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Resin composition and preparation method thereof

A technology of resin composition and epoxy resin, applied in chemical instruments and methods, synthetic resin layered products, layered products, etc., can solve the problem of high brittleness of cured products, unsatisfactory bismaleimide performance, limitations, etc. problems, to achieve the effect of improving processing operability, good solubility, and long storage period

Active Publication Date: 2012-10-10
汕头超声覆铜板科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the melting point of bismaleimide is as high as 150 ° C, and it can only be dissolved in strong polar solvents, and its cured product is brittle, which greatly limits its application, so it must be modified
However, the performance of the modified bismaleimide is still not ideal

Method used

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  • Resin composition and preparation method thereof
  • Resin composition and preparation method thereof
  • Resin composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] In the present embodiment, the preparation method of resin composition comprises the following steps in sequence:

[0026] (1) By weight, 100 parts of 4,4′-diphenylmethane bismaleimide, 43 parts of 2,2′-diallyl bisphenol A and 150 parts of N,N′-dimethyl Formamide is added to the reaction kettle with a stirrer, condenser and thermometer, the stirrer is stirred at a speed of 280 rpm and heated to 130-135°C; then a constant temperature of 130-135°C is maintained, and the stirrer is Stir at a speed of 280 rpm, react for 32 minutes; then stop heating and continue stirring, stop stirring after the temperature of the material in the reactor drops to 23°C, and obtain a modified bismaleimide product;

[0027] (2) Add 258.6 parts of bisphenol A type cyanate, 0.248 parts of cobalt acetylacetonate, 10.24 parts of 4-nonylphenol, 116 parts of N,N′-dimethylformamide and 114 parts of cyclohexanone into the step ( 1) In the obtained modified bismaleimide product, the stirrer was stirred ...

Embodiment 2

[0029] In the present embodiment, the preparation method of resin composition comprises the following steps in sequence:

[0030] (1) By weight, add 100 parts of 4,4'-diphenylmethane bismaleimide, 6.85 parts of diallyl ether and 150 parts of N,N'-dimethylformamide into the mixer with agitator , condensing tube and thermometer, the stirrer is stirred at a speed of 300 rpm and heated to 130-135°C; then a constant temperature of 130-135°C is maintained, and the stirrer is stirred at a speed of 300 rpm , and reacted for 30 minutes; then stop heating and continue to stir, and stop stirring after the temperature of the material in the reactor drops to 23° C. to obtain a modified bismaleimide product;

[0031] (2) Add 103.3 parts of dicyclopentadiene cyanate, 0.015 parts of zinc isooctanoate, 2.96 parts of 4-cinnamon phenol and 82 parts of N,N'-dimethylformamide to the modified product obtained in step (1). In the bismaleimide product, the stirrer stirred for 30 minutes at a speed o...

Embodiment 3

[0033] In the present embodiment, the preparation method of resin composition comprises the following steps in sequence:

[0034] (1) By weight, add 100 parts of N,N'-m-phenylene bismaleimide, 50 parts of 2-allylphenol and 150 parts of N,N'-dimethylformamide with stirring In the reactor, condenser and thermometer, the stirrer is stirred at a speed of 250 rpm and heated to 140-145°C; Stir and react for 35 minutes; then stop heating and continue to stir, and stop stirring after the temperature of the material in the reactor drops to 25°C to obtain a modified bismaleimide product;

[0035] (2) Add 259.4 parts of bisphenol A cyanate, 0.322 parts of cobalt isooctanoate, 9.89 parts of 4-cinnamon phenol, 140 parts of N,N'-dimethylformamide and 124 parts of acetone to step (1) to obtain In the modified bismaleimide product, the agitator stirred for 40 minutes at a speed of 1500 rpm; then added 81 parts of dicyclopentadiene phenolic epoxy resins, stirred for 30 minutes, and the stirri...

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Abstract

A resin composition is made of, by weight, 100 parts of bismaleimide, 1-50 parts of allyl compound, 100-300 parts of cyanate ester, 0.01-0.4 part of catalysts, 2-12 parts of unit phenol, 70-150 parts of halogen-free epoxy resin, 15-20 parts of flame retardant, 120-300 parts of inorganic filler, 0.5-4 parts of coupling agent and 200-450 parts of solvent. Bismaleimide is modified by the allyl compound, the halogen-free epoxy resin and the cyanate ester, the modified bismaleimide is fine in dissolubility, the resin composition is low in viscosity, and solidified products of the resin composition have fine toughness and thermal stability. The vitrification transformation temperature of copper-clad plates made of the resin composition can reach 190-220 DEG C, Z-axial thermal expansion coefficient satisfies that a1 is equal to or smaller than 30ppm / DEG C and a2 is equal to or smaller than 160ppm / DEG C, and the requirements of IC (integrated circuit) packaging carrier plate substrates can be met.

Description

technical field [0001] The invention relates to the field of composite materials, in particular to a resin composition and a preparation method thereof, and the resin composition can be used for manufacturing copper clad laminates. Background technique [0002] Under the trend of multi-functionalization, high I / O count and miniaturization of electronic products, IC packaging technology has also changed accordingly. IC packaging technology has developed from the earliest through-hole insertion (PTH Insertion) method to the surface mount (SMT) method, and now it is mainly packaged by BGA, CSP and Flip Chip. The carrier board industry and the printed circuit board (PCB) two industries have put forward higher and higher requirements. [0003] Common substrate resins for IC packaging substrates include polyimide, polyphenylene ether, bismaleimide-triazine resin (BT resin), and high heat-resistant epoxy resin. Bismaleimide (BMI for short) is a kind of resin system derived from p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/04C08L79/08C08L63/00C08G73/06C08G73/12C08G59/40C08G59/62B32B15/08B32B27/04H01L23/14
Inventor 李柳斌郭瑞珂邓瑞景
Owner 汕头超声覆铜板科技有限公司
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