A new hermetically-sealed contact
feedthrough for cardiac pacemakers and defibrillators for the connection between internal device
electronics and external components, a flat
ceramic disk (1) being used as an insulating main carrier, in which openings (3) are situated, into which various
electrode embodiments (4, 5, 6, 7) may be inserted as through contacts. Using a
metal flange or
metal-plated vapor deposition zone (2), the
ceramic disk may be soldered directly onto the
implant housing (11). In addition, active and passive auxiliary components (8) may be applied directly to the
ceramic. The main carrier may be implemented as a multilayer ceramic (9), so that rewiring levels and shielding components (10) may be integrated in the
feedthrough. The
feedthrough according to the present invention allows novel construction variants, above all things having orientation to multipolar systems, through use of standardized ceramic semifinished products.