Bismaleamic acid, bismaleimide and cured product thereof

A technology of bismaleimide and bismaleamic acid, which is applied in the field of bismaleamic acid, bismaleimide and their cured products, can solve the problems of difficult high performance requirements and the like, and achieves the Less variation in dielectric properties, low water absorption, and effects of low dielectric properties

Inactive Publication Date: 2009-12-16
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to cope with these problems, various bismaleimides and bismaleamic acid as raw materials have been proposed (for example, refer to JP-A-4-261411 and JP-A-7-215933), but it is difficult to say It must be able to meet various high-performance requirements in the field of electronic materials in recent years

Method used

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  • Bismaleamic acid, bismaleimide and cured product thereof
  • Bismaleamic acid, bismaleimide and cured product thereof
  • Bismaleamic acid, bismaleimide and cured product thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0091] The present invention will be described more specifically by way of examples below, but the present invention is not particularly limited to the following examples. In addition, the number average molecular weight and weight average molecular weight were calculated|required by the gel permeation chromatography (GPC) method (polystyrene conversion). As a developing solvent for GPC, THF (tetrahydrofuran) was used. The hydroxyl equivalent and amino equivalent were obtained by quantifying the terminal functional groups by titration. The dielectric constant was measured at 10 GHz by the cavity perturbation method. In the examples of the present invention, drying refers to a state in which calcium chloride is placed in a desiccator (humidity 21%) at a temperature of 20°C for 12 hours, and moisture absorption refers to immersion in water at a temperature of 25°C for 24 hours. hour status. The glass transition temperature is obtained by the DMA method for the cured product, ...

Synthetic example 1

[0093] Synthesis of 2-functional phenylene ether oligomers

[0094] In a 12L vertical elongated reactor with a stirring device, a thermometer, an air inlet pipe, and a baffle, drop 3.88g (17.4mmol) of CuBr 2 , 0.75g (4.4mmol) N, N'-di-tert-butylethylenediamine, 28.04g (277.6mmol) n-butyldimethylamine, 2600g toluene, stirring at a reaction temperature of 40°C, will be mixed by nitrogen and air Mix and adjust the mixed gas with an oxygen concentration of 8% to bubble at a flow rate of 5.2 L / min, and add dropwise 129.32 g (0.48 mol) of 2,2', 3,3 previously dissolved in 2300 g of methanol for 230 minutes. ', 5,5'-hexamethyl-(1,1'-biphenyl)-4,4'-diol, 292.19g (2.40mol) 2,6-dimethylphenol, 0.51g (2.9mmol ) N, N'-di-tert-butylethylenediamine, 10.90g (108.0mmol) mixed solution of n-butyldimethylamine, and stirred. After completion of the dropwise addition, 1500 g of water in which 19.89 g (52.3 mmol) of tetrasodium ethylenediaminetetraacetate was dissolved was added to terminate t...

Synthetic example 2

[0100] Synthesis of 2-functional phenylene ether oligomers

[0101] In a 12L vertical elongated reactor with a stirring device, a thermometer, an air inlet pipe, and a baffle, drop 9.36g (42.1mmol) of CuBr 2, 1.81g (10.5mmol) N, N'-di-tert-butylethylenediamine, 67.77g (671.0mmol) n-butyldimethylamine, 2600g toluene, stirring at a reaction temperature of 40°C, will be mixed by nitrogen and air Mix and adjust the mixed gas with an oxygen concentration of 8% to bubble at a flow rate of 5.2 L / min, and add dropwise 129.32 g (0.48 mol) of 2,2', 3,3 previously dissolved in 2300 g of methanol for 230 minutes. ', 5,5'-hexamethyl-(1,1'-biphenyl)-4,4'diol, 878.4g (7.2mol) 2,6-dimethylphenol, 1.22g (7.2mmol) A mixed solution of N,N'-di-tert-butylethylenediamine and 26.35 g (260.9 mmol) of n-butyldimethylamine was stirred. After completion of the dropwise addition, 1500 g of water in which 48.06 g (126.4 mmol) of tetrasodium ethylenediaminetetraacetate was dissolved was added to termin...

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Abstract

The invention provides bismaleamic acid, bismaleimide and cured product thereof. Particularly, the invention provides a bismaleimide having high heat resistance, a low dielectric constant, a low water absorption coefficient and excellent solvent solubility, a bismaleamic acid capable of generating the above bismaleimide, a cured resin composition containing the above bismaleimide and a cured product obtained by curing the above resin composition. Bismaleamic acid, bismaleimide, the cured resin composition containing the bismaleimide and the cured product obtained by curing the resin composition are obtained by reaction between diamine of bifunctional phenylene ether oligomer and maleic anhydride, wherein the diamine of bifunctional phenylene ether oligomer is obtained by introducing aromatic amino into two terminals of the bifunctional phenylene ether oligomer.

Description

technical field [0001] The present invention relates to bismaleamic acid, bismaleimide and their preparation method obtained by the reaction of aromatic diamine and maleic anhydride with bifunctional phenylene ether oligomers with specific structure as raw materials, and further the present invention It is related with curable resin composition containing this bismaleimide, and these cured products. Background technique [0002] Bismaleimide resins are generally known as high heat-resistant thermosetting resins, and are widely used in the fields of molding materials, composite materials, electric and electronic parts, and the like. In the field of electrical and electronic components in recent years, microelectronics has been rapidly developed. Especially in large-scale computers, high-speed signal transmission is indispensable due to the use of multi-layer circuit boards, etc., but when the dielectric constant of the substrate material is large, signal transmission delays ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07D207/452C07C233/27C07C231/02C08L101/00
CPCC08G65/485C07D207/408C08G65/44C07D207/444C07D207/452C07D403/10
Inventor 上等和良大野大典石井贤治
Owner MITSUBISHI GAS CHEM CO INC
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