Modified bismaleimide resin prepolymer and preparation method thereof

A technology of bismaleimide resin and bismaleimide, which is applied in the field of modified bismaleimide resin prepolymer for prepreg and its preparation, can solve the problem of small elongation at break, Poor performance and toughness, high cross-linking density, etc., to achieve moderate melt viscosity, improve mechanical properties, and improve process performance

Inactive Publication Date: 2017-12-12
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

BMI has short double bond spacing, high crosslinking density, dense cured product structure, few defects, high strength and modulus, good high temperature resistance, radiation resistance, heat and humidity resistance, low moisture absorption rate and small thermal expansion coefficient. It overcomes the disadvantages of relatively low heat resistance of epoxy resin, high molding temperature and high pressure of high temperature resistant polyimide resin
[0003] However, due to the high cross-linking density and high rigidity of the molecular chain of the bismaleimide resin cured product, it exhibits greater brittleness, which is manifested as defects such as poor impact resistance, low elongation at break and low fracture toughness. Become the key to restrict the application and development of BMI resin
In addition, the performance and toughness of the prepreg prepared by BMI resin are poor, and it neither has the film-forming conditions nor can meet the toughness requirements of the resin film. Therefore, the modification of the film-forming process and the toughening modification are the key improvements. technology

Method used

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  • Modified bismaleimide resin prepolymer and preparation method thereof
  • Modified bismaleimide resin prepolymer and preparation method thereof
  • Modified bismaleimide resin prepolymer and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A kind of modified bismaleimide resin prepolymer, its preparation method comprises the steps:

[0030] Weigh 43g of diallyl bisphenol A and put it in a three-necked flask, heat up to 130°C under oil bath and stirring conditions, then add 100g of diphenylmethane bismaleimide to react for 35min, cool down to 120°C Add 25g m-aminophenylacetylene, after the bismaleimide dissolves to obtain a uniform transparent mixed solution, time the reaction for 30 minutes, then add 32g bisphenol A-aniline benzoxazine and 6g 2-ethyl-4-methyl After the imidazole was stirred for 15 minutes to mix evenly, the reaction was stopped, and the reaction was quickly removed to obtain a dark reddish-brown uniform and transparent modified bismaleimide resin prepolymer.

[0031] The modified bismaleimide resin prepolymer obtained in this example was defoamed in a vacuum oven at 115°C for 45 minutes, and then placed in a blast oven for heating and curing to obtain a cured product of the modified bisma...

Embodiment 2

[0035] A kind of modified bismaleimide resin prepolymer, its preparation method comprises the steps:

[0036] Weigh 65g of diallyl bisphenol A and 16g of p-aminophenylacetylene into a three-necked flask, heat up to 120°C under oil bath and stirring conditions, then add 100g of diphenylmethane bismaleimide, wait After dissolving the bismaleimide to obtain a homogeneous transparent mixture, time the reaction for 40 minutes, then add 64g of bisphenol A-aniline benzoxazine and 7g of 2-ethyl-4-methylimidazole, stir for 15 minutes and stop React and remove quickly to obtain dark reddish-brown uniform and transparent modified bismaleimide resin prepolymer.

[0037] The modified bismaleimide resin prepolymer obtained in this example was defoamed in a vacuum oven at 115°C for 45 minutes, and then placed in a blast oven for heating and curing to obtain a cured product of the modified bismaleimide resin. The curing system is carried out in sequence as follows: heating at 140°C for 2h, h...

Embodiment 3

[0041] A kind of modified bismaleimide resin prepolymer, its preparation method comprises the steps:

[0042]Weigh 22g of diallyl bisphenol A and 29g of o-diallyl bisphenol A diglycidyl ether into a three-necked flask, heat up to 130°C under oil bath and stirring conditions, and then add 100g of diphenylmethane Bismaleimide, react for 40 minutes, cool down to 120°C, add 16g of m-aminophenylacetylene to dissolve the bismaleimide to obtain a homogeneous transparent mixture, then react for 15 minutes by time, then add 90g of bisphenol A-aniline benzo Oxazine and 8 g of 2-methylimidazole were stirred for 15 minutes to stop the reaction and then removed quickly to obtain a dark reddish-brown uniform and transparent modified bismaleimide resin prepolymer.

[0043] The modified bismaleimide resin prepolymer obtained in this example was defoamed in a vacuum oven at 115°C for 45 minutes, and then placed in a blast oven for heating and curing to obtain a cured product of the modified bi...

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Abstract

The invention provides a modified bismaleimide resin prepolymer. Bismaleimide is subjected to copolymerization, chain extension and toughening modification by a melting polymerization process and by using an allyl compound, aminophenylacetylene and benzoxazine; the obtained modified bismaleimide resin prepolymer has excellent processing property while maintaining high heat resistance of the bismaleimide, and can greatly improve the mechanical property; furthermore, the prepolymer is moderate in melt viscosity, low in volatile component, high in paving and covering property, long in storage period and low in cost, and is an ideal adhesive film material for prepreg; and the modified bismaleimide resin prepolymer can serve as matrix resin of a composite material, a high-temperature-resistant adhesive, an electronic appliance copper-clad plate insulating material and the like, and is applicable in the technical fields of aerospace, electronic appliances, traffic and transportation and the like.

Description

technical field [0001] The invention relates to the field of bismaleimide resin composite materials, in particular to a modified bismaleimide resin prepolymer for prepreg and a preparation method thereof. Background technique [0002] Bismaleimide (BMI) was successfully developed and commercialized by the French Rhone-Planck company in the late 1960s. BMI has short double bond spacing, high crosslinking density, dense cured product structure, few defects, high strength and modulus, good high temperature resistance, radiation resistance, heat and humidity resistance, low moisture absorption rate and small thermal expansion coefficient. It overcomes the shortcomings of relatively low heat resistance of epoxy resin, high molding temperature and high pressure of high temperature resistant polyimide resin. [0003] However, due to the high cross-linking density and high rigidity of the molecular chain of the bismaleimide resin cured product, it exhibits greater brittleness, whic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/12
CPCC08G73/126
Inventor 王翔周如金王钧段华军杨小利安显刘传奇
Owner WUHAN UNIV OF TECH
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