Chemical mechanical polishing solution for large-sized silicon wafers and preparation method thereof

Abstract

The invention relates to a chemical mechanical polishing solution for large-sized silicon wafers and a preparation method thereof, and the chemical mechanical polishing solution is mainly applied to the ultraprecision machining of large-sized semiconductor silicon substrate slices, and can obtain a nanometer-level ultrasmooth surface. The polishing solution consists of the following components inpercentage by weight: 5 to 50 percent of silicon dioxide abrasive, 1 to 10 percent of pH value regulator, 0.01 to 5 percent of surfactant, 0.01 to 0.05 percent of cleaning auxiliary, 0.01 to 2 percent of chelator and the balance of deionized water; and the silicon dioxide is added in the state of silicasol. Under proper polishing technological conditions, the polishing solution prepared with the components according to the contents can obtain a high-quality polished surface and meet the requirement of the semiconductor industry on the surface quality and removal rate of silicon substrate slices, and moreover, the invention has the advantages of low cost, easy cleaning, low corrosiveness and the like, and has a good application prospect.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing, in particular to a chemical mechanical polishing liquid for large-size silicon wafers and a preparation method thereof. The large-size silicon wafer refers to a silicon single crystal substrate with a specification of 8 inches or more, and the polishing liquid is used for ultra-precision machining of the surface of the large-size silicon single crystal substrate. Background technique [0002] With the advancement of integrated circuit manufacturing technology and the development of technology, on the one hand, in order to increase chip production and reduce unit manufacturing costs, the diameter of silicon substrates is required to continue to increase; The line width is getting thinner. At present, VLSI manufacturing technology has developed into the era of 90nm and 300mm. The characteristic line width technology of 65nm is also entering the market, and the process of 45nm...

AI Technical Summary

Problems solved by technology

Although there have been several R&D and production companies of polishing fluid in China in recent years, in general, there is no company whose products can replace imported products and occupy a place in the domestic market.