3D imaging method and system based on LED array common lens TOF depth measurement

An LED array and depth measurement technology, applied in optical components, optics, instruments, etc., can solve the problems of slow acquisition of depth images, poor alignment accuracy of depth images and two-dimensional images, etc., and achieve strong resistance to ambient light interference, Get fast, high-resolution results

Inactive Publication Date: 2010-10-20
HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
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Problems solved by technology

[0005] The purpose of the present invention is to propose a three-dimensional imaging method based on LED array common lens TOF depth measurement for the shortcomings of the existing three-dimensional imaging method and system, such as slow depth image acquisition speed and poor alignment accuracy between the depth image and the two-dimensional image. and systems for fast and high-precision 3D imaging, meeting the urgent needs of high-performance 3D imaging in many existing fields

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  • 3D imaging method and system based on LED array common lens TOF depth measurement

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Embodiment Construction

[0027] In this embodiment, the three-dimensional imaging method based on LED array common lens TOF depth measurement is carried out as follows:

[0028] 1. A two-dimensional LED array modulated by optical power is used as the lighting source. Only one LED in the two-dimensional LED array is lit at a time, and the modulated light emitted by the LED is projected onto the surface of the target 1 through the projection lens. The receiver 6 receives the scattered light on the surface of the target 1, measures the round-trip time of flight TOF from the light source to the target 1, calculates the depth pixel value of the LED in the lit state according to the round-trip time of flight TOF, and completes the depth pixel value of a single LED. Measurement;

[0029] 2. Scan the entire two-dimensional LED array in time division, repeat the measurement process of the depth pixel value of a single LED, obtain all the depth pixel values ​​of the LED and combine them to generate the depth im...

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Abstract

The invention discloses a 3D imaging method and system based on LED array common lens TOF depth measurement, which is characterized in that a 2D LED array is used as the lighting source, only one LED is in the lightened state every time, the modulated light emitted by the LED is projected onto the surface of the target by a projecting lens, a photoelectric receiver receives the scattered light on the surface of the target, measures the round-trip time of flight (TOF) from the light source to the target, acquires the LED depth pixel value in the lightened state according to the round-trip TOF and completes measurement of the single LED depth pixel value; time division scanning is carried out on the whole 2D LED array, the measurement process of the single LED depth pixel value is repeated and all the LED depth pixel values are acquired and are combined to generate the depth image of the target; a 2D image sensor acquires the 2D image of the target after the scattered light on the surface of the target passes through a 2D imaging lens; the projecting lens and the 2D imaging lens are the same; and the 2D image and the depth image are fused to generate the 3D image of the target. The depth image is fast in acquisition and the depth measurement resolution is high.

Description

technical field [0001] The invention relates to the technical fields of ranging imaging and three-dimensional imaging, in particular to a three-dimensional imaging method and system based on LED array common-lens TOF depth measurement. Background technique [0002] The existing two-dimensional 2D imaging technology based on CCD / CMOS photography and digital image processing has made great progress and has been widely used. However, for the 3D real world, the 2D image obtained by traditional 2D imaging technology is not enough to fully express all the information, thus limiting its application in many fields. In order to solve the above problems, a three-dimensional imaging (3D Imaging) technology emerges as the times require. Three-dimensional imaging refers to recording the three-dimensional image of the objective world through a special method, and then reproducing the objective real image in the human brain through processes such as processing, compression, transmission, ...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B27/22
Inventor 王焕钦徐军何德勇赵天鹏明海
Owner HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
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