A new hermetically-sealed contact feedthrough for cardiac pacemakers and defibrillators for the connection between internal device electronics and external components, a flat ceramic disk (1) being used as an insulating main carrier, in which openings (3) are situated, into which various electrode embodiments (4, 5, 6, 7) may be inserted as through contacts. Using a metal flange or metal-plated vapor deposition zone (2), the ceramic disk may be soldered directly onto the implant housing (11). In addition, active and passive auxiliary components (8) may be applied directly to the ceramic. The main carrier may be implemented as a multilayer ceramic (9), so that rewiring levels and shielding components (10) may be integrated in the feedthrough. The feedthrough according to the present invention allows novel construction variants, above all things having orientation to multipolar systems, through use of standardized ceramic semifinished products.