers than conventional LED chips with the layers arranged in different ways for efficient fabrication and operation. The LED chips can comprise an active LED structure. A dielectric reflective layer is included adjacent to one of the oppositely doped layers. A metal reflective layer is on the dielectric reflective layer, wherein the dielectric and metal reflective layers extend beyond the edge of said active region. By extending the dielectric layer, the LED chips can emit with more efficiency by reflecting more LED light to emit in the desired direction. By extending the metal reflective layer beyond the edge of the active region, the metal reflective layer can serve as a current spreading layer and barrier, in addition to reflecting LED light to emit in the desired direction. The LED chips can also comprise self-aligned and self-limiting features that simplify etching processes during fabrication.

The invention discloses a preparation method of graphene conductive slurry. The preparation method comprises the following steps of 1) putting graphene into NMP, and carrying out ultrasonic dispersiontreatment to obtain a graphene dispersion liquid; 2) putting a carbon material into NMP, and carrying out ultrasonic dispersion treatment to obtain a carbon material dispersion liquid; 3) mixing thegraphene dispersion liquid with the carbon material dispersion liquid, then adding superfine carbon powder and superconductive carbon black, and carrying out high-pressure homogenization treatment toobtain a mixed solution; 4) adding PVDF into NMP to prepare a PVDF solution; and 5) adding the PVDF solution into the mixed solution, stirring, and adjusting the viscosity to obtain the graphene conductive slurry. According to the method, graphene with excellent thermal conductivity is adopted as a raw material, so that the graphene conductive slurry is endowed with excellent heat conduction performance, and when a battery is charged and discharged at a high rate, rapid heat conduction can be achieved, and the situation that the local temperature of the battery is too high is avoided; and thegraphene conductive slurry can be used for remarkably reducing the internal resistance of the battery, and improving the rate capability and the cycling performance of the battery.

Using packet switching, the method of video telephone communication can be applicable to united public network in next generation. New layer of data link layer protocol - data link procedure (DLP) is introduced between service layer of visible telephone and each physical layer. Using current telephone number as address of visible telephone signal packet i.e. destination address code and source address code of DLP frame realizes forwarding and exchanging voice signal in two layers. Using related signaling implements establishment and expiration of call connection as well as outputs packetized visible telephone signal with certain length periodically. Using safety mechanism, network control management mechanism, flow management mechanism provided by DLP realizes safety management, control management and flow management of network.

A printed circuit board having micro-vias used to connect a portion of the contacts in a selected row or column to the first internal layer of the board, thereby creating routing channels on the second and subsequent internal layers of the board between selected rows or columns of through-board vias used to connect the remaining contacts and a BGA package adapted to be used with the printed circuit board.

A lumber drying kiln employs outside air pressure uses a flexible collapsing bag or cover alone or in combination with walls. The collapsing bag seals against a base to maintain the vacuum. The air pressure against the flexible top keeps the lumber layers from warping or cupping during drying. The lumber stack has alternating layers of hot plates or stickers separating layers of lumber. A bag having an open bottom and made of nylon-reinforced rubber or other strong flexible material is placed over the wood and sealed to the stainless steel platform. A vacuum pump is connected with the bag by means of a manifold and operated to remove air from the enclosed lumber stack, the vacuum strengthening the seal between the base and the bottom of the bag. This chamber design is easily scaled up or down to provide a desired drying capacity.

A liquid crystal display structure includes a first substrate panel, a second substrate panel, and a liquid crystal layer disposed between the first substrate panel and the second substrate panel. Pixel portions are formed by respective electrodes for applying a voltage to the liquid crystal layer. The pixel portions include a transparent substrate panel, an organic insulating layer, a patterned reflective layer, a dielectric layer, a transparent conductive layer and a thin film transistor. The organic insulating layer is formed over the transparent substrate panel. The patterned reflective layer is formed over the organic insulating layer exposing a portion of the organic insulating layer. The dielectric layer is formed over the patterned reflective layer. The dielectric layer has a smooth upper surface. The transparent conductive layer is over the dielectric layer. The transparent conductive layer is connected to the thin film transistor so that the thin film transistor can drive the transparent conductive electrode.

The invention discloses a method for preparing a nano layered g-C3N4/Ag@AgCl composite photocatalytic material. The method comprises the following steps: firstly, performing two-sectional urea heating thermal polymerization so as to prepare porous g-C3N4, performing thermal treatment with a solvent on the porous g-C3N4, performing ultrasonic peeling in water so as to obtain nano layered g-C3N4 colloid, preparing a hollow cubic Ag@AgCl nano material by taking ethanol as a solvent, sodium chloride as a template and silver nitrate as a silver source, and finally, performing ultrasonic compounding on the nano layered g-C3N4 and Ag@AgCl, thereby obtaining the nano layered g-C3N4/Ag@AgCl composite photocatalytic material. As nano layered g-C3N4 is distributed on the surface of Ag@AgCl to form a heterogeneous structure, the stability of the nano layered g-C3N4/Ag@AgCl composite photocatalytic material prepared by using the method can be effectively improved, light corrosion of Ag@AgCl is retarded, and the material is high in catalysis property under visible light and sunshine, and has very good application prospects in fields such as photocatalytic water pollution treatment.