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1428results about How to "Avoid heating" patented technology

Plant for energy production

The invention provides a plant for production of energy, comprising any type of heat or energy source including but not limited to solar power sources, nuclear reactors, fossil fuel plants, wind power plants, tidal power plants, waste heat power plants and geothermal sources, operatively arranged at an input side of the plant, and heat delivery or energy production means such as turbine-electric generator sets, operatively arranged at a delivery side of the plant. The plant is distinctive in that it further comprises a thermal energy storage with integrated heat exchanger, comprising a solid state thermal storage material, a heat transfer fluid and means for energy input and output, wherein: the storage comprises at least one heat transfer container, solid state thermal storage material is arranged around the heat transfer container, the heat transfer container contains the heat transfer fluid and the means for energy input and output, so that all heat transferring convection and conduction by the heat transfer fluid takes place within the respective heat transfer container, the thermal energy storage with heat exchanger has been arranged inside thermal insulation, and the solid state thermal energy storage with heat exchanger, has been arranged between the input side and delivery side of the plant for storage and heat exchange of thermal energy, the storage is coupled directly or via an additional heat exchanger to the source and the storage is coupled directly or via an additional heat exchanger to the delivery side of the plant.
Owner:NEST

Heavy oil lightening method and device

The invention relates to a heavy oil lightening method and technique. The method comprises steps as follows: raw oil is introduced into a thermal cracking reactor through a feed system, and mixed with a high-temperature solid heat carrier from a combustion (gasifying) reactor, so that the raw oil is subjected to fluidizing heat exchange with the solid heat carrier and carries out thermal cracking reaction on the surface of the solid heat carrier; the cracking gas generated by the thermal cracking reaction and a light component product are subjected to steam stripping by fluidizing medium gas and enter a subsequent absorption and stabilization system and a purification and separation system, heavy coke (petroleum coke) is attached to the surface of the solid heat carrier and enters the combustion (gasifying) reactor via a material returning valve, and an oxidizing (gasifying) and fluidizing gas is introduced to realize combustion (gasifying) reaction in the fluidization elevation process of the petroleum coke; and after the reaction product (fume or gasified gas) and the solid heat carrier are separated by a gas-solid separator, the fume (gasified gas) is led into a waste heat recovery system and a gas purification system, the high-temperature solid heat carrier is distributed by a distribution valve and respectively enters the thermal cracking reactor and the combustion (gasifying) reactor for cyclic use, and the collected fly ash can be used after further processing, thereby complete high-value conversion and use of the heavy oil.
Owner:INST OF PROCESS ENG CHINESE ACAD OF SCI

Non-pneumatic wheel and wheel, suspension and tire used therein

InactiveUS20110248554A1Prevent tire blowoutReduce vehicle accidentRimsLeaf springsCornering forceBrake fade
Provided is a non-pneumatic wheel (100) for a vehicle, and a wheel (100), suspension (200; 200-1), and tire (300) used therein that are capable of ensuring driving stability because there is no air chamber between a wheel (100) and a tire (300) to blowout. They are also capable of ensuring good road holding, preventing standing waves, reducing brake fade and cornering force, providing good handling and ride comfort, staying quiet when rolling, and are economical and environmentally friendly. The non-pneumatic wheel (100) includes a wheel (100), a shock absorbing member (220; 220-1) coupled to an outer periphery of the wheel (100) and absorbing or attenuating noise and vibration due to external shock, a plurality of resilient members (230; 230-1; 230-2) arranged around and coupled to an outer periphery of the shock absorbing member (220; 220-1) in a radial direction and having a plurality of resilient rings (230-1a) that are resiliently deformed in response to an external force, resilient links (240) respectively coupled to the resilient rings (230-1a) to evenly transmit external shock to the resilient rings (230-1a), rail plates (270) to which sliders (261) formed at both ends of the resilient links (240) are slidably coupled, and a tire (300) having a plurality of coupling grooves (321) formed along an inner periphery such that the rail plates (270) are inserted into the coupling grooves (321).
Owner:CHON YOUNG ILL +4

Supporting substrate for preparing semiconductor light-emitting device and semiconductor light-emitting device using supporting substrates

The present invention is related to a supporting substrate for preparing a semiconductor light-emitting device employing a multi-layered light-emitting structure thin-film and a method for preparing a semiconductor light-emitting device employing the supporting substrate for preparing a semiconductor light-emitting device. The supporting substrate for preparing a semiconductor light-emitting device is formed by successively laminating a sacrificial layer, a heat-sink layer and a bonding layer on a selected supporting substrate. A method for preparing a semiconductor light-emitting device employing the supporting substrate for preparing a semiconductor light-emitting device includes: preparing a first wafer in which a semiconductor multi-layered light-emitting structure is laminated / grown on an upper part of an initial substrate; preparing a second wafer which is a supporting substrate for preparing a semiconductor light-emitting device; bonding the second wafer on an upper part of the first wafer; separating the initial substrate of the first wafer from a result of the bonding; performing passivation after forming a first ohmic contact electrode on an upper part of the first wafer from which the initial substrate is separated; and preparing a single-chip by severing a result of the passivation.
Owner:LG INNOTEK CO LTD
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