High thermal conductivity polyimide film and preparation method thereof

A technology of polyimide film and polyimide resin, which is applied in the field of high thermal conductivity polyimide film and its preparation, can solve the problem that it is difficult to build high-efficiency heat conduction channels, and the mechanical properties and thermal conductivity of polyimide films are incompatible To solve such problems as achieving good thermal conductivity, good mechanical properties and simple process

Active Publication Date: 2018-10-02
INST OF CHEM CHINESE ACAD OF SCI +1
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  • Abstract
  • Description
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Problems solved by technology

[0005] In view of the above-mentioned analysis, the present invention aims to provide a high thermal conductivity polyimide film and its preparation method, in order to solve the problem that existing doping methods are difficult to build efficient heat conduction channels and polyimide film The problem of incompatibility between mechanical properties and thermal conductivity

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  • High thermal conductivity polyimide film and preparation method thereof

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preparation example Construction

[0041] On the other hand, the present invention also provides a kind of preparation method of high thermal conductivity polyimide film, and this preparation method comprises the following steps:

[0042] Step 1: Disperse the thermally conductive filler in an organic solvent to form a dispersion; mix the above dispersion with the amine reactive monomer of polyamic acid resin A, stir at room temperature for 8-12 hours until completely dissolved, and add polyamic acid resin A The acid anhydride reaction monomer is stirred to form a solution of thermally conductive filler doped polyamic acid resin A;

[0043] Mix the reactive monomers of polyamic acid resin B with an organic solvent, and stir at room temperature for 8-12h to form a solution of polyamic acid resin B;

[0044] Step 2: Mix the solution of thermally conductive filler doped with polyamic acid resin A and the solution of polyamic acid resin B, and stir at room temperature for 0.5-1 h to obtain a mixed solution;

[0045...

Embodiment 1

[0053] First, 1 gram of boron nitride with a particle size of 50 nm was dispersed in 57.68 grams of DMAc by ultrasonic to form a dispersion liquid. In a three-necked flask equipped with mechanical stirring, a nitrogen inlet and outlet, and a thermometer, add 4.8 grams (0.024 moles) of ODA and the above dispersion, stir under nitrogen protection until completely dissolved, then add 5.38 grams (0.024 moles) of CHDA, at room temperature Stir for 12 hours to obtain a boron nitride-doped polyamic acid resin solution A with a solid content of 15 wt.%, and a viscosity of 10000 cP. Similarly, in a three-necked flask equipped with mechanical stirring, nitrogen inlet and outlet, and a thermometer, add 3.52 grams (0.011 moles) of TFDB and 59.1 grams of DMAc, stir under nitrogen protection until completely dissolved, then add 6.91 grams (0.011 moles) of BFDA , stirred at room temperature for 10 hours to obtain a polyamic acid resin solution B with a solid content of 15wt.%, and a viscosit...

Embodiment 2

[0055] First, 2 grams of boron nitride with a particle size of 60 nm was dispersed in 40 grams of DMF by ultrasonic to form a dispersion liquid. In a three-necked flask equipped with mechanical stirring, a nitrogen inlet and outlet, and a thermometer, add 3.6 grams (0.018 moles) of ODA and the above dispersion liquid, stir under nitrogen protection until completely dissolved, then add 6.4 grams (0.018 moles) of DSDA, at room temperature Stir for 10 hours to obtain a boron nitride-doped polyamic acid resin solution A with a solid content of 20 wt.%, and a viscosity of 15000 cP. Similarly, in a three-necked flask equipped with mechanical stirring, nitrogen inlet and outlet, and a thermometer, add 4.19 grams (0.013 moles) of TFDB and 39.85 grams of DMF, stir under nitrogen protection until completely dissolved, then add 5.77 grams (0.013 moles) of 6FDA , stirred at room temperature for 10 hours to obtain a polyamic acid resin solution B with a solid content of 20wt.%, and a visco...

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Abstract

The invention relates to a high thermal conductivity polyimide film and a preparation method thereof and belongs to the technical field of polyimide films. According to the high thermal conductivity polyimide film, the problems that an efficient heat conduction channel is difficulty constructed by an existing doping method at low filling volume of thermal conductive filler and mechanical properties and the thermal conductivity of the polyimide film cannot be simultaneously obtained are solved. The film comprises a polyimide resin A, polyimide resin B and the thermal conductive filler; the thermal conductive filler is dispersed in A phase; a solution interaction parameter difference of polyamic acid resin A and polyamic acid resin B is 2.5 to 5.0; the heat conduction channel of the polyimide film is continuous and is perpendicular to the plane of the film. The preparation method comprises the following steps: preparing a thermal conductive filler solution doped with the polyamic acid resin A and a thermal conductive filler solution doped with the polyamic acid resin B; mixing the two solutions; coating a substrate with the mixed solution; heating in the procedures; carrying out thermal imidization and stripping to obtain the high thermal conductivity polyimide film. The high thermal conductivity polyimide film and the preparation method thereof can be used for insulated heat dissipation of electronic components.

Description

technical field [0001] The invention relates to the technical field of polyimide films, in particular to a polyimide film with high thermal conductivity and a preparation method thereof. Background technique [0002] Due to its outstanding heat resistance, excellent dielectric properties and excellent mechanical properties, polyimide films have been widely used as heat-resistant insulating materials in microelectronics and other fields. However, with the continuous development of electronic products towards miniaturization, thinning, multi-function and high performance, chips in integrated circuits tend to be packaged in high-density and three-dimensional stacked forms. When electronic components in integrated circuits operate at high frequency and high speed, a large amount of heat will inevitably be generated. If the heat dissipation problem cannot be effectively solved, the performance and service life of electronic devices will be directly affected. [0003] The thermal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08K3/38C08J5/18C08G73/10C09K5/14
Inventor 范琳张国栋何民辉翟磊莫松
Owner INST OF CHEM CHINESE ACAD OF SCI
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