Sensor module

a sensor module and sensor technology, applied in the field of sensors, can solve the problems of insufficient room to add a second sensing technology within a common housing, electromagnetic interference (emi) requirements of an alumina-based sensor are generally difficult to meet, and achieve the effect of compact and cost-effective sensor modules

Active Publication Date: 2008-02-19
DELPHI TECH IP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007]In accordance with the teachings of the present invention, a compact and cost affordable sensor module is provided. The sensor module includes a housing and a low temperature co-fired ceramic substrate located on the housing. A sensor is located on the low temperature co-fired ceramic substrate. Additionally, signal processing circuitry is located on the low temperature co-fired ceramic substrate. The sensor module further includes a metal shield substantially encapsulating the sensor.

Problems solved by technology

The placement of the sensor on an alumina-based substrate allows for a cost affordable sensor module, however, a number of drawbacks exist.
Additionally, there is generally little flexibility and insufficient room to add a second sensing technology within a common housing.
Also, the electromagnetic interference (EMI) requirements of an alumina-based sensor are generally difficult to meet due to the large area and lack of adequate shielding.

Method used

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Examples

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Embodiment Construction

[0020]Referring now to FIGS. 1-5, a satellite crash sensor module 10 is generally illustrated according to one embodiment of the present invention. In the first embodiment shown, the sensor module 10 contains two sensors in a packaged module capable of sensing pressure and acceleration. However, it should be appreciated that the sensing module 10 may contain other sensing devices. For example, the sensor module 10 may contain one or more sensors for sensing pressure, acceleration, velocity and other conditions alone or in combination, according to other embodiments. While the sensor module 10 is described herein as a satellite crash sensor module, it should be appreciated that the sensor module 10 may be employed in various applications on and off a vehicle.

[0021]The sensor module 10 includes a housing 12 generally having a recessed cavity 14 for receiving the sensors and related circuitry. The housing 12 may be made of plastic or metal. A metal grommet is formed extending through h...

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Abstract

A sensor module is provided having a compact housing containing a sensor. A low temperature co-fired ceramic substrate is located on the housing. The sensor and signal processing circuitry are located on the low temperature co-fired ceramic substrate. The sensor module further includes a metal shield substantially encapsulating the sensor.

Description

TECHNICAL FIELD[0001]The present invention generally relates to sensors and, more particularly, relates to packaged sensor modules, such as crash sensor modules for use on vehicles.BACKGROUND OF THE INVENTION[0002]Electronic crash sensors are commonly employed on vehicles to sense vehicle dynamics. In particular, satellite crash sensors are used for vehicle crash detection systems to sense frontal and side impact during a vehicle crash (collision). To effectively detect vehicle crashes, many vehicle crash detection systems require satellite crash sensors mounted in crush zones of the vehicle. The signal outputs of satellite crash sensors located in select crash zones typically offer optimal signal-to-noise ratio.[0003]Many vehicle crash detection systems require several satellite crash sensors at selected locations to ensure accurate detection of a vehicle crash. For example, air bag deployment systems typically employ a multitude of sensors for sensing longitudinal and / or lateral a...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): G01N3/30
CPCG01D11/245G01P1/023
Inventor MANLOVE, GREGORY J.LONG, STEPHEN P.BORZABADI, HAMID R.VAS, TIMOTHY A.HAWES, KEVIN J.
Owner DELPHI TECH IP LTD
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