Electronic component cutting and stripping machine and method thereof
Patent Information
- Authority / Receiving Office
- CN ยท China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- PROV TECH CORP
- Publication Date
- 2010-12-01
- Estimated Expiration
- Not applicable ยท inactive patent
Smart Images
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Abstract
Description
technical field
[0001] The invention relates to an electronic component cutting and stripping machine and a method thereof, in particular to an electronic component cutting and stripping machine and a method thereof that can reduce the manufacturing process and working time, and can easily strip electronic components, thereby improving production efficiency and saving costs. Background technique
[0002] Nowadays, in the back-end process of LED electronic components, multiple well-tested dies are sucked onto the lead frame for die bonding, and then wire bonded and molded. And cutting / forming (Trim / Form), final testing (test) and packaging, that is to complete the back-end process of LEDs. Among them, the cutting / forming process is to separate the LEDs assembled on the lead frame independently, in order to prevent the LED from cutting To move freely during the operation, the method is to glue a hollow ring frame 12 on the tape 11 first, and cut off the tape edges outside the ...