High toughness and high and low temperature resistant bismaleimide resin prepolymer and preparation method thereof

The technology of bismaleimide resin and bismaleimide is applied in the field of high toughness, high and low temperature resistant bismaleimide resin prepolymer and its preparation, and can solve the peak temperature of resin thermal decomposition of 800°C The thermal performance parameters such as carbon residue rate are low, and the toughness is decreased, so as to achieve the effect of improving the mechanical strength, improving the toughness and improving the toughness.

Inactive Publication Date: 2019-06-25
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the amount of bismaleimide added is small, the thermal performance parameters such as the thermal decomposition peak temperature of the resin and the carbon residue rate at 80

Method used

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  • High toughness and high and low temperature resistant bismaleimide resin prepolymer and preparation method thereof
  • High toughness and high and low temperature resistant bismaleimide resin prepolymer and preparation method thereof
  • High toughness and high and low temperature resistant bismaleimide resin prepolymer and preparation method thereof

Examples

Experimental program
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Example Embodiment

[0034] Example 1

[0035] A bismaleimide resin prepolymer with high toughness and high and low temperature resistance, the specific preparation method is as follows:

[0036] A 500ml three-necked flask is equipped with a thermometer and mechanical stirring. First, add 45g of diallyl bisphenol A and 60g of diallyl bisphenol A diglycidyl ether (epoxy value 0.39), heat to 130°C, and then add 100g Diphenylmethane bismaleimide reacts for 40 minutes, then the reaction system is cooled to 110°C, 40g methylhexahydrophthalic anhydride is added, and the reaction is kept at a constant temperature until a homogeneous and transparent mixture is obtained, and then the reaction is kept for 20 minutes, and then 8g 2-ethyl is added Stir the -4-methylimidazole for 10 minutes to make the accelerator uniformly dispersed in the system, and stop heating to obtain a bismaleimide resin prepolymer with high toughness and high and low temperature resistance. The resin prepolymer is brown-red viscous liquid...

Example Embodiment

[0043] Example 2

[0044] A bismaleimide resin prepolymer with high toughness and high and low temperature resistance, the specific preparation method is as follows:

[0045] A 500ml three-necked flask is equipped with a thermometer and mechanical stirring. First add 65g of diallyl bisphenol A and 30g of diallyl bisphenol A diglycidyl ether, heat to 140°C, and then add 100g of diphenylmethane bismaleyl Imine, react with constant temperature stirring for 10min, then cool the reaction system to 120℃, add 15g methylhexahydrophthalic anhydride, react at constant temperature until the resin system is completely dissolved and homogeneous, then keep the reaction for 10min, then add 3g 2-ethyl-4-methyl Stir the imidazole for 5 minutes to make the accelerator uniformly dispersed in the system, and stop heating to obtain the modified bismaleimide resin prepolymer. The resin prepolymer is brown-red viscous liquid at room temperature.

[0046] The modified bismaleimide resin prepolymer obtaine...

Example Embodiment

[0051] Example 3

[0052] A bismaleimide resin prepolymer with high toughness and high and low temperature resistance, the specific preparation method is as follows:

[0053] A 500ml three-necked flask is equipped with a thermometer and mechanical stirring. First add 45g of diallyl bisphenol A and 60g of diallyl bisphenol A diglycidyl ether, heat to 130°C and then add 100g of diphenylmethane bismaleimide Amine, react with constant temperature stirring for 60min, then cool the reaction system to 100℃, add 30g methylhexahydrophthalic anhydride, react at constant temperature until the system is completely dissolved and uniform, then keep the reaction for 10min, add 3g 2-ethyl-4-methylimidazole and stir 5min to make the accelerator uniformly dispersed in the system, stop heating to obtain modified bismaleimide resin prepolymer. The resin prepolymer is brown-red viscous liquid at room temperature.

[0054] The modified bismaleimide resin prepolymer obtained in this example has good solu...

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Abstract

The invention relates to a high toughness and high and low temperature resistant bismaleimide resin prepolymer and a preparation method thereof. The prepolymer comprises the following raw materials bymass: 100 parts of bismaleimide, 40-65 parts of an allyl compound, 30-60 parts of diallyl bisphenol A diglycidyl ether, 15-40 parts of acid anhydride, and 1-8 parts of a promoter. The high toughnessand high and low temperature resistant bismaleimide resin prepolymer provided by the invention has good solubility, is easily soluble in acetone and other common solvents, and is also suitable for preparation of prepreg by solution process. Also, the prepolymer has the characteristics of moderate melting viscosity, low volatile matters, good spreadability, long storage period, low cost, good heatresistance after curing and good toughness at low temperature, and can adapt to extreme use environments.

Description

technical field [0001] The invention belongs to the technical field of composite materials, and in particular relates to a high-toughness high-low temperature resistant bismaleimide resin prepolymer and a preparation method thereof. Background technique [0002] Bismaleimide (BMI) is prepared by ring-opening nucleophilic substitution reaction between maleic anhydride and diamine, so it is a bifunctional compound with active bridging group R and terminal double bond. BMI has short double-bond spacing, high cross-linking density, dense cured structure, few defects, high strength and modulus, good high temperature resistance, radiation resistance, heat and humidity resistance, low moisture absorption rate and small thermal expansion coefficient. However, due to the regular and symmetrical structure of bismaleimide resin, the cured product often has a high cross-linking density, and the rigidity of the molecular chain makes it more brittle, which is manifested in poor impact res...

Claims

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Application Information

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IPC IPC(8): C08G73/12
Inventor 王翔闫清泉王钧杨小利段华军蔡浩鹏陈黎旋
Owner WUHAN UNIV OF TECH
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