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Glue solution for copper-clad substrate, and preparation method thereof

A technology of copper-clad substrate and glue, which is applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problem of heat resistance decline, low dielectric property flame retardancy, glass transition temperature reduction, etc. problem, to achieve the effect of low raw material cost and easy processing

Active Publication Date: 2012-01-04
VENTEC ELECTRONICS SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The obtained modified bismaleimide resin has high temperature resistance (200-280°C), low dielectric properties and excellent flame retardancy, and can be prepared with epoxy resin and curing agent to produce VO grade Flame-retardant copper-clad laminates, but due to the introduction of epoxy resin, the heat resistance of copper-clad laminates is significantly lower than that of a single modified bismaleimide resin, which is reflected in the glass transition temperature of copper-clad laminates. The increase in the amount of oxygen resin decreases, so that the heat resistance of the copper-clad laminate cannot exceed 250°C under the premise of ensuring VO-level flame retardancy

Method used

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  • Glue solution for copper-clad substrate, and preparation method thereof
  • Glue solution for copper-clad substrate, and preparation method thereof
  • Glue solution for copper-clad substrate, and preparation method thereof

Examples

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Effect test

Embodiment 1

[0022] According to the glue solution of this embodiment, its raw material formula is as follows: 100g of 4,4'-diphenylmethane bismaleimide; 50g of diallyl bisphenol A; 30g of decabromodiphenyl ether; 2-methylimidazole 0.06g; aluminum hydroxide 10g; butanone 15g.

[0023] The preparation process of the glue is as follows: Take 100g of 4,4'-diphenylmethane bismaleimide and 50g of diallyl bisphenol A, put them into a 500ml container, and react at 130°C for about 60min, after cooling Add appropriate amount of butanone to dissolve. After the resin is completely dissolved, add 30g of decabromodiphenyl ether, 0.06g of 2-methylimidazole, 10g of aluminum hydroxide, and finally add the remaining amount of methyl ethyl ketone, and stir evenly to obtain the glue.

Embodiment 2

[0025] According to the glue solution of this embodiment, its raw material formula is as follows: 100 g of 4,4'-diphenyl ether bismaleimide; 50 g of diallyl bisphenol A; 20 g of decabromodiphenyl ether; 2-methylimidazole 0.06g; aluminum hydroxide 15g; butanone 15g.

[0026] The preparation process of the glue solution is as follows: Take 100g of 4,4'-diphenyl ether bismaleimide and 40g of diallyl bisphenol A, put them into a 500ml container, react at 130°C for 60min, and add after cooling Appropriate amount of methyl ethyl ketone dissolved. After the resin is completely dissolved, add 20g of decabromodiphenyl ether, 0.06g of 2-methylimidazole, 15g of aluminum hydroxide, and finally add the remaining methyl ethyl ketone, stir evenly to obtain the glue.

Embodiment 3

[0028] According to the glue solution of this embodiment, its raw material formula is as follows: 100g of 4,4'-diphenylisopropylbismaleimide; 60g of diallyl bisphenol A; 15g of decabromodiphenyl ether; 0.05 g of imidazole; 20 g of aluminum hydroxide; 15 g of butanone.

[0029] The preparation process of the glue solution is as follows: Take 100g of 4,4'-diphenylisopropylbismaleimide and 60g of diallyl bisphenol A, put them into a 500ml container, react at 130°C for 60min, and wait for cooling Then add appropriate amount of butanone to dissolve. After the resin is completely dissolved, add 15g of decabromodiphenylethane, 0.05g of 2-methylimidazole, 20g of aluminum hydroxide, and finally add the remaining methyl ethyl ketone, stir evenly to obtain the glue.

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Abstract

The invention relates to a glue solution for copper-clad substrate, and a preparation method thereof. A raw material formula of the glue solution comprises, by weight, 100 parts of bismaleimide resin, 30-100 parts of an allyl compound, 5-100 parts of decabromodiphenyl oxide or decabromodiphenylethane or a composition comprising the decabromodiphenyl oxide and the decabromodiphenylethane, 0-6 parts of a curing accelerator, 0-30 parts of an inorganic filler and 10-60 parts of a solvent. The preparation method for the glue solution comprises: weighing the bismaleimide resin and the allyl compound according to the formula; carrying out the reaction for 10-150 min at a temperature of 110-180 DEG C; cooling to the room temperature after the reaction is completed; adding the partial solvent to dissolve all the resin; adding the flame retardant, the curing accelerator, the inorganic filler and the residual solvent according to the use amount in the formula; uniformly stirring to obtain the glue solution. With adopting the glue solution provided by the present invention, the copper-clad substrate has the combination of excellent heat resistance, excellent electrical property and excellentflame retardance, is applicable for preparing the multi-layer printed circuit board, and is easy to be subjected to PCB processing.

Description

technical field [0001] The invention belongs to the technical field of preparation of copper-clad laminates for printed circuit boards, and in particular relates to a glue solution for copper-clad substrates and a preparation method thereof. Background technique [0002] Today's society is booming in the direction of electronics, and electronic products have filled our world. With the development of technology and the diversification of application places, various high-tech devices such as mobile phones, cameras, printers, etc. are becoming thinner and smaller. In the direction of development, the printed circuit board (PCB), the key electronic component, is also developing towards thinner and multi-level, thus putting forward higher performance requirements for the copper clad laminate as the PCB substrate, and the specific performance requirements are excellent. Heat resistance, high flame retardancy, low thermal expansion coefficient, low dielectric constant and loss fact...

Claims

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Application Information

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IPC IPC(8): C09J179/08C09J11/06C08G73/12
Inventor 彭代信张建方孙周强
Owner VENTEC ELECTRONICS SUZHOU
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