The utility model discloses a
wafer clamping device and horizontal
electroplating equipment, and the clamping device comprises a clamping unit which comprises a clamping seat, a sealing ring, a conducting ring and a pressing part, the clamping seat forms an opening matched with a to-be-electroplated area on the bottom surface of a
wafer from the bottom, and the sealing ring and the conducting ring are respectively arranged on the clamping seat; wherein the sealing ring and the conducting ring sequentially surround a to-be-plated area from inside to outside and abut against the bottom face of a
wafer, and the wafer is pressed by the pressing component from top to bottom; and the driving unit comprises a lifting driving part. According to the utility model, on one hand, the sealing ring and the conductive ring are kept in a compressed state by arranging the auxiliary component, so that deviation caused by ring deformation of the sealing ring and the conductive ring is eliminated, and
conductivity and sealing performance are effectively improved; on the other hand, through cooperation of the first rotation driving part, the second rotation driving part and the lifting driving part, the wafer enters the
electrolyte in an inclined posture on the basis that the wafer keeps rotating around the center line of the wafer, the
discharge rate of bubbles in the to-be-plated area of the wafer is effectively increased, and the
electroplating quality is improved.