The application discloses a high-thermal-stability shape memory bionic adhesion structure and a preparation method, and belongs to the technical field of bionic adhesion structures. The structure uses m-xylylenediamine (MXDA) with a
benzene ring as a curing agent of an
epoxy resin
monomer, selects
bisphenol A
diglycidyl ether (DGEBA) with a purity of greater than or equal to 85% as an
epoxy monomer, and selects n-octylamine (OA) as an
active agent to promote the reaction between MXDA and DGEBA. A
microstructure template is prepared by a deep
silicon etching method, and a cylindrical
microstructure is prepared on the surface of the
epoxy resin, so that the structure has the characteristics of
high adhesion, relatively low pre-pressure,
high adhesion-pressure ratio and high switching ratio. The adhesion performance of a traditional epoxy-based shape memory bionic adhesion structure is improved, and the
transition temperature of the bionic adhesion structure is significantly improved, so that the application scenarios of the shape memory bionic adhesion structure are expanded.