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A polyolefin adhesive for liquid cooling plates, a heat-bonding film, and a method for preparing the same.

This invention discloses a polyolefin adhesive for liquid cooling plates, a heat-bonding film, and a method for preparing the same. The polyolefin adhesive for liquid cooling plates comprises the following raw materials in parts by weight: 40-80 parts of a base resin; 5-40 parts of a tackifying resin; 1-35 parts of a flame retardant; 1-5 parts of a crosslinking agent; and 0.1-0.5 parts of an antioxidant. The base resin is maleic anhydride polyolefin resin, and the crosslinking agent includes aziridine crosslinking agent, or may also include at least one of polycarbodiimide, bisphenol A type epoxy resin, and bisphenol A type phenolic epoxy resin. This invention achieves a reduction in the curing temperature of the adhesive film and improves its performance.
Owner:HUIZHOU HONGTIAN ELECTRONIC MATERIALS CO LTD