Polyimide foam and preparation method thereof

A technology of polyimide and foamed plastics, applied in the field of polyimide foamed plastics and its preparation, can solve the problem of difficult-to-carbon fiber reinforced epoxy resin composite material support, low thermal deformation or creep capacity, and sound absorption performance. To achieve the effect of good sound absorption performance, high temperature for long-term use, and low density

Active Publication Date: 2010-08-25
SHENZHEN HIFUTURE ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] It can be seen from Table 1 that the compressive strength of rigid polyvinyl chloride (PVC) foam, rigid polyurethane (PU) foam and polystyrene (PS) foam is relatively high, but the glass transition temperature is less than 130 °C, and the long-term use temperature is low. At ≤120°C, it cannot be used as a high-temperature sound-absorbing or noise-reducing material, and it is difficult to use as a support for carbon fiber reinforced epoxy resin composite materials, and it is even less l

Method used

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  • Polyimide foam and preparation method thereof
  • Polyimide foam and preparation method thereof
  • Polyimide foam and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] 1,2,4,5-Pyromellitic anhydride 100 parts

[0052] Polymethylene polyphenyl polyisocyanate 130 parts

[0053] 150 parts of N,N-dimethylformamide

[0054] Triethanolamine 0.50 parts

[0055] Stannous octoate 0.50 parts

[0056] DC-193 2.50 parts

[0057] Foaming agent 6 parts

[0058] Add 1,2,4,5-pyromellitic anhydride and N,N-dimethylformamide solvent into the container and stir thoroughly until the 1,2,4,5-pyromellitic anhydride powder is completely dissolved , add polymethylene polyphenyl polyisocyanate, triethanolamine, stannous octoate, DC-193, and react at a temperature range of 60°C to 90°C for 0.3 hours to 2 hours, and then cool down to 30°C to obtain a higher viscosity foam precursor solution; add foaming agent, stir quickly, pour into the pre-prepared mold after the solution starts to turn white, and foam freely for 5 minutes to obtain the foam intermediate; then put the foam intermediate into a vacuum oven , solidified at 240° C. for 2 hours, and released...

Embodiment 2

[0060] 3,3',4,4'-Benzophenone tetraacid dianhydride 80 parts

[0061] Polymethylene polyphenyl polyisocyanate 109 parts

[0062] N,N-Dimethylformamide 210 parts

[0063] 0.35 parts of triethylamine

[0064] Stannous octoate 0.35 parts

[0065] AK 8805 1 copy

[0066] Foaming agent 5 parts

[0067] Add 3,3',4,4'-benzophenone tetraacid dianhydride and N,N-dimethylformamide solvent into the container and stir thoroughly until 3,3',4,4'-benzophenone After the tetraacid dianhydride powder is completely dissolved, add polymethylene polyphenyl polyisocyanate, triethylamine, stannous octoate, AK 8805, and react at 90°C for 1 hour to 2 hours, then cool down to 30°C to obtain Foam precursor solution with high viscosity; add foaming agent, stir quickly, pour the solution into the pre-prepared mold after the solution starts to turn white, and foam freely for 10 minutes to obtain the foam intermediate; then put the foam intermediate into In a vacuum oven, solidify at 250° C. for 3 ho...

Embodiment 3

[0069] 1,2,4,5-Pyromellitic anhydride 45 parts

[0070] 3,3',4,4'-Benzophenone tetraacid dianhydride 65 parts

[0071] Polymethylene polyphenyl polyisocyanate 180 parts

[0072] N,N-Dimethylacetamide 210 parts

[0073] Triethanolamine 0.40 part

[0074] Dibutyltin dilaurate 0.40 parts

[0075] AK 8805 2 copies

[0076] Foaming agent 4 parts

[0077] Add 1,2,4,5-pyromellitic anhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride and N,N-dimethylacetamide solvent into the container and stir thoroughly, After the powders of 1,2,4,5-pyromellitic anhydride and 3,3',4,4'-benzophenone tetraacid dianhydride are completely dissolved, add polymethylene polyphenyl polyisocyanate, triethanolamine , dibutyltin dilaurate, AK 8805, and react at 90°C for 1 hour to 2 hours, then cool down to 30°C to obtain a foam precursor solution with high viscosity; add foaming agent, stir quickly, and wait until the solution starts to foam After whitening, pour it into a pre-prepared mold, an...

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PUM

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Abstract

The invention relates to polyimide foam and a preparation method thereof. The raw materials of the polyimide foam include aromatic dianhydride or aromatic tetracid, isocyanate, polar solvent, composite catalyst, surfactant, foaming agent and other assistants. The preparation method comprises: reacting the aromatic dianhydride or aromatic tetracid with the isocyanate to obtain solution of polyimide foam precursor; adding the foaming agent into the solution of the foam precursor to perform a reaction to obtain a foam intermediate by free foaming; and solidifying and setting the foam intermediate by heat treatment. The method is characterized in that: the polyimide foam prepared by the method has uniform cells, hard texture, low density, a glass-transition temperature of 260 to 305 DEG C, a Shore hardness of 40 to 88 HC and a compression strength of 400 to 700kPa; the preparation process is simple; the cost is low; the foaming process is nontoxic and environmentally-friendly; an innovation is made in high-temperature, light, pressure-resistance, sound-absorbing, noise-reducing and heat-insulating polymer foam materials; and an important support is provided for high-temperature advanced composite material technology.

Description

technical field [0001] The invention relates to a polyimide foam plastic and a preparation method thereof. Background technique [0002] Existing polyimide foam materials can be used for a long time at 250°C to 300°C, and can be used at 400°C to 500°C for a short time. It is one of the materials with the best thermal stability among polymer foams. Polyimide foam also has good heat insulation and sound absorption properties, good dielectric properties, good flexibility and elasticity, and good radiation resistance. Therefore, polyimide foam materials are widely used as engineering materials in the fields of aerospace, tactical weapons, electronics, communications and ships. [0003] The research on polyimide foam material began in the 1860s, and DuPont of the United States applied for a patent US3249561 in 1966. This patent discloses a method of first preparing a polyamic acid solution, and then adding a dehydrating agent or a dehydrating agent / tertiary amine mixture. Then ...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08G73/10C08J9/02
Inventor 詹茂盛刘小艳王凯
Owner SHENZHEN HIFUTURE ELECTRIC
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