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Halogen-free resin composition and copper clad laminate and printed circuit board applying the same

A halogen resin and composition technology, applied in printed circuit parts, circuit substrate materials, etc., can solve problems such as environmental pollution

Active Publication Date: 2013-06-05
ELITE MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this manufacturing method must use flame retardants containing halogen (such as bromine), such as tetrabromocyclohexane, hexabromocyclodecane, and 2,4,6-tris(tribromophenoxy)-1 , 3,5-Triazabenzene, and these bromine-containing flame retardants are easy to cause pollution to the environment when the product is manufactured, used, or even recycled or discarded

Method used

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  • Halogen-free resin composition and copper clad laminate and printed circuit board applying the same
  • Halogen-free resin composition and copper clad laminate and printed circuit board applying the same
  • Halogen-free resin composition and copper clad laminate and printed circuit board applying the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Example 1 (E1)

[0043] A resin composition comprising the following components:

[0044] (A) the dicyclopentadiene epoxy resin (HP-7200) of 40 weight parts;

[0045] (B) the biphenyl epoxy resin (NC-3000) of 60 weight parts;

[0046] (C) 1.5 parts by weight of dicyandiamide (DICY);

[0047] (D) benzoxazine resin (LZ 8280) of 50 parts by weight;

[0048] (E) 10 parts by weight of styrene maleic anhydride (EF-60);

[0049] (F) 35 parts by weight of the phosphazene compound (SPB-100);

[0050] (G) fused silica of 35 parts by weight;

[0051] (H) 0.3 parts by weight of catalyst (2E4MI);

[0052] (1) the methyl ethyl ketone solvent (MEK) of 45 weight parts;

[0053] (J) 20 parts by weight of dimethylformamide (DMAC).

Embodiment 2

[0054] Example 2 (E2)

[0055] A resin composition comprising the following components:

[0056] (A) the dicyclopentadiene epoxy resin (HP-7200) of 40 weight parts;

[0057] (B) the biphenyl epoxy resin (NC-3000) of 60 weight parts;

[0058] (C) the diaminodiphenyl sulfone (DDS) of 8 weight parts;

[0059] (D) benzoxazine resin (LZ 8280) of 15 parts by weight;

[0060] (E) 30 parts by weight of styrene maleic anhydride (EF-30);

[0061] (F) the flame retardant (Dow XZ92741) of 55 parts by weight;

[0062] (G) fused silica of 42 parts by weight;

[0063] (H) 0.3 parts by weight of catalyst (2E4MI);

[0064] (1) 35 parts by weight of methyl ethyl ketone solvent (MEK).

Embodiment 3

[0065] Example 3 (E3)

[0066] A resin composition comprising the following components:

[0067] (A) the dicyclopentadiene epoxy resin (HP-7200) of 40 weight parts;

[0068] (B) the biphenyl epoxy resin (NC-3000) of 60 weight parts;

[0069] (C) the diaminodiphenyl ether (ODA) of 7 weight parts;

[0070] (D) benzoxazine resin (LZ 8280) of 27 parts by weight;

[0071] (E) styrene maleic anhydride (EF-60) of 8 weight parts;

[0072] (F) the flame retardant (PX-200) of 49 weight parts;

[0073] (G) 38 parts by weight of fused silica;

[0074] (H) 0.3 parts by weight of catalyst (2E4MI);

[0075] (1) 77 parts by weight of methyl ethyl ketone solvent (MEK).

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Abstract

The invention provides halogen-free resin composition, and a copper clad laminate and a printed circuit board applying the halogen-free resin composition. The halogen-free resin composition comprises, by weight, (A) 100 parts of epoxy resin, (B) 1 part -100 parts of benzoxazine resin, (C) 1part -100 parts of styrene maleic anhydride, (D) 0.5 part -30 parts of amine curing agents, and (E) 5-150 parts of halogen-free flame retardants. By means of the specified constituents and ration, the halogen-free resin composition achieves the purposes of low dielectric constant, low dielectric loss, high heat resistance, and high flame resistance, can be manufactured into semi-solidified rubber pieces or resin films, and then achieves the purposes of being applied to the copper clad laminate and the printed circuit board.

Description

technical field [0001] The invention relates to a halogen-free resin composition, in particular to a halogen-free resin composition applied to copper foil substrates and printed circuit boards. Background technique [0002] In response to the world's environmental protection trends and green regulations, Halogen-free is the current environmental protection trend of the global electronics industry. Countries around the world and related electronics manufacturers have successively established mass production schedules for halogen-free electronic products. After the implementation of the European Union's Restriction of Hazardous Substances (RoHS), substances including lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers are no longer used in the manufacture of electronic products or its components. Printed Circuit Board (PCB) is the basis of electronic and electrical products. Halogen-free PCBs are the first priority to be re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L79/04C08L35/06C08K13/02C08K3/36C08K5/5399C08K5/315C08K5/41C08K5/07H05K1/03
Inventor 林育德
Owner ELITE MATERIAL
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