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706 results about "Single lead" patented technology

Light emitting diode (LED) display screen splicing control system and LED display screen

The invention is applied in the field of display screens, and provides a light emitting diode (LED) display screen splicing control system and an LED display screen. The LED display screen splicing control system comprises a video processing and transmission controller, a video receiving and splitting amplifier and an LED screen body controller array, wherein the video processing and transmission controller comprises an input output interface, a first audio and video processor and a signal conversion and optical transmitter which are sequentially connected; the video receiving and splitting amplifier comprises an optical receiving and signal converter, a second audio and video processor, a video output module and an audio output interface which are sequentially connected; the optical receiving and signal converter is connected with the signal conversion and optical transmitter; and the LED screen body controller array comprises more than one shunt-wound single LED screen body controller. The LED display screen splicing control system and the LED display screen provided by the embodiment of the invention can realize the high-resolution display of the LED display screen by the video processing and transmission controller, the video receiving and splitting amplifier and the LED screen body controller array, and have simple designs and low cost.
Owner:KONKA GROUP

Three-dimensionally wrapped packaged LED (Light Emitting Diode) chip

The invention discloses a three-dimensionally wrapped packaged LED (Light Emitting Diode) chip, which is characterized in that six planes of a vertically packaged or inversely packaged single LED chip or series-parallel connected LED chips are coated with fluorescent powder and are fixed by using transparent materials at the periphery, so as to carry out three-dimensional packaging; or a single LED chip or a plurality of series-parallel connected LED chips adopt a vertical or inverse structure and are put into a spherical or tubular shell made of transparent materials; the LED chips are wrapped three-dimensionally by coating a fluorescent powder layer on the inner wall of the shell or mixing the fluorescent powder into the transparent materials; or the LED chips are firstly wrapped by using transparent materials, and subsequently the fluorescent powder is coated on the transparent materials; or the three-dimensional wrapping is carried out by adding a layer of transparent shell material after the coating of the fluorescent powder so as to protect the fluorescent powder. The chip has the beneficial effects that a simplest fluorescent powder wrapping process is adopted so as the make the LED chip emit light in all directions; and in comparison with a traditional single side light emission mode, the loss on light emission of the LED chip is reduced.
Owner:SHANGHAI DANGOO ELECTRONICS TARDING

3D imaging method and system based on LED array common lens TOF depth measurement

InactiveCN101866056AImproved Gain Control AccuracyGet fastOptical elements3d imageEffect light
The invention discloses a 3D imaging method and system based on LED array common lens TOF depth measurement, which is characterized in that a 2D LED array is used as the lighting source, only one LED is in the lightened state every time, the modulated light emitted by the LED is projected onto the surface of the target by a projecting lens, a photoelectric receiver receives the scattered light on the surface of the target, measures the round-trip time of flight (TOF) from the light source to the target, acquires the LED depth pixel value in the lightened state according to the round-trip TOF and completes measurement of the single LED depth pixel value; time division scanning is carried out on the whole 2D LED array, the measurement process of the single LED depth pixel value is repeated and all the LED depth pixel values are acquired and are combined to generate the depth image of the target; a 2D image sensor acquires the 2D image of the target after the scattered light on the surface of the target passes through a 2D imaging lens; the projecting lens and the 2D imaging lens are the same; and the 2D image and the depth image are fused to generate the 3D image of the target. The depth image is fast in acquisition and the depth measurement resolution is high.
Owner:HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
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