3results about How to "Solve the mechanical properties" patented technology

This invention discloses a transition metal phosphide catalyst, its preparation method, and its application, belonging to the field of electrocatalysis technology. The process includes: firstly, dissolving nickel salt, lanthanum salt, urea, and ammonium fluoride in deionized water to synthesize a nickel-lanthanum layered hydroxide nanosheet precursor via a hydrothermal method; secondly, preparing a lanthanum-doped nickel phosphide catalyst using a phosphating reaction; and thirdly, utilizing a lanthanum doping strategy to modulate the electronic structure of nickel phosphide and improve its electrocatalytic reaction performance. This lanthanum-doped nickel phosphide material exhibits good catalytic activity when used to catalyze hydrogen evolution and sulfide ion oxidation reactions. In an integrated two-electrode electrolyzer for sulfide ion oxidation-assisted hydrogen production, it outputs 10 mA cm⁻¹. ‑2 This invention achieves the goal of producing hydrogen and high-value-added sulfur products with low energy consumption by requiring a relatively low voltage of 0.525 V at a current density. It has advantages such as simple preparation process, controllable operating conditions, and low raw material costs, possessing the potential for large-scale production and serving as a high-performance catalyst for electrocatalytic hydrogen production and sulfur ion oxidation reactions.

A biomimetic mother-of-pearl interlocking structure hydrophobic hemp fiber-based radiation cooling membrane and its preparation method are disclosed, belonging to the field of radiation cooling technology. To address the problems of environmentally unfriendly raw materials, high cost, complex preparation processes, and low cooling efficiency in existing radiation cooling materials, this invention provides a preparation technology for a hemp fiber-based biomimetic radiation cooling membrane and a flexible fabric coating. Using industrial hemp recycled fibers as the core green matrix, through synergistic design of material innovation, structural innovation, and process innovation, it comprehensively solves the technical defects of existing radiation cooling materials, providing a new green solution for the large-scale application of radiation cooling technology in multiple scenarios. This radiation cooling membrane, using recycled industrial hemp fibers as the matrix, combines the characteristics of being environmentally friendly, having a biomimetic interlocking structure, and providing high-efficiency radiation cooling. The preparation process is simple and can be mass-produced, meeting the application needs of multiple fields such as building energy conservation, outdoor equipment manufacturing, electronic equipment thermal management, and agricultural greenhouse film control.

This invention relates to the field of electronic materials technology and discloses a low-temperature curing copper-silver composite paste for TGV interconnects and multilayer RDL fabrication and its preparation method. The aim is to address how to suppress the destructive effect of intrinsic copper oxidation on the conductive network during TGV via metallization in an air atmosphere at 200-300°C. This is achieved by using a dense silver layer to coat copper powder to form silver-coated copper composite particles, suppressing the oxidation of the copper core during the heating process. The low-temperature sintering activity of nano-silver powder forms conductive silver bridges before the silver layer dehumidifies, connecting adjacent silver-coated copper particles. A high-temperature resistant resin with a glass transition temperature higher than 260°C after curing is selected as the binder. After curing, the resin is distributed in a discontinuous island-like pattern between the particles, applying compressive stress to enhance contact and simultaneously resisting multilayer wiring processes. The synergistic effect of these three stages allows the sintering reaction to form a stable conductive network in an air atmosphere at 200-300°C, and it is compatible with photosensitive polyimide insulating layers, making it suitable for additive manufacturing of multilayer RDLs for glass via circuit boards.