Halogen-free flam retardant prepolymer, preparation method thereof and application of halogen-free flam retardant prepolymer in copper clad laminate (CCL)

Abstract

The invention particularly relates to a halogen-free flame retardant prepolymer, and an application thereof in the manufacture of the copper clad laminate (CCL). The manufacture of the CCL comprises the following steps: taking and reacting the bismaleimides, allyl compound and phosphorus-containing compound for 10 to 120 minutes at the temperature of 80 to 160 DEG C to obtain the halogen-free flame retardant prepolymer; preparing the prepolymer into solution, stirring uniformly the solution to obtain a glue solution, coating the glue solution uniformly on an E-glass fiber cloth with smooth surface, and then baking the E-glass fiber cloth to prepare a B-rank prepreg; and cutting the B-rank prepreg into proper size according to the size of a pressing machine, overlapping a certain amount of prepregs, and pressing the prepregs with a copper foil with the same size on the top and a copper foil with the same size at the bottom in a hot pressing machine to obtain the CCL. The CCL has good flame retardant effect, no release of harmful gases during the burning, and the product after the solidification of the CCL has the advantages of good toughness, higher thermal decomposition temperature and lower dielectric loss.

Description

technical field [0001] The invention specifically relates to a halogen-free flame-retardant prepolymer and the application of the halogen-free flame-retardant prepolymer to prepare copper-clad laminates. Background technique [0002] With the development of electronic products towards thinner, higher performance, higher reliability and environmental protection, higher requirements are put forward for the base material of printed circuit boards - copper clad laminates. The specific requirements for copper clad laminate products are: environmental protection and flame retardancy, good processability, high heat resistance / moisture resistance, low dielectric loss and high modulus, etc. [0003] The resin matrix is ​​a key factor determining the performance of copper clad laminate composites. As a kind of high-performance resin matrix, bismaleimide resin has the characteristics of high moisture / heat resistance, radiation resistance, high modulus, etc., and is widely used in aero...

AI Technical Summary

Problems solved by technology

However, phosphorus-containing resin is added to bismaleimide resin as an additive. If the ratio is improper, it will cause compatibility problems between the two and affect the moisture resistance and adhesion of the product, which cannot meet the requirements of high-performance copper clad laminates.

For the synthetic phosphorus-containing bismaleimide resin, although its flame retardancy has been improved, its brittleness problem has not been solved; The product has high water absorption and poor moisture resistance, which also cannot meet the requirements of high-performance copper clad laminates.

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