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High-frequency resin composition as well as semi-cured sheet and laminated board manufactured by high-frequency resin composition

A resin composition and prepreg technology, used in integrated circuit packaging, high-frequency, high-speed and high-density interconnection, and electronic materials fields, can solve the problems of insufficient curing, falling off downstream lines, and poor hole wall quality, and achieve excellent copper Effects of foil peel strength and heat resistance, increased concentration, and increased benzene ring content

Active Publication Date: 2013-08-07
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above solutions all have the following problems: (1) Due to the structural characteristics of styrene maleic anhydride, its polar groups are few, which will lead to poor cohesiveness and poor processability; and poor cohesiveness will easily cause downstream lines to fall off and drill holes. (2) The acid anhydride in the resin composition is easy to react with water to form free acid, and the acid anhydride containing free acid will hinder the reaction with the epoxy group, so that it cannot be fully cured , although the method of adding benzoxazine can reduce the hygroscopicity, it cannot avoid the generation of free acid, which affects the stability of the product's moisture resistance

Method used

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  • High-frequency resin composition as well as semi-cured sheet and laminated board manufactured by high-frequency resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036]According to the method in the synthesis example, 60g of prepolymer of diaminodiphenylmethane-type benzoxazine: styrene maleic anhydride = 100:36 was obtained by reacting at 140°C for 60 minutes, and the gelation time was controlled at 210°C. After 500~550 seconds, add an appropriate amount of methyl ethyl ketone to dissolve; after the anhydride-modified benzoxazine prepolymer is completely dissolved, add 23g of phosphorus-containing epoxy resin (XZ92530, Dow Chemical), 17g of phosphorus-containing flame retardant (XZ92741, Dow Chemical), 0.01g 2-ethyl-4 methylimidazole, 40g spherical silica, appropriate amount of butanone solvent, stir and mix evenly to obtain a glue with a solid content of 60%.

[0037] The glue is dipped and coated on E glass fiber cloth (2116, the unit weight is 104g / m 2 ) and baked in an oven at 135°C for 5 minutes to obtain a prepreg with a resin content of 50%.

[0038] The prepared prepreg with a resin content of 50% was placed with a metal copp...

Embodiment 2

[0041] According to the method in the synthesis example, react at 130°C for 40 minutes to prepare 60 g of prepolymer of bisphenol F type benzoxazine: 3,3',4,4'-biphenyltetracarboxylic dianhydride=100:100, condensate The gelation time is controlled at 700-750 seconds at a temperature of 210°C, and an appropriate amount of methyl ethyl ketone is added to dissolve; after the anhydride-modified benzoxazine prepolymer is completely dissolved, 25g of phosphorus-containing epoxy resin (XZ92530, Dow Chemical), 15g of phosphorus-containing flame retardant (XZ92741, Dow Chemical), 0.05g of stannous octoate, 40g of spherical silica, and an appropriate amount of butanone solvent were stirred and mixed evenly to obtain a glue with a solid content of 60%.

[0042] The preparation methods of the prepreg and the copper-clad laminate are the same as in the first embodiment.

[0043] The properties of the obtained copper-clad laminates are shown in Table 1.

Embodiment 3

[0045] According to the method in the synthesis example, react at 150°C for 50 minutes to prepare 55g of prepolymer of bisphenol A benzoxazine: 3,3',4,4'-diphenyl ether tetra-acid dianhydride=100:70, The gelation time is controlled at 1000-1100 seconds at a temperature of 210°C, and an appropriate amount of methyl ethyl ketone is added to dissolve; after the anhydride-modified benzoxazine prepolymer is completely dissolved, 25g of naphthalene ring epoxy resin (NC-7300, Japan Chemicals), 20g phosphorus-containing flame retardant (XZ92741, Dow Chemical), 0.05g 2-ethyl-4 methylimidazole, 40g spherical silica, appropriate amount of butanone solvent, stir and mix evenly to obtain 60% solid content glue.

[0046] The preparation methods of the prepreg and the copper-clad laminate are the same as in the first embodiment.

[0047] The properties of the obtained copper-clad laminates are shown in Table 1.

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Abstract

The invention discloses a high-frequency resin composition. The high-frequency resin composition comprises the following components in parts by weight: (a), 15-80 parts of anhydride-modified benzoxazine resin prepolymer, (b),10-60 parts of halogen-free epoxy resins, (c), 5-40 parts of fire retardant, (d), 0.001-2 parts of accelerant and (e), 0-70 parts of inorganic fillers, wherein the number-average molecular weight of the anhydride-modified benzoxazine resin prepolymer is 400-20000. The preparation method of the anhydride-modified benzoxazine resin prepolymer comprises the following steps of: getting and placing benzoxazine and anhydride compounds in a reaction bottle, heating up to 60 DEG C to 200 DEG C, adding a catalyst which is 0%-2% of the total weight of the reactants, and reacting for 10minutes-150minutes to obtain uniform and transparent anhydride-modified benzoxazine resin prepolymer. According to the high-frequency resin composition as well as a semi-cured sheet and a laminated board manufactured by the high-frequency resin composition, the anhydride-modified benzoxazine resin prepolymer is used for lowering concentration of hydroxyl groups generated by the epoxy resin curing process by the anhydride, so that the content of benzene ring is relatively improved, and the dielectric constant and the dielectric loss of the product are greatly lowered.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a high-frequency resin composition, a prepreg and a laminate made by using the composition, which can be applied to the fields of integrated circuit packaging, high-frequency high-speed and high-density interconnection, and the like. Background technique [0002] For a long time, epoxy resin has been widely used in FR-4 laminates due to its comprehensive advantages such as wide source of raw materials, good processability, and low cost. However, with the high-speed and high-frequency increase in information processing and information transmission in recent years, higher requirements have been placed on the dielectric properties of laminates for printed circuits. To put it simply, the laminate material needs to have low dielectric constant and dielectric loss to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between sign...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/04C08L63/00C08L63/02C08K5/3445C08K5/098C08K5/07C08K5/57C08K3/36B32B15/092B32B27/04
Inventor 杨宋肖升高崔春梅李兴敏
Owner SHENGYI TECH SUZHOU
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