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Heat-transferring adhesive tape with improved functionality

A technology of adhesive tape and adhesive layer, applied in the direction of film/sheet adhesive, film/sheet without carrier, non-polymer adhesive additive, etc., can solve electromagnetic wave shielding performance or electromagnetic wave absorption performance Decrease, decrease in adhesive thermal conductivity, electrical conductivity, impossibility to improve adhesive thermal conductivity, electrical conductivity, electromagnetic wave shielding performance or electromagnetic wave absorption performance, etc.

Inactive Publication Date: 2008-08-13
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, when pores are formed in the adhesive to improve the above-mentioned wettability, the resulting adhesive shows a decrease in thermal conductivity, electrical conductivity, etc. due to the porous structure formed in the adhesive, and causes electromagnetic wave shielding performance or Decrease in electromagnetic wave absorption performance
Therefore, even if a filler such as a thermally conductive filler, an electrically conductive filler, or an electromagnetic wave shielding filler is added to the adhesive, it is impossible to improve the thermal conductivity, electrical conductivity, electromagnetic wave shielding of the adhesive due to the existence of the aforementioned porous structure. performance or electromagnetic wave absorption performance

Method used

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  • Heat-transferring adhesive tape with improved functionality
  • Heat-transferring adhesive tape with improved functionality
  • Heat-transferring adhesive tape with improved functionality

Examples

Experimental program
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Effect test

preparation example Construction

[0093] It is possible to control the adhesive properties of the adhesive tape according to the production method using the crosslinking agent during the manufacture of the adhesive tape. Preferably, the crosslinking agent is used in an amount of about 0.05 to about 5 parts by weight based on 100 parts by weight of the adhesive polymer resin. Specific examples of crosslinking agents that can be used in the present invention include, but are not limited to, polyfunctional acrylates, including monomeric crosslinking agents such as 1,6-hexanediol diacrylate, trimethylolpropane triacrylate, Pentaerythritol triacrylate, 1,2-ethanediol diacrylate and 1,12-dodecanediol acrylate.

[0094] When a photoinitiator is used during the manufacture of the adhesive tape according to the present invention, it is possible to control the degree of polymerization of the adhesive polymer resin by adjusting the amount of the photoinitiator used. Preferably, the photoinitiator is used in an amount of...

Embodiment 1

[0102] 1) Preparation of partial polymerization mixture

[0103] First, 95 parts by weight (parts by weight based on 100 parts by weight of the adhesive polymer resin; the same will apply below) of 2-ethylhexyl acrylate and 5 parts by weight as polar comonomer The acrylic acid was partially polymerized to obtain a slurry with a viscosity of 3000 cPs. Next, make 100 parts of the slurry with 0.2 parts of α, α-methoxy-α-hydroxyacetophenone as photoinitiator and 0.65 parts of 1,6-hexanediol diacrylate (HDDA ) thoroughly, and stir the mixture well.

[0104] 2) Preparation of the first adhesive layer

[0105] The mixture obtained above was divided into two parts, one part and 80 parts of aluminum hydroxide (Al(OH) 3 )mix. Next, the N 2 Gas is injected into the mixture and the mixture is subjected to a porous structure forming (foaming) process with high-speed stirring. Then, the resulting mixture was applied to a thickness of 1 mm on a release sheet, thereby forming a firs...

Embodiment 2

[0113] An adhesive tape was obtained in the same manner as in Example 1, except that carbonyl iron powder having a particle size of 50 μm was used as an electromagnetic wave absorbing filler instead of aluminum hydroxide (Al(OH) 3 ), in order to prepare the second adhesive layer.

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Abstract

Disclosed is an adhesive tape including a first adhesive layer and a second adhesive layer. More particularly, the first adhesive layer has a porous structure and contains a heat conductive filler, and the second adhesive layer has a non-porous structure and contains at least one filler selected from the group consisting of a heat conductive filler, an electromagnetic wave shielding filler and an electromagnetic wave absorbing filler. The adhesive tape may be applied to electronic products, especially to electronic products requiring a large area of adhesion, such as a plasma display panel (PDP).

Description

technical field [0001] The present invention relates to an adhesive tape comprising a first adhesive layer having a porous structure and containing a thermally conductive filler, and a second adhesive layer having a non-porous structure. Background technique [0002] In general, most electronic products, including display devices, include a combination of many different materials. In addition, a variety of adhesives have been used to assemble such electronic products, with varying degrees of thickness and different properties so that the material can perform its function smoothly. Adhesives applied to electronic products not only need to have the function of bonding different kinds of materials together, but also need to have thermal conductivity, electromagnetic wave shielding performance (conductivity), or electromagnetic wave absorption performance, so that materials that are bonded to each other Performs its unique function satisfactorily. [0003] In order to meet the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J7/10
CPCC09J7/10Y10T156/10Y10T428/249954C09J7/38C09J9/00C09J11/04C09J2301/208C09J2301/40
Inventor 金猷勋文成泌
Owner 3M INNOVATIVE PROPERTIES CO
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