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Low dielectric resin composite and copper foil base plate applying composite as well as printed circuit board

A resin composition, resin technology, applied in the direction of printed circuit, printed circuit, printed circuit parts, etc., can solve environmental pollution and other problems, achieve low dielectric properties, increase cross-linking, low dielectric constant and dielectric The effect of loss

Active Publication Date: 2014-01-15
ELITE ELECTRONICS MATERIAL ZHONGSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this manufacturing method must use flame retardants containing halogens (such as bromine), such as tetrabromocyclohexane, hexabromocyclodecane, and 2,4,6-tris(tribromophenoxy)-1 ,3,5-Triazabenzene, and these bromine-containing flame retardants are easy to cause pollution to the environment when the product is manufactured, used, or even recycled or discarded

Method used

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  • Low dielectric resin composite and copper foil base plate applying composite as well as printed circuit board
  • Low dielectric resin composite and copper foil base plate applying composite as well as printed circuit board
  • Low dielectric resin composite and copper foil base plate applying composite as well as printed circuit board

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Embodiment Construction

[0059] For fully understanding purpose, feature and effect of the present invention, now by following specific embodiment, the present invention is described in detail, and explanation is as follows:

[0060] The compositions of the resin compositions of Examples 1-5 (E1-E5) and Comparative Examples 1-2 (C1-C2) are listed in Table 1, respectively. Mix the resin compositions of Examples 1 to 5 and Comparative Examples 1 to 2 in batches in a stirring tank and put them into the impregnation tank, then pass the glass fiber cloth through the above impregnation tank to make the resin composition adhere to the glass Fiber cloth, then heated and baked into a semi-cured state to obtain a semi-cured film.

[0061] For the above-mentioned prepregs prepared in batches, take four prepregs and two 18μm copper foils from the same batch, and laminate them in the order of copper foil, four prepregs, and copper foils, and then place them under vacuum conditions. The copper foil substrate is fo...

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Abstract

The invention provides a resin composite which comprises the following components in parts by weight: (A) 100 parts of terminal styryl polyphenylene oxide resin, (B) 5-75 parts of olefin copolymers and (C) 1-150 parts of polyphenyl ether functional group containing cyanate ester resin. The resin composite provided by the invention can achieve the characteristics of low dielectric constant, low dielectric loss and high heat resistance by containing specific components and proportions; the resin composite provided by the invention can be prepared into a semi-solidified colloidal film or a resin film, thereby achieving the purpose of being applied to a copper foil base plate and a printed circuit board.

Description

technical field [0001] The invention relates to a resin composition, especially a low-dielectric resin composition applied to copper foil substrates and printed circuit boards. Background technique [0002] In order to comply with the world's environmental protection trends and green regulations, Halogen-free is the current environmental protection trend of the global electronics industry. Countries around the world and related electronics manufacturers have successively formulated mass production schedules for halogen-free electronic products. After the implementation of the European Union's Restriction of Hazardous Substances (RoHS), substances including lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers are no longer allowed to be used in the manufacture of electronic products or its components. Printed Circuit Board (PCB) is the basis of electronic and electrical products. Halogen-free PCBs are the first priority to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L71/12C08L25/16C08L45/00C08L79/04B32B15/08B32B27/04H05K1/03
CPCB82Y30/00H05K2201/012B32B15/08C08L79/04C08L25/08C08L79/02C08L79/00H05K1/0353H05K1/024C08L71/123H05K2201/0209H05K1/0346C08L71/126H05K1/0373H05K2201/0158C08L57/00B32B3/10Y10T428/24917Y10T428/31692C08L23/00
Inventor 谢镇宇李长元
Owner ELITE ELECTRONICS MATERIAL ZHONGSHAN
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