Resin composition and molded article comprising the same

A technology of resin composition and compound, which is applied in the field of resin composition and its formed body, can solve the problems of resin composition strength reduction, plasticizer exudation, plasticizer volatilization, etc., and achieve excellent mechanical properties, The effect of excellent melt fluidity

Inactive Publication Date: 2011-09-28
UNITIKA LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when a plasticizer is added, there is a problem that not only the strength of the resin composition is significa

Method used

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  • Resin composition and molded article comprising the same
  • Resin composition and molded article comprising the same
  • Resin composition and molded article comprising the same

Examples

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Embodiment

[0081] Hereinafter, the present invention will be specifically described based on examples. However, the present invention is not limited to these Examples.

[0082] In the following examples and comparative examples, the test methods for various physical property values ​​are as follows.

[0083] [1] MFR (melt index):

[0084] The pellets of the thermoplastic resin composition were measured for their MFR value at a predetermined load and a predetermined temperature using a falling flow meter (manufactured by Toyo Seiki Seisakusho). In this case, a fine hole die having a diameter of 1 mm x a length of 10 mm was used.

[0085] [2] Bending strength, bending modulus of elasticity:

[0086] Measurement was performed based on the method described in ASTM standard D-790.

[0087] [3] Impact strength:

[0088] Izod impact strength was measured using a notched test piece according to the method described in ASTM standard D-256.

[0089] [4] Thermal conductivity:

[0090] The ca...

manufacture example 1

[0137] ·Manufacturing example 1 (C21)

[0138] Dimer acid (manufactured by Tsukino Food Industry Co., Ltd., hydrogen-free) / 1,3-bis(aminomethyl)benzene=46.5 / 53.5 (molar ratio) ratio of raw materials was charged into the reaction tank, at 240°C , and let it react for 2 hours. After the reaction, it was taken out and cut to obtain dimer acid base polyamide resin particles. The resulting pellets had a melt index (MFR) of 1800 g / min at 230° C. and 21.18 N.

manufacture example 2

[0139] ·Manufacturing example 2 (C22)

[0140] Dimer acid (produced by Tsukino Food Industry Co., Ltd., without hydrogen addition) / 65.3% hexamethylenediamine aqueous solution / caprolactam = 10.3 / 7.3 / 82.4 (molar ratio) Raw materials were charged into the reaction tank, and the reaction tank was heated at 250° C. , and let it react for 2 hours. After the reaction, it was taken out and cut to obtain dimer acid base polyamide resin particles. The resulting pellets had a melt index (MFR) of 1300 g / min at 230° C. and 21.18 N.

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Abstract

Provided is a resin composition comprising a thermoplastic resin (A), a filler (B), and a predetermined amount of a melt viscosity reducing agent (C). The melt viscosity reducing agent (C) used in a predetermined amount is either the following (a) or (b): (a) The melt viscosity reducing agent (C) is a polyfunctional allyl compound (C1), and the content of polyfunctional allyl compound (C1) with respect to a total of 100 parts by mass of the thermoplastic resin (A) and filler (B) is 3 to 20 parts by mass, or (b) the melt viscosity reducing agent (C) is a dimer acid-based thermoplastic resin (C2), and the content of the dimer acid-based thermoplastic resin (C2) with respect to a total of 100 parts by volume of the thermoplastic resin (A) and filler (B) is 10 to 45 parts by volume.

Description

technical field [0001] The present invention relates to a resin composition and a molded article formed therefrom, and particularly to a resin composition having melt fluidity during molding and a molded article formed therefrom. Background technique [0002] Known thermoplastic resins used as raw materials for molding include polypropylene (PP), ABS, polyamide (PA6, PA66, etc.), polyester (PET, PBT, etc.), polycarbonate (PC), liquid crystal poly ester (LCP), polyphenylene sulfide (PPS), etc. These resins are widely used in various electronic devices, electronic parts, mechanical parts, and the like. These thermoplastic resins have improved strength and heat resistance by adding reinforcing fillers such as talc and glass fibers, or have various functions imparted by adding fillers having specific functions. [0003] Amorphous thermoplastic resins such as polycarbonate resins and ABS resins, which are excellent in surface appearance and low warpage of molded products, have ...

Claims

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Application Information

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IPC IPC(8): C08L67/06C08K5/3492C08L101/00C08K5/16C08K3/26C08K3/22C08L77/08C08K3/38C08J7/00C08K3/04C08K7/06C08L77/00C08J3/28C08L23/10C08L67/00
CPCC08K5/34924C08K7/06C08L77/08C08L77/00C08L2205/02
Inventor 伊藤显正铸夕哉古川干夫
Owner UNITIKA LTD
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