Halogen-free flame-retardant prepolymer, and prepreg and laminated board made from same

Abstract

The invention discloses a halogen-free flame-retardant prepolymer. The halogen-free flame-retardant prepolymer is prepared through the following methods: heating a phosphorous compound, bismaleimide and an allyl compound in a reaction flask according to a mass ratio of m (phosphorous compound) to m (bismaleimide) to m (allyl compound) to obtain the halogen-free flame-retardant prepolymer, wherein the mass ratio of m (phosphorous compound) to m (bismaleimide) to m (allyl compound) is (1-20):(50-80):(15-50), the total mass of the phosphorous compound, the bismaleimide and the allyl compound is 100 parts, and a structural formula of the phosphorous compound contains a phosphaphenanthrene structure and at least one carboxyl group. A prepreg and a laminated board made from the halogen-free flame-retardant prepolymer have integrated functions of excellent flame retardancy, dielectric property, mechanical property, high heat resistance and Tg, meet requirements on the development of a high-performance printed circuit board material, and can be applied to the fields of integrated circuit packaging, high-frequency high-speed and high-density interconnection and the like.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a halogen-free flame-retardant prepolymer and a prepreg and a laminate made of the same. Background technique [0002] With the development of electronic products towards thinner, higher performance, higher reliability and environmental protection, higher requirements are put forward for the base material of printed circuit boards - copper clad laminates. The specific requirements for copper clad laminate products are: environmental protection and flame retardancy, good processability, high heat resistance / moisture resistance, low dielectric loss and high modulus, etc. The resin matrix is ​​a key factor determining the performance of copper clad laminate composites. As a kind of high-performance resin matrix, bismaleimide resin has the characteristics of high moisture / heat resistance, radiation resistance, high modulus, etc., and is widely used in aerospace, aviation ...

AI Technical Summary

Problems solved by technology

However, the current shortcomings of bismaleimide resin are: poor flame retardancy (UL94V-1 grade), it can only be used in civil electronics and other fields, and its flame retardancy needs to meet the requirements of UL94V-0 grade

[0005] Although the invention patent CN101974156A, the toughness and flame retardancy of bismaleimide resin have been improved and increased, but the mechanical properties of bismaleimide resin decreased significantly after the addition of DOPO, especially the addition of DOPO reduced the resin Interfacial adhesion with glass fiber cloth, thus reducing its mechanical properties interlaminar shear strength and bending properties

And invention patent CN102276837B, although the toughness and the flame retardancy of bismaleimide resin are also improved and increased, yet its heat resistance glass transition temperature (T g ) and dielectric properties are worse than before modification. More importantly, the melting point of cyclic phenoxyphosphazene compound is low, and it will migrate or ooze out during processing (at high temperature). In addition, cyclic phenoxyphosphazene Oxyphosphazene compounds do not react with bismaleimide resins, so their compatibility with bismaleimide resins is poor, thereby affecting their mechanical properties

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