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High toughness and high and low temperature resistant bismaleimide resin prepolymer and preparation method thereof

The technology of bismaleimide resin and bismaleimide is applied in the field of high toughness, high and low temperature resistant bismaleimide resin prepolymer and its preparation, and can solve the peak temperature of resin thermal decomposition of 800°C The thermal performance parameters such as carbon residue rate are low, and the toughness is decreased, so as to achieve the effect of improving the mechanical strength, improving the toughness and improving the toughness.

Inactive Publication Date: 2019-06-25
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the amount of bismaleimide added is small, the thermal performance parameters such as the thermal decomposition peak temperature of the resin and the carbon residue rate at 800°C are still low, and it cannot be used for a long time at a higher temperature
When the amount of bismaleimide is added more, there will be problems such as a decrease in toughness

Method used

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  • High toughness and high and low temperature resistant bismaleimide resin prepolymer and preparation method thereof
  • High toughness and high and low temperature resistant bismaleimide resin prepolymer and preparation method thereof
  • High toughness and high and low temperature resistant bismaleimide resin prepolymer and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A high toughness high and low temperature resistant bismaleimide resin prepolymer, the specific preparation method is as follows:

[0036]Prepare a 500ml three-necked flask with a thermometer and mechanical stirring, first add 45g of diallyl bisphenol A and 60g of diallyl bisphenol A diglycidyl ether (epoxy value 0.39), heat to 130°C, then add 100g Diphenylmethane bismaleimide was reacted for 40 minutes, then the temperature of the reaction system was lowered to 110°C, 40 g of methyl hexahydrophthalic anhydride was added, and the reaction was carried out at constant temperature until a uniform and transparent mixture was obtained. - Stir 4-methylimidazole for 10 minutes to disperse the accelerator uniformly in the system, stop heating to obtain a high toughness high and low temperature resistant bismaleimide resin prepolymer. The resin prepolymer is a brown-red viscous liquid at room temperature.

[0037] The resin prepolymer obtained in this example has good solubilit...

Embodiment 2

[0044] A high toughness high and low temperature resistant bismaleimide resin prepolymer, the specific preparation method is as follows:

[0045] Prepare a 500ml three-necked flask with a thermometer and mechanical stirring, first add 65g of diallyl bisphenol A and 30g of diallyl bisphenol A diglycidyl ether, heat to 140°C, then add 100g of diphenylmethane bismaleyl Imine, stirred and reacted at constant temperature for 10 minutes, then cooled the reaction system to 120°C, added 15g of methyl hexahydrophthalic anhydride, reacted at constant temperature until the resin system was completely dissolved and uniform, then kept the temperature for 10 minutes, and then added 3g of 2-ethyl-4-methyl The imidazole was stirred for 5 minutes to disperse the accelerator uniformly in the system, and the heating was stopped to obtain a modified bismaleimide resin prepolymer. The resin prepolymer is a brown-red viscous liquid at room temperature.

[0046] The modified bismaleimide resin prep...

Embodiment 3

[0052] A high toughness high and low temperature resistant bismaleimide resin prepolymer, the specific preparation method is as follows:

[0053] Prepare a 500ml three-necked flask with a thermometer and mechanical stirring, first add 45g of diallyl bisphenol A and 60g of diallyl bisphenol A diglycidyl ether, heat to 130°C and then add 100g of diphenylmethane bismaleimide Amine, stirred and reacted at constant temperature for 60 minutes, then cooled the reaction system to 100°C, added 30g of methyl hexahydrophthalic anhydride, reacted at constant temperature until the system was completely dissolved and uniform, then kept the temperature for 10 minutes, added 3g of 2-ethyl-4-methylimidazole and stirred After 5 minutes, the accelerator is uniformly dispersed in the system, and the heating is stopped to obtain a modified bismaleimide resin prepolymer. The resin prepolymer is a brown-red viscous liquid at room temperature.

[0054] The modified bismaleimide resin prepolymer obta...

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Abstract

The invention relates to a high toughness and high and low temperature resistant bismaleimide resin prepolymer and a preparation method thereof. The prepolymer comprises the following raw materials bymass: 100 parts of bismaleimide, 40-65 parts of an allyl compound, 30-60 parts of diallyl bisphenol A diglycidyl ether, 15-40 parts of acid anhydride, and 1-8 parts of a promoter. The high toughnessand high and low temperature resistant bismaleimide resin prepolymer provided by the invention has good solubility, is easily soluble in acetone and other common solvents, and is also suitable for preparation of prepreg by solution process. Also, the prepolymer has the characteristics of moderate melting viscosity, low volatile matters, good spreadability, long storage period, low cost, good heatresistance after curing and good toughness at low temperature, and can adapt to extreme use environments.

Description

technical field [0001] The invention belongs to the technical field of composite materials, and in particular relates to a high-toughness high-low temperature resistant bismaleimide resin prepolymer and a preparation method thereof. Background technique [0002] Bismaleimide (BMI) is prepared by ring-opening nucleophilic substitution reaction between maleic anhydride and diamine, so it is a bifunctional compound with active bridging group R and terminal double bond. BMI has short double-bond spacing, high cross-linking density, dense cured structure, few defects, high strength and modulus, good high temperature resistance, radiation resistance, heat and humidity resistance, low moisture absorption rate and small thermal expansion coefficient. However, due to the regular and symmetrical structure of bismaleimide resin, the cured product often has a high cross-linking density, and the rigidity of the molecular chain makes it more brittle, which is manifested in poor impact res...

Claims

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Application Information

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IPC IPC(8): C08G73/12
Inventor 王翔闫清泉王钧杨小利段华军蔡浩鹏陈黎旋
Owner WUHAN UNIV OF TECH
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