The invention belongs to the technical field of
grinding fluid, and particularly relates to
grinding fluid for a
silicon carbide substrate
wafer, which comprises the following component raw materials in parts by weight: 5-12 parts of
diamond micro
powder; 35 to 80 parts of pure water; 15 to 25 parts of a suspending agent; 10-18 parts of a dispersant; 5-10 parts of an emulsifier; 15 to 20 parts of a
lubricant; the dispersing agent and the suspending agent are used for dispersing
diamond micro-
powder, the dispersing agent and the suspending agent are used for dispersing
diamond micro-
powder, the dispersing agent and the suspending agent are used for dispersing diamond micro-powder, the dispersing agent and the suspending agent are used for dispersing diamond micro-powder, the diamond micro-powder is one or a mixture of several of single-
crystal diamond micro-powder, polycrystalline-like diamond micro-powder or
polycrystalline diamond micro-powder, the
diameter of the diamond micro-powder is smaller than 30 micrometers, and the pure water is prepared through a
reverse osmosis method. When a worker prepares the
grinding fluid for the
silicon carbide substrate
wafer, under the cooperation of the dispersing agent and the suspending agent,
sedimentation and condensation of particles can be prevented, an amphiphilic
reagent required by a stable suspension is formed, and therefore it can be guaranteed that the grinding fluid does not settle after being placed for a long time.