Porous nano composite abrasive particle containing polishing active elements, polishing solution composition and preparation method thereof

Abstract

The invention relates to a porous nano composite abrasive particle containing polishing active elements, a polishing solution composition and a preparation method thereof. The composite abrasive particle is: a. composite silicon oxide abrasive particle formed by silicon oxide and oxide containing polishing active elements; or b. composite aluminum oxide abrasive particle formed by aluminum oxide and oxide containing polishing active elements. The composite abrasive particle is in a nano pore structure, and can lower the abrasive hardness and reduce the excess collision of the inorganic compact abrasive particle onto the substrate, thereby reducing the polishing damage; the abrasive particle contains iron or copper, cerium, nickel, titanium, silver or any other polishing active element in the aspect of chemical composition, and can enhance the chemical action of the abrasive particle; and the porous structure of the abrasive particle can adsorb and store the polishing solution component to enhance the chemical activity of the abrasive particle. The enhancement of the chemical action can increase the polishing speed of the abrasive particle, and the abrasive particle designed in such a way can simultaneously achieve the goals of high speed and high precision in polishing. When being used for polishing an electronic device, such as a hard disk substrate, the polishing solution provided by the invention can effectively lower the surface roughness of the memory hard disk substrate, and has high polishing speed.

Description

technical field [0001] The invention relates to a polishing abrasive grain, a polishing liquid composition and a preparation method thereof, in particular to a porous nano-composite abrasive grain containing polishing active elements, a polishing liquid composition and a preparation method thereof. Background technique [0002] Today, with the rapid development of advanced electronic manufacturing technology, severe challenges have been put forward to the limit of mechanical manufacturing, and the requirements for processing accuracy and surface quality are getting higher and higher. Taking the computer hard disk as an example, the flying height of the computer head has been reduced to about 3 nm, and there is a further downward trend. If the surface roughness of the hard disk is too large, the head will collide with the surface of the disk during high-speed rotation, which will damage the head or the magnetic medium on the surface of the hard disk, resulting in failure of...

AI Technical Summary

Problems solved by technology

Reducing the hardness of abrasive grains (such as inorganic abrasive grains / polymer core-shell abrasive grains in research and reports) can improve polishing damage, but reduces the polishing speed, because these abrasive grains are inert abrasive grains and do not have Chemical activity, after the hardness is reduced, the mechanical action is reduced, resulting in the incompatibility between polishing speed and polishing quality