Resin composition and molded article comprising the same
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- UNITIKA LTD
- Publication Date
- 2011-09-28
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The present invention relates to a resin composition and a molded article formed therefrom, and particularly to a resin composition having melt fluidity during molding and a molded article formed therefrom. Background technique
[0002] Known thermoplastic resins used as raw materials for molding include polypropylene (PP), ABS, polyamide (PA6, PA66, etc.), polyester (PET, PBT, etc.), polycarbonate (PC), liquid crystal poly ester (LCP), polyphenylene sulfide (PPS), etc. These resins are widely used in various electronic devices, electronic parts, mechanical parts, and the like. These thermoplastic resins have improved strength and heat resistance by adding reinforcing fillers such as talc and glass fibers, or have various functions imparted by adding fillers having specific functions.
[0003] Amorphous thermoplastic resins such as polycarbonate resins and ABS resins, which are excellent in surface appearance and low warpage of molded products, have ...