The invention discloses a glue solution for a
copper-clad plate and a preparation method of the glue solution, and relates to the technical field of
copper-clad plates. According to the prepared glue solution for the
copper-clad plate, the composite
epoxy resin, the curing agent, the
accelerant, the
solvent, the flexibilizer and the
inorganic filler, the composite
epoxy resin comprises
bisphenol A
epoxy resin, epoxy phenyl polysiloxane,
itaconic acid polyaryletherketone and hydroxyl-terminated
fluorine-containing vinyl polysiloxane, so that the
interface bonding force with the copper plate is enhanced; the
dielectric constant and the
dielectric loss are effectively reduced, the peel strength and the
toughness of the material are also remarkably improved, and the
toughening agent is modified polyether
sulfone microspheres; the modified polyethersulfone microspheres are prepared by
coating polyethersulfone microspheres with
hexamethylenediamine tetrapropionamide
diamine, the
hexamethylenediamine tetrapropionamide
diamine is prepared by carrying out
acylation condensation reaction on
hexamethylenediamine tetramethyl
propionate and
ethylenediamine, and the polyethersulfone microspheres are prepared by carrying out electrostatic
spinning on a
spinning solution of polyethersulfone and vinylpyridine, so that the peel strength of the glue solution is remarkably improved.