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Thermosetting resin composition, prepreg and laminated board

A resin composition and prepreg technology, applied in synthetic resin layered products, lamination, lamination devices, etc., can solve the problem of reducing heat resistance, moisture resistance, thermal expansion coefficient, mechanical properties, dielectric properties, brittleness, and impact on use. performance and other issues, to achieve the effects of low dielectric constant and dielectric loss, excellent moisture and heat resistance and heat resistance, and low thermal expansion coefficient

Active Publication Date: 2011-09-28
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After introducing these components, the flame retardant performance of the board is improved, but these flame retardant resins based on epoxy resin or phenolic resin greatly reduce the heat resistance, moisture resistance, thermal expansion coefficient, mechanical properties, dielectric properties of the system. Electrical properties, etc., cannot meet the application requirements in high-performance fields such as high-density interconnection or integrated circuit packaging
[0004] As a high-performance resin matrix, bismaleimide resin has excellent heat resistance and modulus, but bismaleimide resin has poor solubility and can only be dissolved in some high-boiling point solvents such as N, N- Dimethylformamide, N-methylpyrrolidone, etc., with harsh process conditions
At the same time, the cured product of bismaleimide has high crosslinking density and high brittleness, which seriously affects other performance

Method used

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  • Thermosetting resin composition, prepreg and laminated board
  • Thermosetting resin composition, prepreg and laminated board
  • Thermosetting resin composition, prepreg and laminated board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] According to the method in the synthesis example, react at 130°C for 30 minutes to prepare 4,4'-diphenylmethane bismaleimide resin: 35 g of prepolymer of diallyl bisphenol A=100:30, add an appropriate amount of acetone dissolve. After the modified bismaleimide resin is completely dissolved, add 35g of naphthalene ring epoxy resin (NC-7300, Nippon Kayaku), 15g of bisphenol A cyanate resin (CY-10, Wuqiao Chemical), 15g of phosphorus-containing cyanate resin (structure such as structural formula 1, R=A1), 0.05g of stannous octoate, 60g of spherical silica, 40g of boehmite and an appropriate amount of butanone solvent, stirred and mixed evenly to obtain 60% solid content Glue.

[0054] The glue is dipped and coated on E glass fiber cloth (2116, the unit weight is 104g / m 2 ) and baked in an oven at 135°C for 5 minutes to obtain a prepreg with a resin content of 50%.

[0055] The prepared prepreg with a resin content of 50% was placed with a metal copper foil on the upper ...

Embodiment 2

[0058] According to the method in the synthesis example, react at 130°C for 50min to prepare 4,4'-diphenylmethane bismaleimide resin: 35g of prepolymer of diallyl bisphenol A=100:60, add an appropriate amount of acetone dissolve. After the modified bismaleimide resin is completely dissolved, add 35g of biphenyl type epoxy resin (NC-3000, Nippon Kayaku), 10g of dicyclopentadiene type cyanate resin (CY-3, Wuqiao Chemical) , 20g of phosphorus cyanate resin (structure such as structural formula 3, R=C2), 0.05g of stannous octoate, 60g of spherical silica, 40g of boehmite and an appropriate amount of methyl ethyl ketone solvent, stir and mix evenly to obtain a solid content of 60% glue.

[0059] The preparation methods of the prepreg and the copper-clad laminate are the same as in the first embodiment.

[0060] The properties of the obtained copper-clad laminates are shown in Table 1.

Embodiment 3

[0062] According to the method in the synthesis example, react at 130°C for 55min to prepare 4,4'-diphenylmethane bismaleimide resin: 30g of prepolymer of diallyl bisphenol A=100:75, add appropriate amount of acetone dissolve. After the modified bismaleimide resin is completely dissolved, add 30g of dicyclopentadiene-type epoxy resin (XD-1000, Nippon Kayaku), 25g of phosphorous cyanate resin (structure such as structural formula 2, R1=B1 , R2=B5, R3=B8), 15g bisphenol A cyanate resin (CY-10, Wuqiao Chemical), 0.05g cobalt acetylacetonate, 50g spherical silica, 50g boehmite and an appropriate amount of butanone solvent , Stir and mix evenly to obtain a glue solution with a solid content of 60%.

[0063] The preparation methods of the prepreg and the copper-clad laminate are the same as in the first embodiment.

[0064] The properties of the obtained copper-clad laminates are shown in Table 1.

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Abstract

The invention discloses a thermosetting resin composition which is characterized by comprising the following components in parts by weight: 10-65 parts of alkyl modified bismaleimide resin prepolymer, 5-60 parts of composite cyanate resin and 5-65 parts of halogen-free epoxy resin, wherein the total weight of the resins is 100 parts; the alkyl modified bismaleimide resin prepolymer is obtained byreacting a bismaleimide resin with a diallyl compound for 20-120 minutes at the temperature of 110-160 DEG C and then cooling; and the weight ratio of bismaleimide resin to diallyl compound is 100: (15-120). A prepreg and a laminated board can be prepared by using the composition. The composition, the prepreg and the laminated board have the characteristics of good manufacturability, halogen-free inflaming retardance, excellent humidity resistance and heat resistance, low thermal expansion coefficient and low dielectric constant and dielectric loss, and are suitable for the fields of integrated circuit package, high-frequency, high-speed and high-density interconnection and the like.

Description

technical field [0001] The invention relates to a thermosetting resin composition, a prepreg made therefrom and a laminated board for printed circuits, belonging to the technical field of electronic materials, and can be applied to integrated circuit packaging, high-frequency, high-speed and high-density interconnection. Background technique [0002] Traditional printed circuit laminates mainly use bromine-containing flame retardants such as brominated epoxy resin, tetrabromobisphenol A, etc. to achieve the flame-retardant function of the board. However, bromine-containing flame retardants will produce corrosive gas hydrogen bromide when burned, and may also produce carcinogens such as dioxin and dibenzofuran, polluting the environment and endangering health. Therefore, the development of halogen-free printed circuit board substrates has become a hot spot in the industry. [0003] The method to realize the halogen-free flame retardancy of laminates for printed circuits is g...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08L63/00C08L79/04C08K13/04C08K7/14B32B15/08B32B27/04B32B27/20B32B17/04B32B37/06B32B37/10H05K1/03
Inventor 黄荣辉谌香秀马建肖升高崔春梅梁国正顾嫒娟
Owner SHENGYI TECH SUZHOU
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