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Preparation of polyimide thermosetting resin and application thereof in two-layer method flexibility coat copper plate

A technology of polyimide resin and maleimide, which is applied in coatings, circuit substrate materials, and devices for coating liquid on the surface, etc., which can solve the problem of limited application, poor impact resistance and stress crack resistance issues such as reduced equipment and environmental conditions, low production costs, and good solubility

Active Publication Date: 2008-03-26
华烁电子材料(武汉)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This new type of polymer material made from modifying maleimides (PEI) was developed by researchers working on improving its properties over existing materials like PEIs due to their ability to form strong bonds between different chemical groups during crosslinkage reactions without losing any part or leaving behind unwanted residue. These modifications improve both mechanical strength and thermal conductivity while reducing costs compared to traditional methods.

Problems solved by technology

This patented technical problem addressed in this patents relates to improving the quality and efficiency of producing an adherendable dual-ply flexibility copper plated laminator without requiring expensive specialized facilities like vacuum sintering processes due to their slow reaction time required during drying. Current solutions involve modifying existing bifunctional maleimides based on specific chemistry called diazotodiimide modifiers, while others focus more towards improved strengths compared to current options.

Method used

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  • Preparation of polyimide thermosetting resin and application thereof in two-layer method flexibility coat copper plate
  • Preparation of polyimide thermosetting resin and application thereof in two-layer method flexibility coat copper plate
  • Preparation of polyimide thermosetting resin and application thereof in two-layer method flexibility coat copper plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] 24.03 grams (0.12 moles) of 3,4'-diaminodiphenyl ether, 3.92 grams (0.04 moles) of maleic anhydride and 29.42 grams (0.10 mol) was successively added to NMP (229 milliliters), under nitrogen protection, after stirring at room temperature for 10 hours, 0.24 moles of dehydrating agent acetic anhydride (22.65 milliliters), 0.24 moles of dehydration catalyst triethylamine (33.47 milliliters) and NMP 153 milliliters, reacted at 50°C for 7 hours, and poured it into a large amount of absolute ethanol stirred at high speed to obtain a precipitate. The obtained precipitate was thoroughly washed successively with absolute ethanol and absolute ether, and vacuum-dried to obtain 47.16 g of maleimide-terminated polyimide resin.

[0034] Weigh 30 grams of the above-mentioned maleimide-terminated polyimide resin and 3 grams of diallyl bisphenol A, mix them, dissolve them in NMP (158 ml), and fully stir to form a homogeneous solution. Coat this solution on a copper foil with a thicknes...

Embodiment 2

[0036] With 4,4'-diaminodiphenyl ether 50.06 grams (0.25 mole), maleic anhydride 9.81 grams (0.10 mole) and 3,3',4,4'-diphenyl ether tetraacid dianhydride 62.13 grams ( 0.20 mole) was successively added in DMAc (488 milliliters), under the protection of nitrogen, after stirring at room temperature for 12 hours, add 0.75 moles (70.77 milliliters) of dehydrating agent acetic anhydride, 0.50 moles (69.73 milliliters) of dehydration catalyst triethylamine and DMAc 325 milliliters were reacted at 70° C. for 4 hours, and poured into a large amount of high-speed stirring absolute ethanol to obtain a precipitate. The obtained precipitate was washed thoroughly with anhydrous ethanol and anhydrous ether successively, and vacuum-dried to obtain 99.26 g of maleimide-terminated polyimide resin.

[0037] Weigh 80 grams of the above-mentioned maleimide-terminated polyimide resin and 13 grams of diallyl bisphenol A, mix them, dissolve them in DMAc (425 milliliters), and fully stir to form a h...

Embodiment 3

[0039] 4,4'-diaminodiphenylsulfone (4,4'-DDS) 86.90 grams (0.35 moles), maleic anhydride 9.81 grams (0.10 moles) and 2,2'-bis(3,4-di Carboxyphenyl) 133.27 grams (0.30 moles) of hexafluoropropane tetra-acid dianhydride were successively added to DMF (920 milliliters), under nitrogen protection, after stirring at room temperature for 16 hours, 1.40 moles (132.10 milliliters) of dehydrating agent acetic anhydride were added , 0.14 mol (19.52 milliliters) of dehydration catalyst triethylamine and 613 milliliters of DMF were reacted at 60° C. for 6 hours, and poured into a large amount of dehydrated ethanol stirred at high speed to obtain a precipitate. The obtained precipitate was thoroughly washed successively with absolute ethanol and absolute ether, and then vacuum-dried to obtain 200.00 g of maleimide-terminated polyimide resin.

[0040] Weigh 100 grams of the above-mentioned maleimide-terminated polyimide resin and 6 grams of diallyl bisphenol A, mix them, dissolve them in DM...

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Abstract

The present invention proposes one kind of modified end capped polyamide resin and its preparation process and application in flexible no-glue two-layer copper clad plate, and belongs to the field of flexible printed circuit board material technology. The modified maleimide end capped polyamide resin consists of maleimide end capped polyamide resin and allyl compound. The flexible no-glue two-layer copper clad plate of the modified maleimide end capped polyamide resin has no surface pore, and possesses excellent heat resisting performance, adaptability for no-lead soldering, low crimpability, high size stability, high mechanical strength, high stripping strength, high bending strength, low thermal expansion coefficient, low dielectric constant and low water absorption rate.

Description

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Claims

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Application Information

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Owner 华烁电子材料(武汉)有限公司
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