Epoxy resin composition and low dielectric constant insulating material employing same

A technology of epoxy resin and composition, applied in the direction of circuit substrate materials, synthetic resin layered products, printed circuit components, etc., can solve problems such as applications that cannot meet advanced requirements

Active Publication Date: 2013-06-05
ELITE MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] With the rapid development of communication and broadband application technology, as well as the popularization of cloud computing and the expansion of high-speed transmission applica

Method used

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  • Epoxy resin composition and low dielectric constant insulating material employing same
  • Epoxy resin composition and low dielectric constant insulating material employing same
  • Epoxy resin composition and low dielectric constant insulating material employing same

Examples

Experimental program
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Effect test

Embodiment 1

[0039] 40g of cyanate ester resin (BTP-6020S) containing polyphenylene ether structure was dissolved in 160g of toluene to prepare a 20% toluene solution. Add 100g isocyanate-modified epoxy resin (Dow 97103), 20g styrene-maleic anhydride copolymer (EF-80), 15g bismaleimide resin (BMI-5100), 90g hollow Silica (B-6C), 10g fused silica (SC-2050MB), 0.02g zinc caprylate, 8g phenolic resin (HE-601C), 40g phosphorus-containing flame retardant (OP-935), 1g rubber modification Reactive polyamide resin (rubber modified reactive polyamide resin, BPAM) and 0.2g catalyst 2-ethyl-4-methylimidazole (2E4MI). Then, 200 g of toluene solution containing BTP-6020S was added into the aforementioned reaction flask to prepare a dispersed epoxy resin composition.

Embodiment 2

[0041] 40 g of cyanate ester resin (BTP-6020S) containing polyphenylene ether structure was dissolved in 160 g of dimethylacetamide (DMAC) to prepare a 20% DMAC solution. Add 50g of biphenyl type epoxy resin (NC-3000H), 50g of isocyanate modified epoxy resin (Dow 97103), 26g of styrene-maleic anhydride copolymer (EF-60), 30g of double horse Laimide resin (BMI-2300), 90g hollow silica (B-6C), 10g fused silica (SC-2050MB), 0.02g zinc caprylate, 8g phenolic resin (HE-200C), 45g containing phosphorus Flame retardant (SPB-100), 1.5g rubber-modified reactive polyamide resin (BPAM), 0.2g catalyst 2-ethyl-4-methylimidazole (2E4MI). Then add 200 g of the BTP-6020-containing SDMAC solution into the aforementioned reaction flask to prepare a dispersed epoxy resin composition.

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Abstract

The invention provides an epoxy resin composition, comprising (A) 100 parts by weight of the epoxy resin; (B) 20-100 parts by weight of a cyanate ester resin containing a polyphenylene oxide structure; (C) 10-50 parts by weight of a styrene-maleic anhydride (SMA) copolymer; (D) 5-50 parts by weight of a maleimide resins, and optionally at least one of the following components of (E) an inorganic filler, (F) a catalyst, (G) a phenolic resin, (H) a flame retardant and (I) an adhesion agent. The epoxy resin composition contains specific components and proportions to achieve low dielectric constant, low-dielectric loss, high glass-transition temperature and no halogen; the printed circuit board can be made into a half-cured film or a resin film, and further the object of applying the epoxy resin composition to copper foil substrates and printed circuit boards can be reached.

Description

technical field [0001] The invention relates to an epoxy resin composition, especially an epoxy resin composition applied to copper foil substrates and printed circuit boards. Background technique [0002] In order to adapt to the world's environmental protection trends and green regulations, Halogen-free is the current environmental protection trend of the global electronics industry. Countries around the world and related electronics manufacturers have successively formulated mass production schedules for halogen-free electronic products. After the implementation of the European Union's Restriction of Hazardous Substances (RoHS), substances including lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers are no longer used in the manufacture of electronic products or its components. Printed circuit boards (Primed Circuit Board, PCB) are the basis of electronic and electrical products. Halogen-free PCBs are the first priori...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08G59/62C08G59/40C08G59/42B32B15/092B32B27/04H05K1/03
Inventor 谢镇宇
Owner ELITE MATERIAL
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