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High-temperature-resistant matrix resin for high-Tg copper-clad plate and preparation method of high-temperature-resistant matrix resin

A technology for copper clad laminate and matrix resin is applied in the field of high-Tg copper clad laminate with high temperature resistant matrix resin and its preparation. , the effect of good comprehensive performance

Inactive Publication Date: 2015-04-29
DONGHUA UNIV +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the compatibility between the polyimide system and epoxy resin is poor, and it is difficult to prepare an adhesive system that has both the high temperature resistance of polyimide and the excellent adhesion and processability of epoxy resin.
Therefore, it is difficult to use conventional polyimide resins to modify epoxy resin systems to obtain adhesives with excellent comprehensive properties.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Mix 800 grams of ES216 epoxy resin, 200 grams of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin, 50 grams of 9,10-dihydro-9- Oxa-10-phosphaphenanthrene-10-oxide (DOPO) and 120 grams of tetrabromophthalic anhydride (TBPA) were put into the reaction kettle, stirred and mixed, and stirred and reacted at 100°C for 1 hour to obtain 1170 grams of Group A Points, denoted as A1.

[0036] Put 6.44 grams (0.02 mole) of 1,4-bis(2,4-diaminophenoxy) benzene aromatic tetraamine and 2000 grams of N,N-dimethylacetamide into the reaction kettle and stir at room temperature Dissolve, add 3.92 grams (0.04 moles) of maleic anhydride, stir and react for 0.5 hours, cool in an ice-water bath to 0°C-10°C, add 205.0 grams (0.5 moles) of 2,2-bis[4-(4-aminophenoxy base) phenyl] propane and 100.0 grams (0.5 moles) of 3,4'-diaminodiphenyl ether, 119.6 grams (0.23 moles) of 2,2-bis[4-(3,4-dicarboxyphenoxy)benzene Base] propane dianhydride and 248.0 grams (0.8 moles) 3,3 ', 4,4'-te...

Embodiment 2

[0039] 100 grams of N,N,O-triglycidyl p-aminophenol epoxy resin, 700 grams of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenyl ether epoxy resin , 200 grams of ECC202 epoxy resin, 300 grams of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO), 250 grams of tetrabromophthalic anhydride (TBPA) are put into the reactor, Stir and mix, and stir and react at 120°C for 0.5 hour to obtain 1550 g of component A, which is designated as A2.

[0040] 215.6 grams (0.49 moles) of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]propane and 3.22 grams (0.01 moles) of 1,4-bis(2,4-diaminobenzene Oxygen) benzene, 2000 grams of N,N-dimethylacetamide and 2000 grams of N-methyl-2-pyrrolidone were put into the reaction kettle, stirred and dissolved at room temperature, added 98.0 grams (1.0 moles) of maleic anhydride, stirred After reacting for 0.5 hours, cool in an ice-water bath to 0°C-10°C, add 200.0 g (1.0 mol) of 3,4'-diaminodiphenyl ether aromatic diamine, 119.6 g (0.23 mol) of 2,2-bis[ 4-(3,4-dica...

Embodiment 3

[0043] Take an appropriate amount of the high-Tg copper-clad laminate high-temperature-resistant matrix resins HTPBM-1 and HTPCBM-2 of the above-mentioned examples 1 and 2, and apply them evenly on standard stainless steel test pieces, and then stack them after airing at room temperature for 1 hour. Close, clamp, put into blast oven for curing: heat from room temperature to 95°C, hold for 2.5 hours, continue to heat up to 130°C, hold for 2 hours, continue to heat up to 185°C, hold for 2 hours, continue to heat up to 200°C , keep warm for 1 hour, and cool down to room temperature naturally. The measured tensile shear strength is shown in Table 1.

[0044] Take an appropriate amount of the high-Tg copper-clad laminate high-temperature-resistant matrix resins HTPBM-1 and HTPCBM-2 of the above-mentioned examples 1 and 2, and pour them into a stainless steel disc with a diameter of 5 cm (the disc is coated with a release agent in advance ), thermal curing: heat from room temperatu...

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Abstract

The invention relates to high-temperature-resistant matrix resin for a high-Tg copper-clad plate and a preparation method of the high-temperature-resistant matrix resin. The matrix resin comprises epoxy resin, a polyimide resin liquid, tetrabromophthalic anhydride, DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide), a curing agent and an organic solvent whose mass ratio is 100:50:150: (12-25) : (5-30) : (50-100). The preparation method is as follows: after epoxy resin, DOPO and tetrabromophthalic anhydride are mixed and react, a component A is obtained; after aromatic diamine, aromatic quaternary amine, aromatic dianhydride and maleic anhydride completely react in a strong-polarity nonprotic organic solvent, an azeotropic dehydrating agent and a catalyst are added, and the polyimide resin liquid, namely, a component B is obtained after an azeotropic dehydration imidization reaction; the component A and the component B are mixed, and the curing agent and the organic solvent are added, and the mixture is uniformly mixed to obtain the high-temperature-resistant matrix resin. The product has excellent overall performance, is suitable for manufacturing an advanced composite material, is particularly suitable for manufacturing the high-Tg copper-clad plate and has a good market prospect.

Description

technical field [0001] The invention belongs to the field of matrix resins, and in particular relates to a high-Tg copper-clad clad board high-temperature-resistant matrix resin and a preparation method thereof. Background technique [0002] Copper clad laminate technology and production have experienced more than half a century of development history. Now it has become an important part of basic materials in electronic information products. Copper-clad laminate manufacturing is a sunrise industry, and it has broad prospects along with the development of electronic information and communication industries. Copper clad laminate manufacturing technology is a multidisciplinary technology with high technology. The development of electronics industry technology in the past century shows that copper clad laminate technology is often one of the key aspects to promote the development of the electronics industry. Its progress and development are constantly driven by the innovation...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L79/08C08J5/24B32B15/092B32B15/20B32B27/06B32B27/12B32B27/38
Inventor 虞鑫海陈戚沈海平周志伟
Owner DONGHUA UNIV
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