High-temperature-resistant matrix resin for high-Tg copper-clad plate and preparation method of high-temperature-resistant matrix resin

Abstract

The invention relates to high-temperature-resistant matrix resin for a high-Tg copper-clad plate and a preparation method of the high-temperature-resistant matrix resin. The matrix resin comprises epoxy resin, a polyimide resin liquid, tetrabromophthalic anhydride, DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide), a curing agent and an organic solvent whose mass ratio is 100:50:150: (12-25) : (5-30) : (50-100). The preparation method is as follows: after epoxy resin, DOPO and tetrabromophthalic anhydride are mixed and react, a component A is obtained; after aromatic diamine, aromatic quaternary amine, aromatic dianhydride and maleic anhydride completely react in a strong-polarity nonprotic organic solvent, an azeotropic dehydrating agent and a catalyst are added, and the polyimide resin liquid, namely, a component B is obtained after an azeotropic dehydration imidization reaction; the component A and the component B are mixed, and the curing agent and the organic solvent are added, and the mixture is uniformly mixed to obtain the high-temperature-resistant matrix resin. The product has excellent overall performance, is suitable for manufacturing an advanced composite material, is particularly suitable for manufacturing the high-Tg copper-clad plate and has a good market prospect.

Description

technical field

[0001] The invention belongs to the field of matrix resins, and in particular relates to a high-Tg copper-clad clad board high-temperature-resistant matrix resin and a preparation method thereof. Background technique

[0002] Copper clad laminate technology and production have experienced more than half a century of development history. Now it has become an important part of basic materials in electronic information products. Copper-clad laminate manufacturing is a sunrise industry, and it has broad prospects along with the development of electronic information and communication industries. Copper clad laminate manufacturing technology is a multidisciplinary technology with high technology. The development of electronics industry technology in the past century shows that copper clad laminate technology is often one of the key aspects to promote the development of the electronics industry. Its progress and development are constantly driven by the innovation...