197 results about "Integrated electronics" patented technology

Advanced Smart Cards and similar form factors (e.g. documents, tags) having high quality external surfaces of Polyvinylchloride (PVC), Polycarbonate (PC), synthetic paper or other suitable material can be made with highly sophisticated electronic components (e.g. Integrated Circuit chips, batteries, microprocessors, Light Emitting Diodes, Liquid Crystal Displays, polymer dome switches, and antennae), integrated in the bottom layer of the card structure, through use of injection molded thermosetting or thermoplastic material that becomes the core layer of said Advanced Smart Cards. A lamination finishing process can provide a high quality lower surface, and the encapsulation of the electronic components in the thermosetting or thermoplastic material provides protection from the lamination heat and pressure.

An omnidirectional sensor array system, for example a panoptic camera, comprising a plurality of sensors arranged on a support of predetermined shape to acquire data, wherein said sensors are directional and wherein each sensor is attached to a processing node which comprises integrated electronics that carries out at least a portion of the signal processing algorithms locally in order to reduce the computational load of a central hardware unit.

A compact, agile polarization diversity, multiple frequency band antenna with integrated electronics for terrestrial terminal use in satellite communications systems is disclosed. The antenna includes an antenna feed having highly integrated microwave electronics that are mechanically and electromagnetically coupled thereto in a distributed arrangement so that diverse polarization senses having a low axial ratio and electronic switching control of the polarization senses is provided. The arrangement of the integrated distributed transceiver configuration enables the mechanical rotation of the orientation of a first transceiver for skew alignment while a second transceiver remains stationary relative to the antenna feed assembly. The first transceiver can be a high-band transmitter and receiver pair that supports linear polarization senses and the second transceiver can be a low-band transmitter and receiver pair that supports circular polarization senses. The antenna system presented is highly compact and offers improved polarization performance previously achievable by only larger devices.

A method for the fabrication complex-transition metal oxide (CTMO)/semiconductor or dielectric substrate integrated devices includes the separation of the CTMO film growth process from the CTMO-film/semiconductor or dielectric substrate integration process. The CTMO-film is transferred from the native substrate to the final substrate for fabrication into devices. The CTMO-film is grown onto a native substrate under growth conditions chosen to provide a CTMO-film having desirable properties and thickness. No restrictions are placed upon the native substrate used, the growth method used, or on the growth conditions required. The CTMO-film is then joined to the semiconductor or dielectric substrate and the native substrate is removed, providing the basis for an integrated electronics, photonics, or MEMS device. Techniques fully compatible with semiconductor processing can be used to fabricate monolithically integrated CTMO/semiconductor devices in a first embodiment.

A CMUT on CMOS imaging chip is disclosed. The imaging chip can use direct connection, CMOS architecture to minimize both internal and external connection complexity. Intelligent power management can enable the chip to be used for various imaging applications with strict power constraints, including forward-looking intra-vascular ultrasound imaging. The chip can use digital logic to control transmit and receive events to minimize power consumption and maximize image resolution. The chip can be integrated into a probe, or catheter, and requires minimal external connections. The chip can comprise integrated temperature control to prevent overheating.

A hand-held ultrasound system includes integrated electronics within an ergonomic housing. The electronics includes control circuitry, beamforming and circuitry transducer drive circuitry. The electronics communicate with a host computer using an industry standard high speed serial bus. The ultrasonic imaging system is operable on a standard, commercially available, user computing device without specific hardware modifications, and is adapted to interface with an external application without modification to the ultrasonic imaging system to allow a user to gather ultrasonic data on a standard user computing device such as a PC, and employ the data so gathered via an independent external application without requiring a custom system, expensive hardware modifications, or system rebuilds. An integrated interface program allows such ultrasonic data to be invoked by a variety of such external applications having access to the integrated interface program via a standard, predetermined platform such as visual basic or c++.

An implantable biocompatible component (10) integrating an active element of the type of a sensor for the measurement of a physiologic parameter, a micro-electromechanical system and an integrated electronic circuit. This component (10) has a substrate (12) and a lid (22) in silicon or quartz. The substrate (12) integrates the active element (14) and biocompatible metallic pads (16), electrically connected to the active element. The lid (22) encompasses and peripherally closes the substrate in a hermetic manner, level with the face integrating the active element. This component is void of metallic case for insulation between the active element and outside environment, and of insulative feedthrough for electrical connection to the active element. The substrate and lid can be directly welded to each other through their faces in vis-à-vis, or by interpositioning a sealing ring made of a biocompatible material.

An optical coupler has a waveguide coupled to a grating of multiple scattering units, each scattering unit having a first scattering element formed of a shape in a polysilicon gate layer and a second scattering element formed of a shape in a body silicon layer of a metal-oxide-semiconductor (MOS) integrated circuit (IC). The couplers may be used in a system having a coupler on each of a first and second IC, infrared light being formed into a beam passing between the couplers. Vias may be interposed in third ICs between the first and second ICs. The couplers may be configured with nonuniform width of scattering elements to produce Gaussian or focused beams.

A process for assembling two parts of an integrated electronic circuit has two successive steps. During a first step, the two circuit parts are made into a single unit by molecular bonding, realized on respective application surfaces of the two parts. During a second step, electrical connections are formed from connection portions already present in the application surfaces of the two circuit parts. The connections formed extend across the bonding interface, and are compatible with a high reliability and a high level of integration of the circuit.

A germanium on silicon waveguide photodetector disposed on a silicon on insulator (SOI) substrate. The photodetector is incorporated into a section of a planar silicon waveguide on the substrate. The photodetector generates an electric current as an infrared optical signal travels through the photodetector.

An integrated golf club and analysis system that measures and analyze the performance characteristics of both: 1) a free golf swing without impact with a golf ball and 2) a golf swing with ball impact analysis. Free swing analysis provides critical information needed to analyze swing style so that dynamics swing characteristics optimization can be evaluated throughout the entire swing without ball impact, while impact analysis provides critical information on ball impact location on the club face, however, they cannot be measured simultaneously since ball impact eliminates the ability to identify the swing metric peaks such as velocity if it were to occur after ball impact. To achieve both, an integrated electronics golf club head comprises multiple types of sensors for measuring club head motion, impact and spatial location information with a weight and balance of a regulation golf club head.

A carrying case having an integrated electronic system is disclosed. In one embodiment, the carrying case resembles a conventional wheeled suitcase such as is commonly used by airline travelers. One or more load/force sensors are disposed on or near a bottom surface of the suitcase enclosure. Some means of force transfer is provided for ensuring that when the suitcase is resting on a substantially flat surface, the force from the weight of the suitcase itself and all of its contents are exerted on the sensor(s). An electronic system is disposed within the enclosure and is in electrical communication with the sensor(s). A user actuable input such as a pushbutton is mounted on the exterior of the enclosure. The electronic system is responsive to actuation of the input to perform a weighing operation whereby the output(s) from the sensor(s) are interpreted and supplied to an indicator for providing an indication of the weight of the carrying case and its contents. The indicator may be a visual indicator such as a digital display, and/or an audible indicator, such as a voice synthesizer circuit for reading an audible indication of the weight.

An angular velocity sensor has two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly of wafers provides a hermetic barrier between the masses and an ambient environment.

The invention disclosed herein provides biosensors and methods which increase the sensitivity of assays of optically labelled molecules fluorescently tagged polypeptides and polynucleotides while decreasing the sample volume required for detection. By integrating reflective sidewalls into the receptacles used in such assays, the signal-to-noise ratio of the optical signal is increased significantly. Typically the receptacles are microchannels. In addition, the geometry of the receptacles can be controlled C to further optimize the signal-to-noise ratio of the optical signal. The invention disclosed herein further provides methods and devices involving integrated electronics, wherein an element such as a diode, a transistor, an integrated circuit etc., is integrated with a bioreactor/channel in order to facilitate the detection or fabrication of bio-materials.

Acoustic transducers configured with integrated electronics technology are adapted to digitize signal data close to the transducer. The transducers are packaged with a reduced number of elements and sealed for exposure to harsh environments, without oil compensation. A transducer assembly includes a frame, an acoustic transducer element disposed on the frame, and an electronics module disposed on the frame and linked to the acoustic transducer element. The pressure and temperature tolerant electronics module is adapted to process a signal associated with the transducer element.

A handheld barcode/RFID reader includes a printed circuit board having a first side and a second side opposite the first side. The first side includes at least a portion of barcode/RFID electronic circuitry affixed thereto. The second side contains a ground plane for the electronic circuitry. The handheld barcode/RFID reader further includes a patch antenna, electrically coupled to the circuitry, and mounted on the second side of the printed circuit board such that the ground plane of the printed circuit board also provides a ground for the patch antenna.

The invention relates to a tool magazine and automatic tool changer comprehensive performance detecting system, which adopts a three-shaft acceleration sensor, a wireless vibration sensor, an industrial camera, a PSD (position sensory device) camera and a sound pressure sensor as detecting elements for detecting the comprehensive performance of a large-sized tool magazine and an automatic tool changer thereof. An IEPE (integrated electronics piezo electric) analog quantity collection card, a wireless gateway, an image collection card and an analog voltage collection card are adopted as a data collection or a signal transmission device to detect performances of the large-sized tool magazine and the automatic tool changer on the five aspects such as vibration of the tool magazine, vibration of a mechanical arm, positioning error of the tool magazine, the tool changing movement precision of a mechanical hand and the working noise of the entire machine and to transmit collected signals to an industrial personal computer. LabVIEW is adopted as a tool to design processing software special for analyzing and calculating data and for analyzing, operating and storing the acquired experimental data. The tool magazine and automatic tool changer comprehensive performance detecting system has the advantages of strong portability, wide measurement range, high measurement precision, low requirement on the professional technical level of an operator and the like and has strong practical application value.

Methods for realizing integrated lasers and photonic integrated circuits on complimentary metal-oxide semiconductor (CMOS)-compatible silicon (Si) photonic chips, potentially containing integrated electronics, are disclosed. The integration techniques rely on light coupling with integrated light coupling elements such as turning mirrors, lenses, and surface grating couplers. Light is coupled from between two or more substrates using the light coupling elements. The technique can realize integrated lasers on Si where a gain flip chip (the second substrate) is bonded to a Si chip (the first substrate) and light is coupled between a waveguide in the gain flip chip to a Si waveguide by way of a turning mirror or grating coupler in the flip chip and a grating coupler in the Si chip. Integrated lenses and other elements such as spot-size converters can also be incorporated to alter the mode from the gain flip chip to enhance the coupling efficiency to the Si chip. The light coupling integration technique also allows for the integration of other components such as modulators, amplifiers, and photodetectors. These components can be waveguide-based or non-waveguide based, that is to say, surface emitting or illuminating.

The present invention includes compositions and methods of creating electrical isolation and ground plane structures, around electronic devices (inductors, antenna, resistors, capacitors, transmission lines and transformers) in photo definable glass ceramic substrates in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

A watchband with integrated electronics designed to be attachable to any standard mechanical or digital timepiece. The watchband has a flexible circuit board sandwiched between layers of watchband material, allowing for the flexibility of a normal watchband with the electronics capability of a mobile computer and fitness tracker. The watchband has an embedded heart rate sensor, body temperature sensor, ambient temperature sensor, vibration generator, inertial sensors, and wireless communication device. The watchband is powered by a rechargeable battery, which is recharged using a charging port that can be connected to a battery charger.