Electronic component cutting and stripping machine and method thereof

Abstract

The invention provides an electronic component cutting and stripping machine and a method thereof. The electronic component cutting and stripping machine comprises a feeding device, a conveying device, a shifting device, a cutting device, a cleaning device and a receiving device; wherein the feeding device contains a plurality of lead frames provided with electronic components; the conveying device is provided with a conveying mechanism and a stripping platform provided with a bevel, and the conveying mechanism is used for conveying adhesive belts; the shifting device utilizes a picking and placing device to take out the lead frames provided with electronic components from the feeding device, the lead frames are shifted and adhered onto the adhesion belts on the conveying device, and then the adhesion belts and the lead frames are conveyed to the position below the cutting device; the cutting device utilizes a cutter to cut the lead frames on the adhesive belts, so as to obtain a plurality of independent electronic components, and the conveying mechanism conveys the independent electronic components and adhesive belts to the position below the cleaning device; and the cleaning device utilizes a cleaner to clean dust on the electronic components, then the conveying mechanism causes the adhesive belts to bend down along the bevel of the stripping platform, so as to strip the electronic components, and the electronic components are dropped into the receiving device to be received and contained.

Description

technical field [0001] The invention relates to an electronic component cutting and stripping machine and a method thereof, in particular to an electronic component cutting and stripping machine and a method thereof that can reduce the manufacturing process and working time, and can easily strip electronic components, thereby improving production efficiency and saving costs. Background technique [0002] Nowadays, in the back-end process of LED electronic components, multiple well-tested dies are sucked onto the lead frame for die bonding, and then wire bonded and molded. And cutting / forming (Trim / Form), final testing (test) and packaging, that is to complete the back-end process of LEDs. Among them, the cutting / forming process is to separate the LEDs assembled on the lead frame independently, in order to prevent the LED from cutting To move freely during the operation, the method is to glue a hollow ring frame 12 on the tape 11 first, and cut off the tape edges outside the ...

AI Technical Summary

Problems solved by technology

[0003] In this cutting / forming process, in order to prevent the LED from moving during the cutting operation, a ring-shaped frame must be pasted on the tape first, and the tape edge outside the ring-shaped frame must be cut off before the lead frame with LED can be pasted on the tape In addition, it not only consumes cost, but also increases the procedures such as pasting the ring frame and cutting the tape edge material, which consumes operating time

[0004] The cutting / forming process manually sticks the lead frames with LEDs on the tape inside the ring frame one by one, and then transfers each ring frame to the cutting machine for cutting. When the number of lead frames is large, the manual sticking operation It is quite time-consuming and labor-intensive, resulting in the loss of production efficiency

[0005] The cutting / forming process must use a special material of U-V tape and irradiate the tape with a UV lamp to remove the adhesiveness of the tape. Not only the cost of the tape is high, but also UV lamp equipment needs to be purchased, resulting in increased costs and time-consuming work.

[0006] As the volume of LEDs is becoming smaller and smaller, it is quite difficult for the picker and placer of the material transfer device to take out the tiny LEDs on the tape, resulting in the loss of materials that are not easy to receive

Images