Halogen-free flame-retardant polyimide resin composition and prepreg and laminate made with same

A technology of polyimide resin and resin composition, applied in the direction of layered products, metal layered products, chemical instruments and methods, etc., can solve the problem of low heat resistance of bisphenol A epoxy resin, bismaleyl Improve the heat resistance of the imine resin composition and other problems, and achieve the effects of excellent dielectric properties, good toughness, strong peeling and high toughness

Active Publication Date: 2015-09-02
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For example, Chinese invention patent 201010270929.8 discloses a method of preparing flame-retardant resin by reacting DOPO with BMI and allyl compounds, which has a good flame-retardant effect, but the storage stability of the prepolymer and the toughness of the cured product Still need to improve
In addition, Chinese invention patent 201110239153.8 discloses a halogen-free phosphorus-contai

Method used

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  • Halogen-free flame-retardant polyimide resin composition and prepreg and laminate made with same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Take 100g of 4,4'-diphenylmethane bismaleimide, 70g of diallyl bisphenol A diglycidyl ether (epoxy equivalent 256g / eq), and 20g of phosphorus-containing compound (A) into a 500mL reaction bottle In the process, use an oil bath to slowly heat to 120-160° C. and keep stirring for 30 minutes to obtain a halogen-free flame-retardant polyimide resin composition. After the reaction is completed, cool to room temperature.

Embodiment 2

[0044] Take 30g of 4,4'-diphenyl ether bismaleimide, 90g of 4,4'-diphenylmethane bismaleimide, 40g of diallyl bisphenol A, diallyl bisphenol A di Put 20g of glycidyl ether (epoxy equivalent 220g / eq), 23g of phosphorus-containing compound (A) into a 500mL reaction bottle, heat slowly to 120-160°C in an oil bath and keep stirring for 50min to obtain a halogen-free flame retardant The polyimide resin composition is cooled to room temperature after the completion of the reaction.

Embodiment 3

[0046] Get 4,4'-diphenyl ether bismaleimide 125g, allyl phenoxy resin 20g, diallyl bisphenol A diglycidyl ether 50g (epoxy equivalent 215g / eq), phosphorus compound ( B) 30g was put into a 500mL reaction bottle, slowly heated to 120-160°C using an oil bath and kept stirring for 60min to obtain a halogen-free flame-retardant polyimide resin composition, which was cooled to room temperature after the reaction was completed.

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Abstract

The invention discloses a halogen-free flame-retardant polyimide resin composition, comprising, by weight, bismaleimide a, composite allyl compound b, and phosphorous compound c. A preparing method of the halogen-free flame-retardant polyimide resin composition includes: heating the bismaleimide, the composite allyl compound and the phosphorous compound in a reaction flask for reaction, with the composite allyl compound being composed of first allyl compound and second allyl compound. The first allyl compound is made from one or any of diallyl bisphenol A, diallyl bisphenol S, allyl phenoxy resin, and diallyl diphenyl ether. The second allyl compound is made from one or any of diallyl bisphenol A diglycidyl ether, diallyl bisphenol S diglycidyl ether, diallyl diphenyl ether diglycidyl ether. A laminate made from the halogen-free flame-retardant polyimide resin composition has the advantages of high resistance, high toughness, low water absorption rate, and excellent dielectric property and flame retardance.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a halogen-free flame-retardant polyimide resin composition and a prepreg and a laminate made by using the composition. Background technique [0002] With the development of high-functionality, high-performance, high-reliability and environmental protection of electronic components, the heat resistance of the plate must be improved to meet the harsh processing technology of lead-free soldering and multiple pressing. The traditional FR-4 The heat resistance of the material is far from meeting the requirements. [0003] Bismaleimide resin is a kind of compound with dual active end groups, which can be cross-linked and cured under the action of heating or catalyst, and has excellent heat resistance, heat and humidity resistance, dielectric properties, good mechanical properties and Dimensional stability, so it is widely used in many high-tech fields such as aerospace, ele...

Claims

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Application Information

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IPC IPC(8): C08G73/12C08L79/08C08L61/14C08L71/08C08K5/5399C08K5/5313B32B15/20B32B15/08
Inventor 季立富谌香秀戴善凯黄荣辉崔春梅
Owner SHENGYI TECH SUZHOU
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