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Fluorine-containing low-dielectric-loss bismaleimide resin, and preparation method and application thereof

A technology of bismaleimide resin and bismaleimide, applied in the field of thermosetting resin and its preparation, can solve the problem that bismaleimide resin cannot meet the application requirements

Active Publication Date: 2015-04-01
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Despite these improvements, the existing double-horse resins still cannot meet the needs of the application

Method used

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  • Fluorine-containing low-dielectric-loss bismaleimide resin, and preparation method and application thereof
  • Fluorine-containing low-dielectric-loss bismaleimide resin, and preparation method and application thereof
  • Fluorine-containing low-dielectric-loss bismaleimide resin, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] Add 30g of diallyl bisphenol A to a three-necked flask equipped with a stirrer, a thermometer and a reflux condenser, slowly raise the temperature to 130°C, add 10g of PEI after the temperature stabilizes, and add 60g of 2,2'-bisphenol A after the PEI is dissolved [4-(4-Maleimidophenoxy)phenyl]hexafluoropropane and 20g bisphenol A cyanate, react at a constant temperature of 130°C until the resin system is uniform and transparent, keep the reaction for 30min, and cool down to 80°C 1.5 g of azobisisobutyronitrile was added at ℃, and after stirring for 10 minutes, a modified fluorine-containing bismaleimide resin was obtained, which was an orange-yellow viscous liquid.

Embodiment 2

[0073] Add 42g of hexafluorodiallyl bisphenol A to a three-necked flask equipped with a stirrer, a thermometer and a reflux condenser, slowly raise the temperature to 130°C, add 15g of PEI after the temperature stabilizes, and add 68g of 2,2' after the PEI is dissolved -Bis[4-(4-maleimidophenoxy)phenyl]hexafluoropropane and 20g of bisphenol A cyanate, react at a constant temperature of 130°C until the resin system is uniform and transparent, keep the reaction for 30min, and cool down Add 1.5 g of benzoyl peroxide to 100° C. and stir for 10 minutes to obtain a modified fluorine-containing bismaleimide resin, which is an orange-yellow viscous liquid.

Embodiment 3

[0075] Add 42g of hexafluorodiallyl bisphenol A into a three-necked flask equipped with a stirrer, a thermometer and a reflux condenser, slowly raise the temperature to 130°C, add 15g of PPO after the temperature stabilizes, and add 68g of 2,2' after the PPO is dissolved -Bis[4-(4-maleimidophenoxy)phenyl]hexafluoropropane and 42g cyclopentadiene cyanate, react at a constant temperature of 130°C until the resin system is uniform and transparent, then keep the reaction for 30min, Cool down to 100° C., add 1.5 g of benzoyl peroxide, and stir for 10 minutes to obtain a modified fluorine-containing bismaleimide resin, which is an orange-yellow viscous liquid.

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Abstract

The invention discloses a fluorine-containing low-dielectric-loss bismaleimide resin and a cured resin thereof, and a preparation method and application thereof. The resin is prepared by carrying out blend reaction on the following composition, wherein the composition comprises the following components in parts by weight: 20-120 parts of bismaleimide monomer, 20-120 parts of allyl compound, 20-120 parts of cyanate, 2-20 parts of thermoplastic high molecule and 0.1-1.5 parts of bismaleimide accelerator. At least one of the bismaleimide monomer and allyl compound contains fluorine. The bismaleimide resin disclosed by the invention has excellent heat stability, dielectric properties and mechanical properties, can be used as a high-performance composite material resin matrix, and has application value in the fields of copper clad plates, electronic packaging, aerospace and the like.

Description

technical field [0001] The invention belongs to the technical field of thermosetting resin and its preparation, and in particular relates to a fluorine-containing bismaleimide resin with low dielectric loss and its preparation and application. Background technique [0002] Bismaleimide resin (referred to as "bismaleimide resin") not only has outstanding heat resistance, heat and humidity resistance, mechanical properties and chemical resistance, but also has excellent dielectric properties (dielectric constant is 3.0-3.2, the dielectric loss is about 0.01-0.02). However, with the current development of electronic and electrical products in the direction of high frequency, high power and miniaturization, the properties of materials used in the fields of components, IC chips and PCB substrates have also proposed lower dielectric constants and lower dielectric constants. Electrical losses, higher glass transition temperature requirements. [0003] At present, there are four m...

Claims

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Application Information

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IPC IPC(8): C08G73/12C08L79/08
Inventor 赵彤郭颖韩悦周恒
Owner INST OF CHEM CHINESE ACAD OF SCI
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