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Thermosetting resin composition, and prepreg and laminated board made from thermosetting resin composition

A technology of resin composition and prepreg, which is applied in the direction of synthetic resin layered products, lamination, lamination equipment, etc., can solve the problems of heat resistance, water absorption, dielectric properties, flammability, toughness, etc., to achieve peeling The effect of high strength, good solubility and high toughness

Active Publication Date: 2015-08-26
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, commonly used allyl compounds, such as allyl bisphenol A, allyl bisphenol S, phenolic allyl novolac, allyl phenol oxygen, allyl aralkyl phenol, etc., however, with These allyl compound-modified bismaleimide resins tend to lose the other in terms of heat resistance, water absorption, dielectric properties, flammability, and toughness.

Method used

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  • Thermosetting resin composition, and prepreg and laminated board made from thermosetting resin composition
  • Thermosetting resin composition, and prepreg and laminated board made from thermosetting resin composition
  • Thermosetting resin composition, and prepreg and laminated board made from thermosetting resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Take 100g of 4,4'-diphenylmethane bismaleimide, 70g of diallyl bisphenol A diglycidyl ether (epoxy equivalent 256g / eq) into a 500mL reaction bottle, and slowly heat to React at 155°C for 30 minutes while maintaining stirring. After the reaction is completed, cool to room temperature to obtain a modified bismaleimide prepolymer.

[0045]Add an appropriate amount of acetone to dissolve, stir and mix evenly to obtain a glue solution with a solid content of 62%, impregnate the above glue solution with E glass fiber cloth, and bake in an oven at 160°C for 5 minutes to prepare a prepreg.

[0046] Overlay 8 pieces of the above-mentioned semi-cured sheets with burrs removed, attach 35 micron copper foil up and down, and place them in a vacuum hot press to press to obtain a copper-clad laminate. The specific pressing process is pressing at a pressure of 1.5Mpa and a temperature of 220° C. for 4 hours. The properties of the obtained copper-clad laminates are shown in Table 1.

Embodiment 2

[0048] Take 30g of 4,4'-diphenyl ether bismaleimide, 70g of 4,4'-diphenylmethane bismaleimide, 50g of diallyl bisphenol A, diallyl bisphenol A di Put 50g of glycidyl ether (epoxy equivalent 220g / eq) into a 500mL reaction flask, heat slowly to 140°C using an oil bath and keep stirring for 50min, cool to room temperature after the reaction is complete, and obtain modified bismaleimide Amine prepolymers.

[0049] Add an appropriate amount of acetone to dissolve, stir and mix evenly to obtain a glue with a solid content of 62%.

[0050] The preparation methods of the prepreg and the copper-clad laminate are the same as in the first embodiment.

[0051] The properties of the obtained copper-clad laminates are shown in Table 1.

Embodiment 3

[0053] Take 100g of 4,4'-diphenyl ether bismaleimide, 40g of allyl phenoxy resin, 50g of diallyl bisphenol S diglycidyl ether (epoxy equivalent 215g / eq) into a 500mL reaction bottle , using an oil bath to slowly heat to 140° C. and keep stirring for 60 minutes. After the reaction is completed, cool to room temperature to obtain a modified bismaleimide prepolymer.

[0054] Add an appropriate amount of acetone to dissolve, and after the dissolution is complete, add 23 parts of cyclic phenoxyphosphazene compound (FP-100, Fushimi Pharmaceutical Co., Ltd), stir and mix evenly to obtain a glue with a solid content of 62%.

[0055] The preparation methods of the prepreg and the copper-clad laminate are the same as in the first embodiment.

[0056] The properties of the obtained copper-clad laminates are shown in Table 1.

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Abstract

The invention discloses a thermosetting resin composition. The thermosetting resin composition comprises the following solids by weight: (a) a modified bismaleimide prepolymer, (b) a curing accelerator, (c) a fire retardant, and (d) inorganic fillers. A preparation method of the modified bismaleimide prepolymer comprises the following step: heating bismaleimide and a composite allyl compound in a reaction bottle, wherein the composite allyl compound is composed of a first-class allyl compound and a second-class allyl compound, the first-class allyl compound is selected from one or more of diallyl bisphenol A, diallyl bisphenol S, allyl phenoxy resin and diallyl diphenyl ether, and the second-class allyl compound is selected from one or more of diallyl bisphenol A diglycidyl ether, diallyl bisphenol S diglycidyl ether and diallyl diphenyl ether diglycidyl ether. A laminated board integrates high heat resistance, high toughness, low water absorption, excellent dielectric property and good fire resistance.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a thermosetting resin composition, a prepreg and a laminate made by using the composition. Background technique [0002] With the development of high-functionality, high-performance, high-reliability and environmental protection of electronic components, the heat resistance of the plate must be improved to meet the harsh processing technology of lead-free soldering and multiple pressing. The traditional FR-4 The heat resistance of the material is far from meeting the requirements. [0003] Bismaleimide resin is a kind of compound with dual active end groups, which can be cross-linked and cured under the action of heating or catalyst, and has excellent heat resistance, heat and humidity resistance, dielectric properties, good mechanical properties and Dimensional stability, so it is widely used in many high-tech fields such as aerospace, electronic appliances, transpor...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08K5/5399C08K5/50C08K3/36C08K9/06C08G73/10B32B27/04B32B27/28B32B27/18B32B15/08B32B15/20B32B37/06
CPCB32B15/08B32B15/20B32B27/00B32B27/18B32B27/281B32B2260/046B32B2307/306B32B2307/3065C08G73/10C08K3/36C08K5/50C08K5/5399C08K9/06C08L2201/02C08L2201/08C08L2203/20C08L79/08
Inventor 季立富谌香秀戴善凯黄荣辉崔春梅
Owner SHENGYI TECH SUZHOU
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